| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/04/2009 | CN101360391A Embedded capacitor construction of printed circuit board |
| 02/04/2009 | CN101359707A LED and manufacturing method thereof |
| 02/04/2009 | CN101359704A Light element device and method for manufacturing same |
| 02/04/2009 | CN101359692A Pixel construction and thin-film transistor thereof |
| 02/04/2009 | CN101359678A Image display system and preparation thereof |
| 02/04/2009 | CN101359672A Semiconductor structure |
| 02/04/2009 | CN101359671A Active array substrate, liquid crystal display board and method for manufacturing liquid crystal display board |
| 02/04/2009 | CN101359670A Active driving TFT matrix construction and manufacturing method thereof |
| 02/04/2009 | CN101359669A TFT LCD array substrate construction and manufacturing method thereof |
| 02/04/2009 | CN101359661A Multi-die dc-dc boost power converter with efficient packaging |
| 02/04/2009 | CN101359660A Semiconductor apparatus with thin semiconductor film |
| 02/04/2009 | CN101359659A Semiconductor package, semiconductor module and device comprising the module |
| 02/04/2009 | CN101359658A Multi-chip encapsulation construction of large power |
| 02/04/2009 | CN101359657A Multi-die dc-dc boost power converter with efficient packaging |
| 02/04/2009 | CN101359656A Image sensor package and fabrication method thereof |
| 02/04/2009 | CN101359655A LED encapsulation construction using ceramic as substrate and preparation thereof |
| 02/04/2009 | CN101359654A Structure of semiconductor component-buried loading board and preparation thereof |
| 02/04/2009 | CN101359653A Memory module encapsulation construction and encapsulation method thereof |
| 02/04/2009 | CN101359652A Coil type chip encapsulation construction |
| 02/04/2009 | CN101359651A Integrated circuit package structure having electromagnetic interference prevention structure |
| 02/04/2009 | CN101359650A Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same |
| 02/04/2009 | CN101359649A Programmable via devices, maufacturing method thereof and integrated logic circuit |
| 02/04/2009 | CN101359648A Programmable via devices, maufacturing method thereof and integrated logic circuit |
| 02/04/2009 | CN101359647A Semiconductor device, its manufacturing method and display apparatus |
| 02/04/2009 | CN101359646A Semiconductor wafer and manufacturing method for semiconductor device |
| 02/04/2009 | CN101359645A Semiconductor device, premolding packaging structure and manufacture method |
| 02/04/2009 | CN101359644A Integrated circuit package structure |
| 02/04/2009 | CN101359643A Package substrate and manufacturing method therefor |
| 02/04/2009 | CN101359642A Semiconductor chip package and method for designing the same |
| 02/04/2009 | CN101359641A Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication |
| 02/04/2009 | CN101359640A Circuit board overlapping construction having embedded semi-conductor element |
| 02/04/2009 | CN101359639A Circuit board construction embedded with semi-conductor chip and preparation thereof |
| 02/04/2009 | CN101359638A Electronic device, method of producing the same, and semiconductor device |
| 02/04/2009 | CN101359637A Power semiconductor device with metal contact layer and corresponding production method |
| 02/04/2009 | CN101359636A Encapsulation construction of electronic component and encapsulation method thereof |
| 02/04/2009 | CN101359635A Semiconductor substrate and method of fabricating the same, method of fabricating semiconductor device and method of fabricating image sensor |
| 02/04/2009 | CN101359620A Semiconductor structure for reducing resistance of metallic circuit and method of manufacturing same |
| 02/04/2009 | CN101359618A Thru hole filling method, thru hole filling construction and thru hole manufacturing method |
| 02/04/2009 | CN101359608A Integrate circuit packaging, forming method thereof and structure of wafer-level ball integrate circuit packaging |
| 02/04/2009 | CN101359604A Method, apparatus and system for strengthening chip cooling |
| 02/04/2009 | CN101359600A Integrated circuit packaging system for fine pitch substrates |
| 02/04/2009 | CN101359599A Lead frame and manufacturing method thereof, semi-conductor device and manufacturing method thereof |
| 02/04/2009 | CN101359136A TFT LCD array substrate structure and method for manufacturing same |
| 02/04/2009 | CN101358723A LED lamp radiator and its manufacture method |
| 02/04/2009 | CN101358722A LED lamp body and lamp case with high heat sinking mechanism |
| 02/04/2009 | CN101358721A Evaporator, loop heat pipe module and heat generating apparatus |
| 02/04/2009 | CN101358715A Packaging technology for white light LED |
