| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/27/2009 | US7482687 Etch stop in a damascene interconnect structure |
| 01/27/2009 | US7482686 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same |
| 01/27/2009 | US7482685 Ceramic circuit board, method for making the same, and power module |
| 01/27/2009 | US7482684 Semiconductor device with a dopant region in a lower wire |
| 01/27/2009 | US7482683 Integrated circuit encapsulation system with vent |
| 01/27/2009 | US7482682 Micro-device packaging |
| 01/27/2009 | US7482681 Semiconductor device package utilizing proud interconnect material |
| 01/27/2009 | US7482680 Customized non-volatile memory device packages |
| 01/27/2009 | US7482679 Leadframe for a semiconductor device |
| 01/27/2009 | US7482678 Surface-mounted microwave package and corresponding mounting with a multilayer circuit |
| 01/27/2009 | US7482675 Probing pads in kerf area for wafer testing |
| 01/27/2009 | US7482671 MOS semiconductor device isolated by a device isolation film |
| 01/27/2009 | US7482659 Semiconductor devices with electric current detecting structure |
| 01/27/2009 | US7482658 Semiconductor device and method of manufacturing the same |
| 01/27/2009 | US7482650 Method of manufacturing a semiconductor integrated circuit device having a columnar laminate |
| 01/27/2009 | US7482645 Method and structure for making a top-side contact to a substrate |
| 01/27/2009 | US7482642 Bipolar transistors having controllable temperature coefficient of current gain |
| 01/27/2009 | US7482638 Package for a semiconductor light emitting device |
| 01/27/2009 | US7482551 Processing a memory link with a set of at least two laser pulses |
| 01/27/2009 | US7482288 Method for producing a grid cap with a locally increased dielectric constant |
| 01/27/2009 | US7482274 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same |
| 01/27/2009 | US7482263 Semiconductor device and method for manufacturing the same |
| 01/27/2009 | US7482260 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding |
| 01/27/2009 | US7482259 Chip structure and process for forming the same |
| 01/27/2009 | US7482256 Semiconductor device and method of manufacturing the same |
| 01/27/2009 | US7482253 Fusing nanowires using in situ crystal growth |
| 01/27/2009 | US7482237 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device |
| 01/27/2009 | US7482204 Chip packaging process |
| 01/27/2009 | US7482202 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 01/27/2009 | US7482201 Nanoparticle filled underfill |
| 01/27/2009 | US7482200 Process for fabricating chip package structure |
| 01/27/2009 | US7482198 Method for producing through-contacts and a semiconductor component with through-contacts |
| 01/27/2009 | US7481263 Cooling apparatus |
| 01/27/2009 | US7480988 Method and apparatus for providing hermetic electrical feedthrough |
| 01/22/2009 | WO2009012450A1 Methods for attachment and devices produced using the methods |
| 01/22/2009 | WO2009011752A2 Microelectronic package element and method of fabricating thereof |
| 01/22/2009 | WO2009011457A1 Method for producing heat transfer member, power module, inverter for vehicle, and vehicle |
| 01/22/2009 | WO2009011337A1 Resin composition and its use |
| 01/22/2009 | WO2009011335A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 01/22/2009 | WO2009011304A1 Heat curable resin compositon |
| 01/22/2009 | WO2009011175A1 Package component, electronic device provided with the package component and package component manufacturing method |
| 01/22/2009 | WO2009011140A1 Semiconductor package and its manufacturing method |
| 01/22/2009 | WO2009011077A1 Semiconductor device and process for producing the same |
| 01/22/2009 | WO2009010716A1 Semiconductor chip package with bent outer leads |
| 01/22/2009 | WO2009010457A2 Expansion slots for the thermomechanical relief of an electrical contact |
| 01/22/2009 | WO2009010440A1 Electronic component and device of high insulation resistance and method for producing the same |
| 01/22/2009 | WO2009010353A2 Component comprising at least one semiconductor substrate having an integrated circuit |
| 01/22/2009 | WO2008145804A9 Interference shielded electronics module and method for providing the same |
| 01/22/2009 | WO2008114091A3 Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
| 01/22/2009 | US20090023840 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 01/22/2009 | US20090023253 Semiconductor Device and Method of Making Same |
