| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/15/2009 | DE102008031096A1 Befestigungselement für ein Halbleiter-Sensorbauelement Fastening element for a semiconductor sensor device |
| 01/15/2009 | DE102008025173A1 Modul einer lichtemittierenden Diode für eine Instrumententafel A light emitting diode module for an instrument panel |
| 01/15/2009 | DE102007051798B3 Micro-channel heat sink for cooling semiconductor laser component, has electrically isolating inorganic protective layer or closing protective layer formed from metal and applied on sealing surfaces and inner surfaces of inlet and outlet |
| 01/15/2009 | DE102007031958A1 Kontakt-Struktur für ein Halbleiter-Bauelement sowie Verfahren zur Herstellung desselben Contact structure for a semiconductor device and method of manufacturing the same |
| 01/15/2009 | DE102007023057B3 Coolant e.g. cooling air, volume flow regulating device, has minimal value switch, and delimiter connected with regulators of regulator circuit that includes reference value input connected with setpoint device |
| 01/15/2009 | DE102007007356B4 Hochfrequenzschaltung, Standardzelle, Entwurfsystem und Testverfahren High-frequency circuit, standard cell design system and test method |
| 01/15/2009 | DE10147376B4 Elektronisches Bauteil und Systemträger sowie Verfahren zur Herstellung derselben Electronic component and system carrier, as well as methods for making same |
| 01/15/2009 | DE10108557B4 Halbleiterlaser-Kühlvorrichtung A semiconductor laser cooling device |
| 01/15/2009 | CA2692870A1 Enabling holographic media backwards compatibility with dual-use media card connector |
| 01/14/2009 | EP2015392A1 High-frequency semiconductor device |
| 01/14/2009 | EP2015361A2 Semi conductor device |
| 01/14/2009 | EP2015360A2 Electronic component with side contacts |
| 01/14/2009 | EP2015359A2 Process for manufacturing a semiconductor package and circuit board aggregation |
| 01/14/2009 | EP2015355A2 Methods of manufacturing semiconductor structures with air dielectric |
| 01/14/2009 | EP2014787A1 Cu-Mn ALLOY SPUTTERING TARGET AND SEMICONDUCTOR WIRING |
| 01/14/2009 | EP2014735A2 Polymer anisotropic electroconductive gluing material and a gluing method |
| 01/14/2009 | EP2014702A1 Resin for optical semiconductor element encapsulation containing polyborosiloxane |
| 01/14/2009 | EP2014144A1 Regulator with a cooling body for an electric machine |
| 01/14/2009 | EP2013906A1 A microwave chip supporting structure |
| 01/14/2009 | EP2013905A1 A microwave chip supporting structure |
| 01/14/2009 | EP2013675A2 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect |
| 01/14/2009 | EP1610132B1 Fabricating interconnects using sacrificial substrates |
| 01/14/2009 | EP1556894A4 Thermal enhanced package for block mold assembly |
| 01/14/2009 | EP1327226B1 Module having a lead frame equipped with components on both sides |
| 01/14/2009 | EP1260551B1 Flame-retardant epoxy resin composition and laminate made with the same |
| 01/14/2009 | EP0923128B1 Method of manufacturing a semiconductor package |
| 01/14/2009 | CN201182049Y Single plate and electronic equipment with the same |
| 01/14/2009 | CN201182048Y Intermediate water diversion type porous cooling radiator |
| 01/14/2009 | CN201181705Y Multi-chip packaging structure |
| 01/14/2009 | CN201181704Y LED packaging structure and distant range irradiation structure including the same |
| 01/14/2009 | CN201181703Y Led发光面板 Led light-emitting panel |
| 01/14/2009 | CN201181702Y Thin soldering type commutation bridge stack |
| 01/14/2009 | CN201181701Y Axial multi-grain flexible-welded transient voltage eliminator |
| 01/14/2009 | CN201181700Y Wire frame and electric connecting structure |
| 01/14/2009 | CN201181699Y Kinking stitch and kinking stitch seat |
| 01/14/2009 | CN201181698Y Explosion-proof water-cooling apparatus of electric power electronic power element |
| 01/14/2009 | CN201181697Y Fixer structure for heat radiator |
| 01/14/2009 | CN201181696Y Heat radiating device of chip module |
| 01/14/2009 | CN201180976Y Heat conduction and radiation structure of luminous diode lamp |
| 01/14/2009 | CN201180975Y LED lamp radiator and high power LED lighting device |
| 01/14/2009 | CN201180974Y High power LED lighting device |
| 01/14/2009 | CN201180973Y High power LED lighting device |
| 01/14/2009 | CN201180972Y High power LED lighting lamp radiator |
| 01/14/2009 | CN201180971Y LED bulb |
| 01/14/2009 | CN201180970Y High-power forced-cooling type heat pipe LED illumination device |
| 01/14/2009 | CN201180969Y LED lamp |
| 01/14/2009 | CN201180968Y LED Lamp |
| 01/14/2009 | CN201180967Y Heat radiating device for LED |
| 01/14/2009 | CN201180966Y High power LED lamp refrigerating device |
