| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/15/2009 | WO2009008526A1 Process for producing electronic component, and electronic component produced by the process |
| 01/15/2009 | WO2009008509A1 Epoxy resin-forming liquid preparation containing inorganic particle |
| 01/15/2009 | WO2009008457A1 Heat radiating component for electronic component, case for electronic component, carrier for electronic component, and package for electronic component |
| 01/15/2009 | WO2009008376A1 Process for producing semiconductor device, semiconductor device, semiconductor production apparatus, and storage medium |
| 01/15/2009 | WO2009008283A1 Optical semiconductor-sealing composition |
| 01/15/2009 | WO2009008243A1 High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same |
| 01/15/2009 | WO2009008212A1 Insulating film material, multilayer wiring board and process for producing the multilayer wiring board, and semiconductor apparatus and process for producing the semiconductor device |
| 01/15/2009 | WO2009008106A1 Light receiving device and method of manufacturing light receiving device |
| 01/15/2009 | WO2009008029A1 Circuit substrate |
| 01/15/2009 | WO2009007932A2 Integrated circuits on a wafer and method of producing integrated circuits |
| 01/15/2009 | WO2009007931A1 Wafer, reticle and method for manufacturing integrated circuits on a wafer |
| 01/15/2009 | WO2009007930A2 Integrated circuits on a wafer and method for separating integrated circuits on a wafer |
| 01/15/2009 | WO2009007928A2 Methods for manufacturing integrated circuits |
| 01/15/2009 | WO2009007252A2 Control apparatus |
| 01/15/2009 | WO2009006761A1 Multi-layer baseboard and manufacturing method thereof |
| 01/15/2009 | US20090019414 High tolerance tcr balanced high current resistor for rf cmos and rf sige bicmos applications and cadenced based hierarchical parameterized cell design kit with tunable tcr and esd resistor ballasting feature |
| 01/15/2009 | US20090017611 Semiconductor device and method for fabricating the same |
| 01/15/2009 | US20090017609 Rectangular contact used as a low voltage fuse element |
| 01/15/2009 | US20090017580 Systems and methods for vertically integrating semiconductor devices |
| 01/15/2009 | US20090017574 Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus |
| 01/15/2009 | US20090017333 Method of forming group-iii nitride crystal, layered structure and epitaxial substrate |
| 01/15/2009 | US20090017327 Fretting and whisker resistant coating system and method |
| 01/15/2009 | US20090016088 Semiconductor assembly |
| 01/15/2009 | US20090016025 combining electromagnetic interference (EMI) absorbing materials with thermoconductive materials to improve EMI shielding effectiveness in an economical manner; electronics; e.g. includes carbonyl iron; ferrite particles combined with ceramics suspended within an elastomeric matrix |
| 01/15/2009 | US20090015903 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices |
| 01/15/2009 | US20090015363 Integrated transformer |
| 01/15/2009 | US20090015285 Test structures for electrically detecting back end of the line failures and methods of making and using the same |
| 01/15/2009 | US20090014909 Printing device, production unit, and production method of electronic parts |
| 01/15/2009 | US20090014899 Integrated circuit package system including stacked die |
| 01/15/2009 | US20090014898 Solder cap application process on copper bump using solder powder film |
| 01/15/2009 | US20090014897 Semiconductor chip package and method of manufacturing the same |
| 01/15/2009 | US20090014896 Flip-chip package structure, and the substrate and the chip thereof |
| 01/15/2009 | US20090014895 Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip |
| 01/15/2009 | US20090014894 Stacked semiconductor device and semiconductor memory device |
| 01/15/2009 | US20090014893 Integrated circuit package system with wire-in-film isolation barrier |
| 01/15/2009 | US20090014892 Integrated circuit device |
| 01/15/2009 | US20090014891 Three-dimensional die-stacking package structure and method for manufacturing the same |
| 01/15/2009 | US20090014890 Multi-chip semiconductor device |
| 01/15/2009 | US20090014889 Method for producing chip stacks, and associated chip stacks |
| 01/15/2009 | US20090014888 Semiconductor chip, method of fabricating the same and stack package having the same |
| 01/15/2009 | US20090014887 Method of producing multilayer interconnection and multilayer interconnection structure |
| 01/15/2009 | US20090014886 Dynamic random access memory with an electrostatic discharge structure and method for manufacturing the same |
| 01/15/2009 | US20090014885 Four-Terminal Reconfigurable Devices |
| 01/15/2009 | US20090014884 Slots to reduce electromigration failure in back end of line structure |
| 01/15/2009 | US20090014883 Integrated circuit system with dummy region |
| 01/15/2009 | US20090014882 Semiconductor device |
| 01/15/2009 | US20090014881 Semiconductor device, and method and apparatus for manufacturing same |
