| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/21/2009 | CN101350330A Thin-film transistor array substrate and manufacturing method thereof |
| 01/21/2009 | CN101350319A Process and system for manufacturing an encapsulated semiconductor device |
| 01/21/2009 | CN101350318A Electronic package an electronic device |
| 01/21/2009 | CN101350316A Circuit device manufacturing method |
| 01/21/2009 | CN101350314A Method of manufacturing pipe chip on film joint and structure thereof |
| 01/21/2009 | CN101349417A High heat conducting shimming material of LED light fitting heat radiation technique |
| 01/21/2009 | CN101349416A Radiating structure of LED |
| 01/21/2009 | CN101349415A Large power LED lamp convection heat radiating device |
| 01/21/2009 | CN101349414A LED lamp with heat radiation structure |
| 01/21/2009 | CN101349413A LED lamp |
| 01/21/2009 | CN101349412A LED lamp |
| 01/21/2009 | CN101349411A LED lamp |
| 01/21/2009 | CN100455178C Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them |
| 01/21/2009 | CN100455177C Radiating system for communication apparatus |
| 01/21/2009 | CN100455175C Loop-type radiating module group |
| 01/21/2009 | CN100455160C Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 01/21/2009 | CN100454694C Nitride semiconductor light-emitting device |
| 01/21/2009 | CN100454595C Light emitting-diode module group |
| 01/21/2009 | CN100454566C Image sensing-detecting chip and circuit board combination |
| 01/21/2009 | CN100454562C Thin-film transistor array substrates, manufacturing method and LCD device containing the same |
| 01/21/2009 | CN100454561C Film transistor array substrates and its producing method, repairing method |
| 01/21/2009 | CN100454557C TET LCD array substrate structure and its producing method |
| 01/21/2009 | CN100454556C Repairing structure and active component array substrate |
| 01/21/2009 | CN100454554C Electrostatic discharge protection structure and thin-film transistor substrate including same |
| 01/21/2009 | CN100454553C Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus |
| 01/21/2009 | CN100454544C Semiconductor device |
| 01/21/2009 | CN100454543C Semiconductor device |
| 01/21/2009 | CN100454539C Semiconductor integrated circuit device |
| 01/21/2009 | CN100454537C Electronic apparatus and method for manufacturing the same |
| 01/21/2009 | CN100454535C Method and system for hermetically sealing packages for optics |
| 01/21/2009 | CN100454534C Single-segment and multi-segment triggering type voltage-adjustable static-electricity discharging protection semiconductor structure |
| 01/21/2009 | CN100454533C EMI shielding for electronic component packaging |
| 01/21/2009 | CN100454532C Interposer, interposer assembly and device assembly therewith |
| 01/21/2009 | CN100454531C Semiconductor device and method of manufacturing the same |
| 01/21/2009 | CN100454530C Surface mounting electronic component and its manufacturing method |
| 01/21/2009 | CN100454529C Paste for forming an interconnect and interconnect formed from the paste |
| 01/21/2009 | CN100454528C Integrated liquid cooling heat radiator |
| 01/21/2009 | CN100454527C Radiator and its making method |
| 01/21/2009 | CN100454526C Thermo-interface material producing method |
| 01/21/2009 | CN100454525C Composite material, electrical circuit or electric module |
| 01/21/2009 | CN100454524C Radiating module |
| 01/21/2009 | CN100454523C Integrated circuit chip packaging and manufacturing method thereof |
| 01/21/2009 | CN100454522C 半导体器件 Semiconductor devices |
| 01/21/2009 | CN100454515C Method for forming aluminium lead wire |
| 01/21/2009 | CN100454509C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/21/2009 | CN100454508C Method for producing image-pickup assembly and camera module |
| 01/21/2009 | CN100454505C Semiconductor device and its making method |
| 01/21/2009 | CN100454502C Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 01/21/2009 | CN100454484C Circuitry component fabricating method |
| 01/21/2009 | CN100454444C Conductive paste composition, conductive paste and its preparation |
| 01/21/2009 | CN100454118C Tape circuit substrate with reduced size of base film |
| 01/21/2009 | CN100453896C LED fluorescent tube |
| 01/21/2009 | CN100453225C Heat radiator and its producing method |
