Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/06/2014CN102134452B 半导体装置制造用耐热性粘合片和耐热性粘合片用粘合剂 The semiconductor device manufacturing heat-resistant adhesive sheet and heat-resistant adhesive sheet with an adhesive
08/06/2014CN102067144B 使用应力变化的侵入保护 Use stress intrusion protection
08/06/2014CN102044512B 集成电路及三维堆叠的多重芯片模块 Three-dimensional integrated circuits and multi-chip modules stacked
08/06/2014CN102017135B 带有在多个接触平面中的元器件的基板电路模块 A substrate having a plurality of circuit modules in the contact plane components
08/06/2014CN101996950B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN101980861B 用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法 Components and methods for reducing warpage during semiconductor processing and bending of the flexible substrate
08/06/2014CN101604671B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN101572406B 瞬态电压抑制器及方法 Transient voltage suppressor and methods
08/05/2014US8799845 Adaptive patterning for panelized packaging
08/05/2014US8797762 Device for acquiring information regarding the inside of a tire
08/05/2014US8796869 Semiconductor device and method of manufacturing the same
08/05/2014US8796868 Semiconductor layout
08/05/2014US8796867 Semiconductor package and fabrication method thereof
08/05/2014US8796866 Micro-electromechanical pressure sensor having reduced thermally-induced stress
08/05/2014US8796865 RFID tags with bumped substrate, and apparatuses and methods for making
08/05/2014US8796864 Flip chip bonded semiconductor device with shelf
08/05/2014US8796862 Three dimensional memory structure
08/05/2014US8796861 Semiconductor package having support member
08/05/2014US8796860 Semiconductor device
08/05/2014US8796858 Virtually substrate-less composite power semiconductor device
08/05/2014US8796856 Semiconductor device and manufacturing method thereof
08/05/2014US8796855 Semiconductor devices with nonconductive vias
08/05/2014US8796853 Metallic capped interconnect structure with high electromigration resistance and low resistivity
08/05/2014US8796852 3D integrated circuit structure and method for manufacturing the same
08/05/2014US8796851 Bonding pad and method of making same
08/05/2014US8796850 Wiring connection method and functional device
08/05/2014US8796849 Metal bump joint structure
08/05/2014US8796848 Circuit board and chip package structure
08/05/2014US8796847 Package substrate having main dummy pattern located in path of stress
08/05/2014US8796845 Electronic device covered by multiple layers and method for manufacturing electronic device
08/05/2014US8796844 Package structure
08/05/2014US8796843 RF and milimeter-wave high-power semiconductor device
08/05/2014US8796842 Stacked semiconductor chip device with thermal management circuit board
08/05/2014US8796841 Semiconductor device with embedded heat spreading
08/05/2014US8796840 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
08/05/2014US8796839 Semiconductor package including a power plane and a ground plane
08/05/2014US8796838 Semiconductor device
08/05/2014US8796837 Lead and lead frame for power package
08/05/2014US8796836 Land grid array semiconductor device packages
08/05/2014US8796835 Package on package having improved thermal characteristics
08/05/2014US8796834 Stack type semiconductor package
08/05/2014US8796833 Solder bump for ball grid array
08/05/2014US8796832 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
08/05/2014US8796831 Complex semiconductor packages and methods of fabricating the same
08/05/2014US8796830 Stackable low-profile lead frame package
08/05/2014US8796827 Semiconductor device including a DC-DC converter
08/05/2014US8796826 Window clamp top plate for integrated circuit packaging
08/05/2014US8796825 Materials, structures and methods for microelectronic packaging
08/05/2014US8796824 Semiconductor structure
08/05/2014US8796817 Semiconductor device
08/05/2014US8796801 Illuminable GaAs switching component with transparent housing and associated microwave circuit
08/05/2014US8796775 Electro-static discharge protection device
08/05/2014US8796739 Ballasted polycrystalline fuse
08/05/2014US8796725 Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device
08/05/2014US8796686 Integrated circuits with leakage current test structure
08/05/2014US8796684 Lithographic method and arrangement
08/05/2014US8796563 Connection structure, power module and method of manufacturing the same
08/05/2014US8796562 Combiner box
08/05/2014US8796561 Fan out build up substrate stackable package and method
08/05/2014US8796560 Power semiconductor package with bottom surface protrusions
08/05/2014US8796158 Methods for forming circuit pattern forming region in an insulating substrate
08/05/2014US8796138 Through substrate vias
08/05/2014US8796133 Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections
08/05/2014US8796115 Light-emitting diode arrangement and method for producing the same
08/05/2014US8796109 Techniques for bonding substrates using an intermediate layer
08/05/2014US8796077 Semiconductor device
08/05/2014US8795556 Self-aligned permanent on-chip interconnect structure formed by pitch splitting
08/05/2014US8794797 Hybrid illuminator
08/05/2014US8794498 Electronic component device and method for producing the same
08/05/2014US8794287 Wafer bonding apparatus
08/05/2014DE202014103443U1 Halbleiter-Bauelement Semiconductor component
07/2014
07/31/2014WO2014117119A1 Leadframe-based semiconductor package having terminals on top and bottom surfaces
07/31/2014WO2014116925A1 Methods of attaching a module on wafer substrate
07/31/2014WO2014116760A1 Variable frequency drive operation to avoid overheating
07/31/2014WO2014116656A1 Microelectronic package and method of manufacture thereof
07/31/2014WO2014116586A1 Metal-on-metal (mom) capacitors having laterally displaced layers, and related systems and methods
07/31/2014WO2014116538A1 Embedded package on package systems
07/31/2014WO2014116355A1 In-situ thermoelectric cooling
07/31/2014US20140213020 Semiconductor die mount by conformal die coating
07/31/2014US20140212085 Optocoupler
07/31/2014US20140211442 Pre-soldered leadless package
07/31/2014US20140210543 High frequency semiconductor switch
07/31/2014US20140210113 Alignment mark recovery with reduced topography
07/31/2014US20140210111 Embedded package on package systems
07/31/2014US20140210110 Attachment of microelectronic components
07/31/2014US20140210109 Built-in electronic component substrate and method for manufacturing the substrate
07/31/2014US20140210108 Semiconductor package
07/31/2014US20140210107 Stacked wafer ddr package
07/31/2014US20140210106 ULTRA THIN PoP PACKAGE
07/31/2014US20140210105 Method of forming interconnection lines
07/31/2014US20140210104 Non-lithographic formation of three-dimensional conductive elements
07/31/2014US20140210103 MRAM with Sidewall Protection and Method of Fabrication
07/31/2014US20140210102 Systems and methods for producing flat surfaces in interconnect structures
07/31/2014US20140210101 Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package
07/31/2014US20140210100 Conductive line routing for multi-patterning technology
07/31/2014US20140210099 Packaged Semiconductor Devices and Packaging Methods
07/31/2014US20140210098 Techniques for enhancing fracture resistance of interconnects
07/31/2014US20140210097 Integrated circuit package with active interposer
07/31/2014US20140210096 Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
07/31/2014US20140210094 Wiring structure, droplet discharge head, and droplet discharge apparatus
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