| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/03/2009 | US7486710 Semiconductor laser device and method of manufacturing the same |
| 02/03/2009 | US7486519 System for cooling a heat-generating electronic device with increased air flow |
| 02/03/2009 | US7486518 Cooling device and electronic apparatus |
| 02/03/2009 | US7486517 Hand-held portable electronic device having a heat spreader |
| 02/03/2009 | US7486515 Fluid circulator for fluid cooled electronic device |
| 02/03/2009 | US7486367 Display panel including signal lines having multiple conductive lines |
| 02/03/2009 | US7486307 Semiconductor apparatus having conductive layers and semiconductor thin films |
| 02/03/2009 | US7486284 Driver chip and display apparatus having the same |
| 02/03/2009 | US7485975 Alignment error measuring mark and method for manufacturing semiconductor device using the same |
| 02/03/2009 | US7485974 Chip structure with bevel pad row |
| 02/03/2009 | US7485973 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 02/03/2009 | US7485972 Semiconductor device |
| 02/03/2009 | US7485971 Electronic device package |
| 02/03/2009 | US7485970 Semiconductor package substrate having contact pad protective layer formed thereon |
| 02/03/2009 | US7485969 Stacked microelectronic devices and methods for manufacturing microelectronic devices |
| 02/03/2009 | US7485968 3D IC method and device |
| 02/03/2009 | US7485967 Semiconductor device with via hole for electric connection |
| 02/03/2009 | US7485964 Dielectric material |
| 02/03/2009 | US7485963 Use of supercritical fluid for low effective dielectric constant metallization |
| 02/03/2009 | US7485962 Semiconductor device, wiring substrate forming method, and substrate processing apparatus |
| 02/03/2009 | US7485961 Approach to avoid buckling in BPSG by using an intermediate barrier layer |
| 02/03/2009 | US7485960 Semiconductor device and manufacturing method thereof |
| 02/03/2009 | US7485959 Structure for joining a semiconductor package to a substrate using a solder column |
| 02/03/2009 | US7485958 Device with beam structure, and semiconductor device |
| 02/03/2009 | US7485957 Fluid cooled encapsulated microelectronic package |
| 02/03/2009 | US7485956 Microelectronic package optionally having differing cover and device thermal expansivities |
| 02/03/2009 | US7485955 Semiconductor package having step type die and method for manufacturing the same |
| 02/03/2009 | US7485954 Stacked dual MOSFET package |
| 02/03/2009 | US7485953 Chip package structure |
| 02/03/2009 | US7485952 Drop resistant bumpers for fully molded memory cards |
| 02/03/2009 | US7485951 Modularized die stacking system and method |
| 02/03/2009 | US7485949 Semiconductor device |
| 02/03/2009 | US7485944 Programmable electronic fuse |
| 02/03/2009 | US7485942 Films deposited at glancing incidence for multilevel metallization |
| 02/03/2009 | US7485940 Guard ring structure for improving crosstalk of backside illuminated image sensor |
| 02/03/2009 | US7485931 Semiconductor integrated circuit |
| 02/03/2009 | US7485930 Method for four direction low capacitance ESD protection |
| 02/03/2009 | US7485915 Semiconductor device and method having capacitor and capacitor insulating film that includes preset metal element |
| 02/03/2009 | US7485587 Method of making a semiconductor device having improved contacts |
| 02/03/2009 | US7485585 Method of forming a thin film, method of manufacturing a gate structure using the same and method of manufacturing a capacitor using the same |
| 02/03/2009 | US7485578 Semiconductor device |
| 02/03/2009 | US7485571 Method of making an integrated circuit |
| 02/03/2009 | US7485565 Nickel bonding cap over copper metalized bondpads |
| 02/03/2009 | US7485562 Method of making multichip wafer level packages and computing systems incorporating same |
| 02/03/2009 | US7485500 Chip module and method for producing a chip module |
| 02/03/2009 | US7485498 Space-efficient package for laterally conducting device |
| 02/03/2009 | US7485490 Method of forming a stacked semiconductor package |
| 02/03/2009 | US7485489 Electronics circuit manufacture |
| 02/03/2009 | US7485349 Thin film forming method |
| 02/03/2009 | US7485340 Thin metal films by atomic layer deposition: tungsten nucleation layer over a silicon wafer; copper film from CuCl and triethylboron; vapor phase pulses in inert gas |
| 02/03/2009 | US7485006 Memory module, socket and mounting method providing improved heat dissipating characteristics |
| 02/03/2009 | US7484556 Heat dissipating member |