| 01/20/2009 | USRE40623 Method and apparatus for identifying integrated circuits |
| 01/20/2009 | US7480404 Method and system for positioning articles with respect to a processing tool |
| 01/20/2009 | US7480146 Heat sink mounting systems and methods |
| 01/20/2009 | US7480144 Heat dissipation device |
| 01/20/2009 | US7480143 Variable-gap thermal-interface device |
| 01/20/2009 | US7479986 Imaging apparatus including a cooled imaging element which is shifted to perform high-definition imaging |
| 01/20/2009 | US7479706 Chip package structure |
| 01/20/2009 | US7479705 Semiconductor device |
| 01/20/2009 | US7479704 Substrate improving immobilization of ball pads for BGA packages |
| 01/20/2009 | US7479703 Integrated circuit package with sputtered heat sink for improved thermal performance |
| 01/20/2009 | US7479702 Composite conductive film and semiconductor package using such film |
| 01/20/2009 | US7479701 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics |
| 01/20/2009 | US7479700 Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same |
| 01/20/2009 | US7479699 Seal ring structures with unlanded via stacks |
| 01/20/2009 | US7479698 Bonding pad structure disposed in semiconductor device and related method |
| 01/20/2009 | US7479697 Resilient carrier assembly for an integrated circuit |
| 01/20/2009 | US7479696 Integrated BST microwave tunable devices fabricated on SOI substrate |
| 01/20/2009 | US7479695 Low thermal resistance assembly for flip chip applications |
| 01/20/2009 | US7479694 Membrane 3D IC fabrication |
| 01/20/2009 | US7479693 Arrangement of conductive connectors in a power semiconductor device |
| 01/20/2009 | US7479692 Integrated circuit package system with heat sink |
| 01/20/2009 | US7479691 Power semiconductor module having surface-mountable flat external contacts and method for producing the same |
| 01/20/2009 | US7479690 Semiconductor device |
| 01/20/2009 | US7479689 Electronically programmable fuse having anode and link surrounded by low dielectric constant material |
| 01/20/2009 | US7479681 Multilayered semiconductor structure containing a MISFET, a resistor, a capacitor, and an inductor |
| 01/20/2009 | US7479680 Method and apparatus that provides differential connections with improved ESD protection and routing |
| 01/20/2009 | US7479671 Thin film phase change memory cell formed on silicon-on-insulator substrate |
| 01/20/2009 | US7479670 Organic electronic component with high resolution structuring, and method of the production thereof |
| 01/20/2009 | US7479666 Driving circuit of a liquid crystal display panel |
| 01/20/2009 | US7479656 Compound semiconductor formed from a heated portion of a layered structure including rare earth transition metal |
| 01/20/2009 | US7479653 UV curable protective encapsulant |
| 01/20/2009 | US7479462 Thin films and methods for the preparation thereof |
| 01/20/2009 | US7479451 Display device manufacturing method preventing diffusion of an aluminum element into a polysilicon layer in a heating step |
| 01/20/2009 | US7479450 Post passivation interconnection schemes on top of the IC chips |
| 01/20/2009 | US7479449 Underfill and mold compounds including siloxane-based aromatic diamines |
| 01/20/2009 | US7479413 Method for fabricating semiconductor package with circuit side polymer layer |
| 01/20/2009 | US7479412 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
| 01/20/2009 | US7479411 Apparatus and method for forming solder seals for semiconductor flip chip packages |
| 01/20/2009 | US7479408 Stack package made of chip scale packages |
| 01/20/2009 | US7479407 Digital and RF system and method therefor |
| 01/20/2009 | US7479398 Methods and apparatus for packaging integrated circuit devices |
| 01/20/2009 | US7478472 Method of making circuitized substrate with signal wire shielding |
| 01/15/2009 | WO2009009584A1 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof |
| 01/15/2009 | WO2009009516A2 Nano shower for chip-scale cooling |
| 01/15/2009 | WO2009009182A1 Enabling holographic media backwards compatibility with dual-use media card connector |
| 01/15/2009 | WO2009008959A1 Non-inductive silicon transient voltage suppressor |
| 01/15/2009 | WO2009008836A1 A heat transfer device |