| 01/14/2009 | CN201180950Y Light source module of LED |
| 01/14/2009 | CN201180947Y LED combination structure |
| 01/14/2009 | CN101346817A Solid state imaging element module fabrication method |
| 01/14/2009 | CN101346816A Universal pad arrangement for surface mounted semiconductor devices |
| 01/14/2009 | CN101346815A Microelectronic machine and method for manufacturing same |
| 01/14/2009 | CN101346751A Active matrix substrate, display device, television receiver, and method for repairing defects of active matrix substrate |
| 01/14/2009 | CN101346735A RFID label film embossing manufacturing techniques |
| 01/14/2009 | CN101346056A Method and system for cooling heat-generating devices |
| 01/14/2009 | CN101346055A Structure improvement of radiator support |
| 01/14/2009 | CN101346054A Thermal interface material, its preparation method and packaging body with the same |
| 01/14/2009 | CN101346051A Fastener and heat radiating device with the same |
| 01/14/2009 | CN101346039A Novel via structure for improving signal integrity |
| 01/14/2009 | CN101346033A Semiconductor packaging structure and method for discharging electronic component on substrate |
| 01/14/2009 | CN101345469A Liquid cooling energy converting equipment |
| 01/14/2009 | CN101345405A Protection circuit of power switch device |
| 01/14/2009 | CN101345268A Semiconductor photovoltaic element with joining structure |
| 01/14/2009 | CN101345257A Asymmetric metal-oxide-semiconductor transistor and production method and element using the same |
| 01/14/2009 | CN101345250A Integrated circuit device and memory array |
| 01/14/2009 | CN101345247A Photovoltaic apparatus and method of manufacturing the same |
| 01/14/2009 | CN101345245A Panel and electronic device with electrostatic discharge protection effect |
| 01/14/2009 | CN101345243A Semiconductor device |
| 01/14/2009 | CN101345242A A spiral inductor formed in a semiconductor substrate and a method for forming the inductor |
| 01/14/2009 | CN101345241A Semiconductor device |
| 01/14/2009 | CN101345240A Contact structure of MOS transistor, adjacent contact structure and semiconductor SRAM unit |
| 01/14/2009 | CN101345239A Electronic device |
| 01/14/2009 | CN101345238A Packaging of semiconductor devices for increased reliability |
| 01/14/2009 | CN101345237A Embedded tenon type packaging structure and manufacturing method thereof |
| 01/14/2009 | CN101345235A LED chip with electrostatic protection function and production method thereof |
| 01/14/2009 | CN101345234A Electronic module and fabrication method thereof |
| 01/14/2009 | CN101345233A Test structure and monitoring method for CUI effect of shallow plough groove isolation technology |
| 01/14/2009 | CN101345232A Power supply supplying linking line of integrated circuit and preparation method thereof |
| 01/14/2009 | CN101345231A Semiconductor chip, method of fabricating the same and stack package having the same |
| 01/14/2009 | CN101345230A Integrated circuit structure and its forming method |
| 01/14/2009 | CN101345229A LCD drive integrated circuit chip and package |
| 01/14/2009 | CN101345228A Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment |
| 01/14/2009 | CN101345227A Lead frame, semiconductor package including the lead frame and method of forming the lead frame |
| 01/14/2009 | CN101345226A IC device and method of manufacturing the same |
| 01/14/2009 | CN101345225A Electronic component and method of forming the same |
| 01/14/2009 | CN101345224A Rewinding type semiconductor packaging construction and substrate thereof |
| 01/14/2009 | CN101345223A Semiconductor devices, semiconductor modules and methods for cooling semiconductor devices |
| 01/14/2009 | CN101345222A Rewinding type semiconductor packaging construction for improving cooling effect |
| 01/14/2009 | CN101345221A Gan substrate, substrate with an epitaxial layer, semiconductor device, and gan substrate manufacturing method |
| 01/14/2009 | CN101345220A Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
| 01/14/2009 | CN101345207A Non-volatile memory, source/drain line plug and manufacturing method thereof |
| 01/14/2009 | CN101345199A Packaging structure and its forming method |
| 01/14/2009 | CN101345198A Semiconductor device and its manufacturing method |
| 01/14/2009 | CN101344897A Clock supply circuit and method of designing the same |
| 01/14/2009 | CN101344236A Short-pitch thin LED lead frame |
| 01/14/2009 | CN101344232A Surface type LED lamp |
| 01/14/2009 | CN101343760A Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology |
| 01/14/2009 | CN101343367A Resin for optical semiconductor element encapsulation containing polyborosiloxane |