| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/22/2009 | US20090020847 Semiconductor device having trench isolation region and methods of fabricating the same |
| 01/22/2009 | US20090020845 Shallow trench isolation structures for semiconductor devices including doped oxide film liners and methods of manufacturing the same |
| 01/22/2009 | US20090020818 Semiconductor diode structures |
| 01/22/2009 | US20090020804 Semiconductor device and method for fabricating the same |
| 01/22/2009 | US20090020756 Test structures of a semiconductor device and methods of forming the same |
| 01/22/2009 | US20090020755 Test structure of a semiconductor device and semiconductor device |
| 01/22/2009 | US20090020754 Test structure for determining gate-to-body tunneling current in a floating body FET |
| 01/22/2009 | US20090020747 Method for realizing a hosting structure of nanometric elements |
| 01/22/2009 | US20090020744 Stacked multilayer structure and manufacturing method thereof |
| 01/22/2009 | US20090019693 Printed wiring board and method of manufacturing the same |
| 01/22/2009 | DE202008014845U1 Kühlmodul mit einem Wasserkühler Cooling module with a water cooler |
| 01/22/2009 | DE112007000267T5 Halbleiteranordnung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 01/22/2009 | DE10324751B4 Verfahren zur Herstellung einer Halbleiter-Struktur mit einem Halbleitersubstrat und mit diesem Verfahren hergestellte Halbleiter-Struktur A method of fabricating a semiconductor structure comprising a semiconductor substrate, and with this method produced semiconductor structure |
| 01/22/2009 | DE102008029644A1 Halbleiterbauelement Semiconductor device |
| 01/22/2009 | DE102008029193A1 Verfahren zur Ausbildung einer Justiermarke eines Halbleiterbauelements A method of forming an alignment mark of a semiconductor device |
| 01/22/2009 | DE102008028072A1 Halbleitergerät Semiconductor device |
| 01/22/2009 | DE102008025599A1 Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat Packaged active microstructures with direct contacting a substrate |
| 01/22/2009 | DE102007033517A1 Integrated circuit, particularly matrix of multiple integrated circuits, has terminal and another terminal for potential and third terminal for another potential and two four-layer arrangements have two conductivity types on common track |
| 01/22/2009 | DE102007033288A1 Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung An electronic component and device with a high insulation resistance as well as processes for their preparation |
| 01/22/2009 | DE102007033005A1 Modul und Verfahren zur Herstellung eines Moduls Module and method for manufacturing a module |
| 01/22/2009 | DE102007033003A1 Bauelement mit wenigstens einem Halbleitersubstrat mit einer integrierten elektrischen Schaltung Component with at least a semiconductor substrate with an integrated electrical circuit |
| 01/22/2009 | DE102007032058A1 Sensor, particularly absolute pressure sensor, has measuring point, which is covered by passivation unit, by which parameter in medium to be measured is detected by measuring point |
| 01/22/2009 | DE102005038409B4 Gehäuseteil für ein elektrisches Bauelement, Kondensator und Kondensatormodul Housing part for an electrical component, capacitor and capacitor module |
| 01/22/2009 | DE102004060854B4 Halbleitervorrichtungs-Simulationsverfahren und Halbleitervorrichtungs-Simulationsvorrichtung Semiconductor device simulation method and simulation apparatus semiconductor device |
| 01/22/2009 | DE10127010B4 Elektronisches Bauteil mit einem Halbleiterchip auf einem spannungsreduzierten Substrat Electronic component having a semiconductor chip on a substrate voltage reduced |
| 01/22/2009 | DE10113943B4 Diodenlaserbauelement Diode laser component |
| 01/22/2009 | DE10106836B4 Integrierte Schaltungsanordnung aus einem flächigen Substrat Integrated circuit arrangement of a planar substrate |
| 01/21/2009 | EP2017892A2 Light emitting device and method of manufacturing the same |
| 01/21/2009 | EP2017891A1 Semiconductor module |
| 01/21/2009 | EP2017889A2 Ultra-thick thick film on ceramic substrate |
| 01/21/2009 | EP2017888A2 Electronic component package and method of manufacturing the same, and electronic component device |
| 01/21/2009 | EP2017887A1 Package for electronic components and method for packaging semiconductor devices |
| 01/21/2009 | EP2017886A1 Aluminum-silicon carbide composite body and method for processing the same |
| 01/21/2009 | EP2017885A2 Method of producing an electric connection using nanotubes and having air gaps |
| 01/21/2009 | EP2017295A1 Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device |
| 01/21/2009 | EP2016813A2 Gimballed attachment for multiple heat exchangers |
| 01/21/2009 | EP2016628A2 Thermal isolation of electronic devices in submount used for leds lighting applications |
| 01/21/2009 | EP2016607A2 Semiconductor components and systems having encapsulated through wire interconnects (twi) and wafer level methods of fabrication |
| 01/21/2009 | EP1688025A4 Flat plate heat transfer device |