| 01/22/2009 | US20090023248 Method of packaging a semiconductor die |
| 01/22/2009 | US20090023244 Etching/bonding chamber for encapsulated devices and method of use |
| 01/22/2009 | US20090022893 Punched adhesive tape for semicconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 01/22/2009 | US20090022621 Bonding wire |
| 01/22/2009 | US20090021974 Semiconductor device |
| 01/22/2009 | US20090021922 Housing for a power module |
| 01/22/2009 | US20090021909 Method and system for cooling at least on electronic device |
| 01/22/2009 | US20090021873 Electro static discharge protection in integrated circuits |
| 01/22/2009 | US20090021626 Solid state imaging apparatus and method for fabricatig the same |
| 01/22/2009 | US20090021109 Under bump metal film, method for forming same, and surface acoustic wave device |
| 01/22/2009 | US20090020893 Integrated circuit package system with triple film spacer |
| 01/22/2009 | US20090020891 Methods to Achieve Precision Alignment for Wafter Scale Packages |
| 01/22/2009 | US20090020890 Semiconductor device and method for manufacturing the same |
| 01/22/2009 | US20090020889 Semiconductor apparatus and manufacturing method thereof |
| 01/22/2009 | US20090020888 Circuit module and electrical component |
| 01/22/2009 | US20090020887 Semiconductor apparatus and manufacturing method thereof |
| 01/22/2009 | US20090020886 Semiconductor device and method of fabricating the same |
| 01/22/2009 | US20090020885 Semiconductor device and method of manufacturing the same |
| 01/22/2009 | US20090020884 Surface treatment method, semiconductor device and method of forming the semiconductor device |
| 01/22/2009 | US20090020883 Semiconductor device and method for fabricating semiconductor device |
| 01/22/2009 | US20090020882 Semiconductor device and method of producing the same |
| 01/22/2009 | US20090020881 Semiconductor device package and fabricating method thereof |
| 01/22/2009 | US20090020880 Wiring structure in a semiconductor device and method of forming a wiring structure in a semiconductor device |
| 01/22/2009 | US20090020879 Wiring structure in semiconductor device and method of fabricating wiring structure in semiconductor device |
| 01/22/2009 | US20090020878 Semiconductor packages and methods of fabricating the same |
| 01/22/2009 | US20090020877 Transmission line structure and signal transmission structure |
| 01/22/2009 | US20090020876 High temperature packaging for semiconductor devices |
| 01/22/2009 | US20090020875 Semiconductor Device and Manufacturing Method Thereof |
| 01/22/2009 | US20090020874 Semiconductor device and method for manufacturing semiconductor device |
| 01/22/2009 | US20090020873 Semiconductor apparatus, and method of manufacturing semiconductor apparatus |
| 01/22/2009 | US20090020872 Wire bonding method and semiconductor device |
| 01/22/2009 | US20090020871 Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same |
| 01/22/2009 | US20090020870 Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board for such electronic device |
| 01/22/2009 | US20090020869 Interconnect joint |
| 01/22/2009 | US20090020868 Integrated circuit package and system interface |
| 01/22/2009 | US20090020867 Semiconductor device |
| 01/22/2009 | US20090020866 Semiconductor devices and manufacturing methods therefor |
| 01/22/2009 | US20090020865 Method for Packaging Semiconductor Dies Having Through-Silicon Vias |
| 01/22/2009 | US20090020864 Wafer Level package Structure and Fabrication Methods |
| 01/22/2009 | US20090020863 Stacked semiconductor devices and signal distribution methods thereof |
| 01/22/2009 | US20090020862 Device structure with preformed ring and method therefor |
| 01/22/2009 | US20090020861 Semiconductor device |
| 01/22/2009 | US20090020860 Semiconductor device and manufacturing method of the same |
| 01/22/2009 | US20090020859 Quad flat package with exposed common electrode bars |
| 01/22/2009 | US20090020858 Tape carrier substrate and semiconductor device |
| 01/22/2009 | US20090020857 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (sip) devices |
| 01/22/2009 | US20090020856 Semiconductor device structures and methods for shielding a bond pad from electrical noise |
| 01/22/2009 | US20090020855 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 01/22/2009 | US20090020850 Semiconductor design apparatus, semiconductor circuit and semiconductor design method |