| 02/03/2009 | CA2472750C High density area array solder microjoining interconnect structure and fabrication method |
| 01/29/2009 | WO2009015267A1 Bonding wire loop thermal extraction in semiconductor package |
| 01/29/2009 | WO2009014989A1 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 01/29/2009 | WO2009014985A2 Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires |
| 01/29/2009 | WO2009014956A1 Semiconductor dies with recesses, associated leadframes, and associated systems and methods |
| 01/29/2009 | WO2009014092A1 Ceramic substrate, process for producing the same, and dielectric-porcelain composition |
| 01/29/2009 | WO2009013826A1 Semiconductor device |
| 01/29/2009 | WO2009013678A2 Reinforced structure for a stack of layers in a semiconductor component |
| 01/29/2009 | WO2009013665A2 A leadframe structure for electronic packages |
| 01/29/2009 | WO2009013315A2 Semiconductor substrate with through-contact and method for production thereof |
| 01/29/2009 | WO2009013186A1 Semiconductor module |
| 01/29/2009 | WO2009012726A1 A non-insulating led |
| 01/29/2009 | WO2009003018A3 Conformal shielding process using process gases |
| 01/29/2009 | US20090029540 Nonvolatile semiconductor memory and manufacturing method thereof |
| 01/29/2009 | US20090029500 Hermetic pacakging and method of manufacture and use therefore |
| 01/29/2009 | US20090028491 Interconnect structure |
| 01/29/2009 | US20090027866 Semiconductor die package with internal bypass capacitors |
| 01/29/2009 | US20090027857 Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry |
| 01/29/2009 | US20090027137 Tapered dielectric and conductor structures and applications thereof |
| 01/29/2009 | US20090027074 Test structure and test method |
| 01/29/2009 | US20090026636 Semiconductor device and method of manufacturing same |
| 01/29/2009 | US20090026635 Semiconductor device and manufacturing method thereof |
| 01/29/2009 | US20090026634 Electronic part mounting structure and its manufacturing method |
| 01/29/2009 | US20090026633 Flip chip package structure and method for manufacturing the same |
| 01/29/2009 | US20090026632 Chip-to-chip package and process thereof |
| 01/29/2009 | US20090026631 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 01/29/2009 | US20090026630 Semiconductor device and method for manufacturing same |
| 01/29/2009 | US20090026629 Semiconductor package having a stacked wafer level package and method for fabricating the same |
| 01/29/2009 | US20090026628 Electrical connections for multichip modules |
| 01/29/2009 | US20090026627 Support Structures for On-Wafer Testing of Wafer-Level Packages and Multiple Wafer Stacked Structures |
| 01/29/2009 | US20090026626 Method for fabricating semiconductor device and semiconductor device |
| 01/29/2009 | US20090026625 Adhesion enhancement for metal/dielectric interface |
| 01/29/2009 | US20090026624 Semiconductor device and method for manufacturing metal line thereof |
| 01/29/2009 | US20090026623 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof |
| 01/29/2009 | US20090026622 Semiconductor Device and Method for Manufacturing Same |
| 01/29/2009 | US20090026621 Bond pad stacks for ESD under pad and active under pad bonding |
| 01/29/2009 | US20090026620 Method for cutting multilayer substrate, method for manufacturing semiconductor device, semiconductor device, light emitting device, and backlight device |
| 01/29/2009 | US20090026619 Method for Backside Metallization for Semiconductor Substrate |
| 01/29/2009 | US20090026618 Semiconductor device including interlayer interconnecting structures and methods of forming the same |
| 01/29/2009 | US20090026617 Semiconductor device having a copper metal line and method of forming the same |
| 01/29/2009 | US20090026616 Integrated circuit having a semiconductor substrate with a barrier layer |
| 01/29/2009 | US20090026615 Semiconductor device having external connection terminals and method of manufacturing the same |
| 01/29/2009 | US20090026614 System in package and method for fabricating the same |
| 01/29/2009 | US20090026613 Semiconductor package and method for manufacturing the same |
| 01/29/2009 | US20090026612 Semiconductor package having an improved connection structure and method for manufacturing the same |
| 01/29/2009 | US20090026611 Electronic assembly having a multilayer adhesive structure |
| 01/29/2009 | US20090026610 Semiconductor device and method of manufacturing the same |
| 01/29/2009 | US20090026609 Semiconductor device and method for manufacturing the same |