| 01/21/2009 | EP1654753A4 Semiconductor device package and method for manufacturing same |
| 01/21/2009 | EP1639644B1 Integrated circuit package having stacked integrated circuits and method therefor |
| 01/21/2009 | EP1540769B1 Dielectric interconnect frame incorporating emi shield and hydrogen absorber for tile t/r modules |
| 01/21/2009 | CN201185538Y Sandwich type radiating module |
| 01/21/2009 | CN201185537Y Tight junction structure for radiating device containing annular body |
| 01/21/2009 | CN201185536Y Sandwich type radiating module set |
| 01/21/2009 | CN201185511Y BGA encapsulation locating structure |
| 01/21/2009 | CN201185507Y 印制电路板 Printed circuit board |
| 01/21/2009 | CN201185193Y 发光体 Light |
| 01/21/2009 | CN201185190Y Node terminal protection structure capable of improving semiconductor power device electrostatic protective performance |
| 01/21/2009 | CN201185188Y LED chip packaging structure capable of generating crossrange light permeating a rugged surface |
| 01/21/2009 | CN201185187Y High-power small encapsulation triode |
| 01/21/2009 | CN201184576Y Heat radiation body with protection function and heat radiation fin thereof |
| 01/21/2009 | CN201184575Y LED lamp heat radiation seat |
| 01/21/2009 | CN201184574Y LED lamp heat radiation seat |
| 01/21/2009 | CN201184573Y LED light source lower heat radiation type integrated lamp cap |
| 01/21/2009 | CN201184519Y High power light-emitting diode barrel lamp |
| 01/21/2009 | CN101351886A ASIC design using clock and power grid standard cell |
| 01/21/2009 | CN101351885A Test pads on flash memory cards |
| 01/21/2009 | CN101351884A Compliant terminal mountings with vented spaces and methods |
| 01/21/2009 | CN101351883A Leadframe based flash memory cards |
| 01/21/2009 | CN101351882A Electronic module, and method for producing one |
| 01/21/2009 | CN101351881A Mounting assembly for optoelectronic devices |
| 01/21/2009 | CN101351880A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/21/2009 | CN101351876A Strip for integrated circuit packages having a maximized usable area |
| 01/21/2009 | CN101351875A Semiconductor device manufacturing method |
| 01/21/2009 | CN101351873A Integrated capacitors in package-level structures, processes of making same, and systems containing same |
| 01/21/2009 | CN101351815A Manufacturing method and device for making an in-mold circuit comprising a chip |
| 01/21/2009 | CN101351399A Electronic part sealing board, electronic part sealing board in multiple part form, electronic device using electronic part sealing board, and electronic device fabricating method |
| 01/21/2009 | CN101351109A Radiating device |
| 01/21/2009 | CN101351108A Combination of radiating device |
| 01/21/2009 | CN101351107A Back board combination for heat radiator |
| 01/21/2009 | CN101351106A Faster for radiating device |
| 01/21/2009 | CN101351104A Fastener for radiating fan |
| 01/21/2009 | CN101351103A External connection radiating device |
| 01/21/2009 | CN101351088A Inside imbedded type line structure and technique thereof |
| 01/21/2009 | CN101351087A Inside imbedded type line structure and technique thereof |
| 01/21/2009 | CN101350585A Modular stable starter |
| 01/21/2009 | CN101350390A LED encapsulation structure |
| 01/21/2009 | CN101350387A Encapsulation base unit for LED and manufacturing method thereof |
| 01/21/2009 | CN101350382A High power white light LED and chip thereof |
| 01/21/2009 | CN101350381A Salient point LED and manufacturing method thereof |
| 01/21/2009 | CN101350366A Antistatic TFT substrate and processing technique thereof |
| 01/21/2009 | CN101350362A Light emitting device and manufacturing method thereof |
| 01/21/2009 | CN101350356A Active element array substrate |
| 01/21/2009 | CN101350355A Capacitor and manufacturing method thereof |
| 01/21/2009 | CN101350349A Semiconductor device and method for fabricating the same |
| 01/21/2009 | CN101350346A Light emitting device and method of manufacturing the same |
| 01/21/2009 | CN101350345A 半导体器件 Semiconductor devices |
| 01/21/2009 | CN101350344A Semiconductor device package and fabricating method thereof |
| 01/21/2009 | CN101350342A Integrated circuit structure for test |
| 01/21/2009 | CN101350341A Monitoring structure for semiconductor metallic silicides |
| 01/21/2009 | CN101350340A Semiconductor device having oxidized metal film and manufacture method of the same |
| 01/21/2009 | CN101350339A Tape carrier substrate and semiconductor device |
| 01/21/2009 | CN101350338A Embedded type chip substrate structure |
| 01/21/2009 | CN101350337A IC having wafer paste sheet adhesive tape and encapsulation method tehreof |
| 01/21/2009 | CN101350336A Chip packaging structure |
| 01/21/2009 | CN101350335A Open window type ball grid array semiconductor packaging piece and web board structure used thereby |
| 01/21/2009 | CN101350334A Semiconductor assembly having a housing |
| 01/21/2009 | CN101350333A GaN substrate, substrate with epitaxial layer, semiconductor device, and method of manufacturing GaN substrate |
| 01/21/2009 | CN101350332A Ultra thin wafers having an edge support ring and manufacture method thereof |