| 01/15/2009 | US20090014880 Dual damascene process flow enabling minimal ulk film modification and enhanced stack integrity |
| 01/15/2009 | US20090014879 Semiconductor device and method of manufacturing the same |
| 01/15/2009 | US20090014878 Structure and method of forming electrodeposited contacts |
| 01/15/2009 | US20090014877 Selective Formation of Boron-Containing Metal Cap Pre-layer |
| 01/15/2009 | US20090014876 Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof |
| 01/15/2009 | US20090014875 Bonding pad for preventing pad peeling and method for fabricating the same |
| 01/15/2009 | US20090014874 Semiconductor apparatus and manufacturing method of semiconductor apparatus |
| 01/15/2009 | US20090014873 Electronic device and manufacturing method |
| 01/15/2009 | US20090014872 Method for manufacturing a circuit board structure, and a circuit board structure |
| 01/15/2009 | US20090014871 Semiconductor device |
| 01/15/2009 | US20090014870 Semiconductor chip and package process for the same |
| 01/15/2009 | US20090014869 Semiconductor device package with bump overlying a polymer layer |
| 01/15/2009 | US20090014868 Manufacturing ic chip in portions for later combining, and related structure |
| 01/15/2009 | US20090014867 Seal ring for glass wall microelectronics package |
| 01/15/2009 | US20090014866 Multichip module package and fabrication method |
| 01/15/2009 | US20090014865 Heat-conductive package structure |
| 01/15/2009 | US20090014864 Thermal interface material having carbon nanotubes, component package having the same and method for making the component package |
| 01/15/2009 | US20090014863 Subassembly that includes a power semiconductor die and a heat sink and method of forming same |
| 01/15/2009 | US20090014862 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof |
| 01/15/2009 | US20090014861 Microelectronic package element and method of fabricating thereof |
| 01/15/2009 | US20090014860 Multi-chip stack structure and fabricating method thereof |
| 01/15/2009 | US20090014859 Interconnects for packaged semiconductor devices and methods for manufacturing such devices |
| 01/15/2009 | US20090014858 Packaged semiconductor assemblies and methods for manufacturing such assemblies |
| 01/15/2009 | US20090014857 Semiconductor wafer structure |
| 01/15/2009 | US20090014856 Microbump seal |
| 01/15/2009 | US20090014855 Semiconductor integrated circuit device and method of manufacturing the same |
| 01/15/2009 | US20090014854 Lead frame, semiconductor package including the lead frame and method of forming the lead frame |
| 01/15/2009 | US20090014853 Integrated circuit package for semiconductior devices with improved electric resistance and inductance |
| 01/15/2009 | US20090014852 Flip-Chip Packaging with Stud Bumps |
| 01/15/2009 | US20090014851 Fusion quad flat semiconductor package |
| 01/15/2009 | US20090014850 Electrically Connecting Substrate With Electrical Device |
| 01/15/2009 | US20090014849 Integrated circuit package system with multiple molding |
| 01/15/2009 | US20090014848 Mixed Wire Semiconductor Lead Frame Package |
| 01/15/2009 | US20090014847 Integrated circuit package structure with electromagnetic interference shielding structure |
| 01/15/2009 | US20090014845 Film-forming composition |
| 01/15/2009 | US20090014843 Manufacturing process and structure of through silicon via |
| 01/15/2009 | US20090014831 Electronic device comprising an integrated circuit and a capacitance element |
| 01/15/2009 | US20090014829 Semiconductor fuse box and method for fabricating the same |
| 01/15/2009 | US20090014801 Decoupling capacitor circuit and layout for leakage current reduction and esd protection improvement |
| 01/15/2009 | US20090014800 Silicon controlled rectifier device for electrostatic discharge protection |
| 01/15/2009 | US20090014797 Semiconductor device and method of manufacturing the same |
| 01/15/2009 | US20090014759 Solid state imaging apparatus and method for fabricating the same |
| 01/15/2009 | US20090014739 light-emitting diode package structure |
| 01/15/2009 | US20090014718 Test element group for monitoring leakage current in semiconductor device and method of manufacturing the same |
| 01/15/2009 | US20090014717 Test ic structure |
| 01/15/2009 | US20090014562 Spray Nozzle Apparatus and Method of Use |
| 01/15/2009 | US20090014162 Counter-stream-mode oscillating-flow heat transport apparatus |
| 01/15/2009 | US20090014160 Heat dissipation module |
| 01/15/2009 | DE112007000478T5 Schaltung mit einem Thermoelement Circuit with a thermocouple |
| 01/15/2009 | DE10205502B4 Halbleiterbauelement mit integriertem Temperatursensor A semiconductor device with integrated temperature sensor |
| 01/15/2009 | DE102008032711A1 Halbleitervorrichtung Semiconductor device |
| 01/15/2009 | DE102008032059A1 Packungen, Biochip-Kits und Packungsverfahren Packs, biochip kits and packaging method |
| 01/15/2009 | DE102008031309A1 Halbleiterbauteil und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |