| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/28/2009 | CN101355087A Active element array substrate |
| 01/28/2009 | CN101355083A Semiconductor device |
| 01/28/2009 | CN101355082A Display panel and test system |
| 01/28/2009 | CN101355081A Semiconductor device, wafer and method of designing and manufacturing the same |
| 01/28/2009 | CN101355079A Semiconductor device and method of fabricating the same |
| 01/28/2009 | CN101355078A Crosstalk-free wlcsp structure for high frequency application |
| 01/28/2009 | CN101355077A Method for designing semiconductor device and semiconductor device |
| 01/28/2009 | CN101355076A Integrated circuit having a semiconductor substrate with a barrier layer |
| 01/28/2009 | CN101355075A Loading belt for smart card, encapsulation module for smart card using the same and manufacturing method thereof |
| 01/28/2009 | CN101355074A 半导体器件封装 The semiconductor device package |
| 01/28/2009 | CN101355073A Leadframe panel |
| 01/28/2009 | CN101355072A Door pole stream-exchanging thyristor |
| 01/28/2009 | CN101355071A Conductor holder type semiconductor package and making method thereof |
| 01/28/2009 | CN101355070A Stackable semiconductor encapsulation construct for multi-cylinder body |
| 01/28/2009 | CN101355069A Semiconductor packages with through hole silicon and method of fabricating the same |
| 01/28/2009 | CN101355068A Bond pad stacks for ESD under pad and active under pad bonding |
| 01/28/2009 | CN101355067A Improved electrical connections for multichip modules |
| 01/28/2009 | CN101355066A Packaging structure and manufacturing method thereof |
| 01/28/2009 | CN101355065A Semiconductor device having external connection terminals and method of manufacturing the same |
| 01/28/2009 | CN101355064A Semiconductor device and method of manufacturing same |
| 01/28/2009 | CN101355063A Electronic device and method for manufacturing electronic device |
| 01/28/2009 | CN101355062A Cuprum/silicium encapsulating material with micro diffusion blocking layer and preparation method thereof |
| 01/28/2009 | CN101355061A High performance semiconductor module with sealant device on substrate carrier and corresponding production method |
| 01/28/2009 | CN101355060A Power semiconductor module with connecting devices |
| 01/28/2009 | CN101355059A 半导体器件 Semiconductor devices |
| 01/28/2009 | CN101355058A Semiconductor device and method of manufacturing the same |
| 01/28/2009 | CN101355057A Isolating ring substrate, mask plate and forming method thereof |
| 01/28/2009 | CN101355051A Semiconductor device having a copper metal line and method of forming the same |
| 01/28/2009 | CN101355049A Method for implementing air bridge interconnection and chip with air bridge interconnection structure |
| 01/28/2009 | CN101355044A System in package and method for fabricating the same |
| 01/28/2009 | CN101355043A Encapsulation body for electronic element and preparation method thereof |
| 01/28/2009 | CN101355042A Thin plastic leadless package with exposed metal die paddle |
| 01/28/2009 | CN101355040A Stacking structure for multiple chips and manufacturing method thereof |
| 01/28/2009 | CN101355039A Encapsulation body for image sensing element and preparation method thereof |
| 01/28/2009 | CN101355038A Method and chip for integrating micro electromechanical system device and integrated circuit |
| 01/28/2009 | CN101355013A Process for fabricating a structure for epitaxy without an exclusion zone |
| 01/28/2009 | CN101354947A Magnetic element and manufacturing method thereof |
| 01/28/2009 | CN101354917A Non-volatile memory devices including stacked nand-type resistive memory cell strings and methods of fabricating the same |
| 01/28/2009 | CN101354755A Semiconductor device and method for manufacturing the same |
| 01/28/2009 | CN101354222A Temperature equalization plate and interlaced capillary structure and method for manufacturing the same |
| 01/28/2009 | CN101354221A Temperature equalization plate and capillary structure and method for manufacturing the same |
| 01/28/2009 | CN101353471A Encapsulating epoxy resin molding material and semiconductor device |
| 01/28/2009 | CN101352802A Method for manufacturing heat radiator having plate-shaped fins |
| 01/28/2009 | CN100456914C Radiator module |
| 01/28/2009 | CN100456913C Radiation device |
| 01/28/2009 | CN100456655C Glass terminal for high-speed optical communication |
| 01/28/2009 | CN100456504C Ultra-high power illumination LED metallic packaging structure |
| 01/28/2009 | CN100456501C 光收发器模块 Optical transceiver module |
