| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/29/2009 | US20090026608 Crosstalk-Free WLCSP Structure for High Frequency Application |
| 01/29/2009 | US20090026607 Electronic Device and Method of Manufacturing Same |
| 01/29/2009 | US20090026606 Semiconductor Device and Method for Manufacturing the Same |
| 01/29/2009 | US20090026605 Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area |
| 01/29/2009 | US20090026604 Semiconductor plastic package and fabricating method thereof |
| 01/29/2009 | US20090026603 Electronic component package and method of manufacturing same |
| 01/29/2009 | US20090026602 Method For Manufacturing And Making Planar Contact With An Electronic Apparatus, And Correspondingly Manufactured Apparatus |
| 01/29/2009 | US20090026601 Semiconductor module |
| 01/29/2009 | US20090026600 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 01/29/2009 | US20090026599 Memory module capable of lessening shock stress |
| 01/29/2009 | US20090026598 Wafer Level Packaging Integrated Hydrogen Getter |
| 01/29/2009 | US20090026597 Stacked integrated circuit leadframe package system |
| 01/29/2009 | US20090026596 Lead frame, semiconductor package, and stacked semiconductor package having the same |
| 01/29/2009 | US20090026595 Semiconductor device package |
| 01/29/2009 | US20090026594 Thin Plastic Leadless Package with Exposed Metal Die Paddle |
| 01/29/2009 | US20090026593 Thin semiconductor die packages and associated systems and methods |
| 01/29/2009 | US20090026592 Semiconductor dies with recesses, associated leadframes, and associated systems and methods |
| 01/29/2009 | US20090026591 Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same |
| 01/29/2009 | US20090026590 Leadframe panel |
| 01/29/2009 | US20090026589 Semiconductor device and method of manufacturing the same |
| 01/29/2009 | US20090026588 Plasma processing method for forming a film and an electronic component manufactured by the method |
| 01/29/2009 | US20090026587 Gradient deposition of low-k cvd materials |
| 01/29/2009 | US20090026585 Semiconductor Device and Method for Manufacturing the same |
| 01/29/2009 | US20090026577 Antifuse element and semiconductor device including same |
| 01/29/2009 | US20090026575 Semiconductor device and method of manufacturing the same |
| 01/29/2009 | US20090026574 Electrical fuse having sublithographic cavities thereupon |
| 01/29/2009 | US20090026573 Semiconductor memory device and method for manufacturing the same |
| 01/29/2009 | US20090026570 Methods and structures for discharging plasma formed during the fabrication of semiconuctor device |
| 01/29/2009 | US20090026566 Semiconductor device having backside redistribution layers and method for fabricating the same |
| 01/29/2009 | US20090026558 Semiconductor device having a sensor chip, and method for producing the same |
| 01/29/2009 | US20090026524 Stacked Circuits |
| 01/29/2009 | US20090026511 Isolation process and structure for CMOS imagers |
| 01/29/2009 | US20090026482 Optoelectronic Component |
| 01/29/2009 | US20090026450 Thin film transistor substrate and method of manufacturing the same |
| 01/29/2009 | US20090025976 Electric component |
| 01/29/2009 | DE112007000781T5 Halbleitervorrichtung mit lötbaren Schleifenkontakten Semiconductor device with solderable loop contacts |
| 01/29/2009 | DE112007000112T5 Passive Impedanzentzerrung von seriellen Hochgeschwindigkeitsverbindungen Passive impedance equalization of high-speed serial links |
| 01/29/2009 | DE10351875B4 Integriertes Schaltkreisbauelement mit MIM-Kondensator Integrated circuit device with MIM capacitor |
| 01/29/2009 | DE10245770B4 Ausgangsschaltkreis Output circuit |
| 01/29/2009 | DE102008033465A1 Halbleiterbaugruppe mit einem Gehäuse Semiconductor device having a housing |
| 01/29/2009 | DE102008032170A1 Eine Herstellungsmethode einer lichtemittierenden Diode A manufacturing method of a light emitting diode |
| 01/29/2009 | DE102008029645A1 Halbleiter-Waferstruktur A semiconductor wafer structure |
| 01/29/2009 | DE102008026545A1 Halbleiter-Teilbaugruppen mit Verbünden und Verfahren zum Herstellen derselben Semiconductor subassemblies with composites and methods of making the same |
| 01/29/2009 | DE102008022087A1 Terminationskompensation für differentielle Signale auf Glas Terminationskompensation for differential signals on glass |
| 01/29/2009 | DE102007035060A1 Connection for semiconductor component with carrier element, has holes arranged one above other in semiconductor component and carrier element, where hole of semiconductor component is conically formed |
| 01/29/2009 | DE102007033810A1 Test structure e.g. MOSFET, for use in semiconductor device, has structure element e.g. isolation layer, positioned in structure with respect to another structure element such that changing of electric characteristics is effected |
| 01/29/2009 | DE102007010882B4 Verfahren zur Herstellung einer Lötverbindung zwischen einem Halbleiterchip und einem Substrat A process for producing a solder connection between a semiconductor chip and a substrate |