| 02/04/2009 | CN100459839C Support column with porous structure |
| 02/04/2009 | CN100459837C An electronic device |
| 02/04/2009 | CN100459426C Single package multi-chip RF power amplifier |
| 02/04/2009 | CN100459329C Light-emitting semiconductor component comprising protective diode |
| 02/04/2009 | CN100459319C Card connector having a heat radiation member without inhibiting insertion and removal of card |
| 02/04/2009 | CN100459222C Mask, method of manufacturing the same, method of forming thin film pattern, method of manufacturing electro-optical device |
| 02/04/2009 | CN100459200C Optical diode package structure |
| 02/04/2009 | CN100459195C Illuminator packaging structural capable of preventing electrostatic damaged and manufacturing method therefor |
| 02/04/2009 | CN100459194C Packing structure and method |
| 02/04/2009 | CN100459190C Device for cooling an electrical component and production method thereof |
| 02/04/2009 | CN100459167C Thin film transistor array panel and its manufacturing method |
| 02/04/2009 | CN100459154C Semiconductor device with sense structure |
| 02/04/2009 | CN100459152C Isolated high-voltage LDMOS transistor having a split well structure |
| 02/04/2009 | CN100459145C Insulation structure of the high-voltage power integrated circuit |
| 02/04/2009 | CN100459142C Semiconductor display device, semiconductor and electronic device |
| 02/04/2009 | CN100459140C Solid-state imaging device and manufacturing method thereof, and camera module |
| 02/04/2009 | CN100459138C Optical device and method for fabricating the same |
| 02/04/2009 | CN100459137C Method for manufacturing backside-illuminated optical sensor |
| 02/04/2009 | CN100459136C Solid-state imaging device and method for manufacturing the same |
| 02/04/2009 | CN100459134C Solid-state imaging apparatus |
| 02/04/2009 | CN100459130C Semiconductor structure and application, especially for restricting over-voltage |
| 02/04/2009 | CN100459129C Semiconductor product with semiconductor substrate and testing structure, and method |
| 02/04/2009 | CN100459128C Wafer for realizing the chip pin compatibility and method thereof |
| 02/04/2009 | CN100459125C Semiconductor device manufacturing method |
| 02/04/2009 | CN100459124C Multiple chip packaging arrangement |
| 02/04/2009 | CN100459123C Stack type chip packaging structure, chip packaging body and manufacturing method |
| 02/04/2009 | CN100459122C Multi-chip package and producing method thereof |
| 02/04/2009 | CN100459121C RF power transistor with internal bias feed |
| 02/04/2009 | CN100459120C Bipolar transistor having raised extrinsic base |
| 02/04/2009 | CN100459119C Lateral LUBISTOR structure and method |
| 02/04/2009 | CN100459118C ESD protection for high voltage applications |
| 02/04/2009 | CN100459117C Integrated circuit device with electrostatic discharge protection element |
| 02/04/2009 | CN100459116C Electronic device and method of manufacturing same |
| 02/04/2009 | CN100459115C Band type substrate and semiconductor package using the same |
| 02/04/2009 | CN100459114C Electric device for forming contact array on substrate |
| 02/04/2009 | CN100459113C Lead frame and method for fabricating resin-encapsulated semiconductor device using the same |
| 02/04/2009 | CN100459112C Electronic component having an integrated passive electronic component |
| 02/04/2009 | CN100459111C Method and apparatus for a dual substrate package |
| 02/04/2009 | CN100459110C Electronic part mounting substrate and semiconductor device |
| 02/04/2009 | CN100459109C Cu-Mo substrate and method for producing same |
| 02/04/2009 | CN100459108C Semiconductor device |
| 02/04/2009 | CN100459107C Semiconductor devices and manufacturing method thereof |
| 02/04/2009 | CN100459099C Copper interconnected fabricating method for semiconductor device and structure thereof |
| 02/04/2009 | CN100459098C Integrated electronic component having specifically produced nanotubes in vertical structure and manufacturing method thereof |
| 02/04/2009 | CN100459097C Semiconductor devices and method for forming bottom connector used in the Semiconductor devices |
| 02/04/2009 | CN100459085C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459084C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459083C Method for manufacturing substrate of embedded element |
| 02/04/2009 | CN100459069C Fuse and method for forming |
| 02/04/2009 | CN100459066C Semiconductor device and manufacturing process therefor as well as plating solution |
| 02/04/2009 | CN100458343C Heat collector with mounting plate |
| 02/04/2009 | CN100457823C Epoxy resin composition, condensate thereof |
| 02/04/2009 | CN100457086C Aseptic medicine composition |