| 01/28/2009 | CN100456492C Semiconductor device having a photon absorption layer to prevent plasma damage |
| 01/28/2009 | CN100456480C Landscape insulation bar double-pole-type transistor |
| 01/28/2009 | CN100456474C Semiconductor device, manufacturing method for semiconductor device, and electronic equipment |
| 01/28/2009 | CN100456473C Package structure of power power-supply module |
| 01/28/2009 | CN100456472C Power converter package with enhanced thermal management |
| 01/28/2009 | CN100456471C Electronic apparatus |
| 01/28/2009 | CN100456470C Semi-fusible link system for a multi-layer integrated circuit and method of making same |
| 01/28/2009 | CN100456469C Structure and method for accurate deep trench resistance measurement |
| 01/28/2009 | CN100456468C Package for a high-frequency electronic device |
| 01/28/2009 | CN100456467C Silicon chip carrier with conductive through-VIAS and method for fabricating same |
| 01/28/2009 | CN100456466C 半导体装置 Semiconductor device |
| 01/28/2009 | CN100456465C Structure of reducing guide-hole stress and making method |
| 01/28/2009 | CN100456464C Semiconductor device and method for manufacturing semiconductor device |
| 01/28/2009 | CN100456463C Semiconductor device and method of manufacturing a semiconductor device |
| 01/28/2009 | CN100456462C Amorphous carbon layer to improve photoresist adhesion |
| 01/28/2009 | CN100456461C Heat sink of heat pipe |
| 01/28/2009 | CN100456460C Fastener of radiator |
| 01/28/2009 | CN100456459C Semiconductor chip heat transfer device |
| 01/28/2009 | CN100456458C Radiating apparatus |
| 01/28/2009 | CN100456457C Method of manufacturing radiating plate and semiconductor apparatus using the same |
| 01/28/2009 | CN100456456C Semiconductor package featuring metal lid member |
| 01/28/2009 | CN100456455C Substrate with many via contact means disposed therein |
| 01/28/2009 | CN100456448C Active matrix substrate, manufacturing method thereof, electro-optical device, and electronic apparatus |
| 01/28/2009 | CN100456444C Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 01/28/2009 | CN100456442C Semiconductor encapsulation structure possessing support part, and preparation method |
| 01/28/2009 | CN100456438C Semiconductor device and manufacturing process therefor as well as plating solution |
| 01/28/2009 | CN100456437C Zeolite-carbon doped oxide composite low K dielectric |
| 01/28/2009 | CN100456419C Method of producing a layer arrangement, method of producing an electrical component, layer arrangement, and electrical component |
| 01/28/2009 | CN100456206C Heat abstractor assembling |
| 01/28/2009 | CN100456090C Liquid crystal display device and thin film transistor base plate thereof |
| 01/28/2009 | CN100455513C Magnesium hydrate particles and its manufacturing method and resin composite including same |
| 01/27/2009 | US7483770 Cooling assembly comprising micro-jets |
| 01/27/2009 | US7483560 Method for measuring three dimensional shape of a fine pattern |
| 01/27/2009 | US7483286 Semiconductor memory device with high permeability lines interposed between adjacent transmission lines |
| 01/27/2009 | US7483273 Semiconductor module and semiconductor module heat radiation plate |
| 01/27/2009 | US7483261 Cooling device for an electronic equipment |
| 01/27/2009 | US7482861 Semiconductor integrated circuit device, and method of manufacturing the same |
| 01/27/2009 | US7482703 Semiconductor device having align mark layer and method of fabricating the same |
| 01/27/2009 | US7482702 Semiconductor component sealed on five sides by polymer sealing layer |
| 01/27/2009 | US7482701 Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device |
| 01/27/2009 | US7482700 Semiconductor device having projection on surface thereof, and method of identifying semiconductor package |
| 01/27/2009 | US7482699 Semiconductor device |
| 01/27/2009 | US7482698 Semiconducting device with folded interposer |
| 01/27/2009 | US7482696 Light-emitting diode package structure |
| 01/27/2009 | US7482695 Stack MCP and manufacturing method thereof |
| 01/27/2009 | US7482694 Semiconductor device and its manufacturing method |
| 01/27/2009 | US7482693 Top layers of metal for high performance IC's |
| 01/27/2009 | US7482692 Tungsten plug structure of semiconductor device and method for forming the same |
| 01/27/2009 | US7482691 Semiconductor device and method for fabricating the same |
| 01/27/2009 | US7482690 Electronic components such as thin array plastic packages and process for fabricating same |
| 01/27/2009 | US7482689 Microcomputer |
| 01/27/2009 | US7482688 Attaching heat sinks to integrated circuit packages |