| 01/29/2009 | DE102007008912B4 Halbleitervorrichtung Semiconductor device |
| 01/29/2009 | DE102004043084B4 Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips Apparatus and method for the assembly or wiring of semiconductor chips |
| 01/29/2009 | DE102004003863B4 Technik zur Herstellung eingebetteter Metallleitungen mit einer erhöhten Widerstandsfähigkeit gegen durch Belastung hervorgerufenen Materialtransport Technology for the production of embedded metal lines with increased resistance caused by load material handling |
| 01/29/2009 | DE10042839B4 Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung Electronic component having heat sink and method for its preparation |
| 01/28/2009 | EP2019572A2 Assembly substrate and method of manufacturing the same |
| 01/28/2009 | EP2019571A2 Electronic component-embedded board and method of manufacturing the same |
| 01/28/2009 | EP2019429A1 Module with an electronic component electrically connected between two substrates, in particular DCB ceramic substrates, and production method thereof |
| 01/28/2009 | EP2019427A1 Low-noise flip-chip packages and flip chips thereof |
| 01/28/2009 | EP2019426A2 Heatsink having an internal plenum |
| 01/28/2009 | EP2019425A1 Semiconductor device and method for manufacturing the same |
| 01/28/2009 | EP2019424A2 High performance semiconductor module with sealant device on substrate carrier and corresponding production method |
| 01/28/2009 | EP2019421A2 Power semiconductor device with metal contact layer and corresponding production method |
| 01/28/2009 | EP2019106A1 (Thio)Phenoxy Phenyl Silane Composition And Method For Making Same |
| 01/28/2009 | EP2018793A1 Method for the production of an electroluminescence apparatus and an electroluminescence apparatus produced according to said method |
| 01/28/2009 | EP2018667A2 Power semiconductor module |
| 01/28/2009 | EP2018666A2 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component |
| 01/28/2009 | EP2018665A1 Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 01/28/2009 | EP1335831A4 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 01/28/2009 | EP1269450B1 Component provided with a description |
| 01/28/2009 | CN201188739Y Radiation fin structure and combined radiator |
| 01/28/2009 | CN201188738Y Composite heat-exchanging system |
| 01/28/2009 | CN201188737Y Electric refrigeration heat radiator |
| 01/28/2009 | CN201188424Y Novel output type coupler for light-sensitive thyristor |
| 01/28/2009 | CN201188422Y Substrate structure for thin-film transistor |
| 01/28/2009 | CN201188418Y Cooling apparatus for central processing unit |
| 01/28/2009 | CN201187759Y Heat radiation structure of LED illuminating apparatus |
| 01/28/2009 | CN201187758Y LED light fitting |
| 01/28/2009 | CN201187757Y LED light fitting |
| 01/28/2009 | CN201187755Y LED heat radiator |
| 01/28/2009 | CN201187752Y Structure improvement of LED explosion-proof lamp |
| 01/28/2009 | CN201187742Y High power LED lamp |
| 01/28/2009 | CN201187741Y Array type LED encapsulation structure |
| 01/28/2009 | CN201187731Y LED light guide board and heat radiating device thereof |
| 01/28/2009 | CN201187730Y LED lamp structure |
| 01/28/2009 | CN201187695Y Concatenation type light fitting heat radiating device |
| 01/28/2009 | CN201187694Y Strip-shaped LED lighting lamp |
| 01/28/2009 | CN201186252Y Glue solution injector driven by electromagnetic expulsive force |
| 01/28/2009 | CN101356644A Electronic assembly with detachable components |
| 01/28/2009 | CN101356643A 半导体器件 Semiconductor devices |
| 01/28/2009 | CN101356642A Printed-circuit board, and method for manufacturing the same |
| 01/28/2009 | CN101356641A Semiconductor mounting wiring board and method for manufacturing same, and semiconductor package |
| 01/28/2009 | CN101356640A Electronic component mounting board and method for manufacturing such board |
| 01/28/2009 | CN101356638A Semiconductor device and method for manufacturing semiconductor device |
| 01/28/2009 | CN101356633A Methods of packaging a semiconductor die and package formed by the methods |
| 01/28/2009 | CN101356007A Inorganic sulfate ion scavenger, inorganic scavenging composition, and electronic component- sealing resin composition, electronic component-sealing material, electronic component, varnish, adhesive, |
| 01/28/2009 | CN101355864A Radiating device |
| 01/28/2009 | CN101355845A Substrate with conductive projection and technique thereof |
| 01/28/2009 | CN101355117A Led |
| 01/28/2009 | CN101355098A Electro-optical apparatus, matrix substrate, and electronic unit |
| 01/28/2009 | CN101355096A Organic light emitting display and method of manufacturing the same |
| 01/28/2009 | CN101355094A Solid-state imaging device |
| 01/28/2009 | CN101355092A Encapsulation structure for optoelectronic device |
| 01/28/2009 | CN101355091A Case for housing solid-state imaging element, manufacturing method thereof, and solid-state imaging device |