| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/05/2009 | US20090032934 Potential-free housing leadthrough |
| 02/05/2009 | US20090032933 Redistributed chip packaging with thermal contact to device backside |
| 02/05/2009 | US20090032932 Integrated circuit packaging system for fine pitch substrates |
| 02/05/2009 | US20090032931 Power semiconductor module with connecting devices |
| 02/05/2009 | US20090032930 Packaging substrate having chip embedded therein and manufacturing method thereof |
| 02/05/2009 | US20090032929 Semiconductor chips with reduced stress from underfill at edge of chip |
| 02/05/2009 | US20090032928 Multi-chip stack structure having through silicon via and method for fabrication the same |
| 02/05/2009 | US20090032927 Semiconductor substrates connected with a ball grid array |
| 02/05/2009 | US20090032926 Integrated Support Structure for Stacked Semiconductors With Overhang |
| 02/05/2009 | US20090032925 Packaging with a connection structure |
| 02/05/2009 | US20090032924 Hermetically sealed package with window |
| 02/05/2009 | US20090032923 Method and apparatus for stacking electrical components using via to provide interconnection |
| 02/05/2009 | US20090032922 Semiconductor Package, Printed Wiring Board Structure and Electronic Apparatus |
| 02/05/2009 | US20090032921 Printed wiring board structure and electronic apparatus |
| 02/05/2009 | US20090032920 Laser release process for very thin si-carrier build |
| 02/05/2009 | US20090032919 Semiconductor device and lead frame |
| 02/05/2009 | US20090032918 Integrated circuit package system with multiple devices |
| 02/05/2009 | US20090032917 Lead frame package apparatus and method |
| 02/05/2009 | US20090032916 Semiconductor package apparatus |
| 02/05/2009 | US20090032915 TFCC (TM) & SWCC (TM) thermal flex contact carriers |
| 02/05/2009 | US20090032914 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module |
| 02/05/2009 | US20090032913 Component and assemblies with ends offset downwardly |
| 02/05/2009 | US20090032911 Patterned thin soi |
| 02/05/2009 | US20090032910 Dielectric stack containing lanthanum and hafnium |
| 02/05/2009 | US20090032909 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners |
| 02/05/2009 | US20090032902 Semiconductor Devices and Methods for Manufacturing the Same |
| 02/05/2009 | US20090032901 Method of curing hydrogen silsesquioxane and densification in nano-scale trenches |
| 02/05/2009 | US20090032876 ESD protection for bipolar-CMOS-DMOS integrated circuit devices |
| 02/05/2009 | US20090032871 Integrated circuit with interconnected frontside contact and backside contact |
| 02/05/2009 | US20090032857 Semiconductor device manufacturing method and semiconductor device |
| 02/05/2009 | US20090032846 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 02/05/2009 | US20090032813 Test Wafer, Manufacturing Method Thereof and Method for Measuring Plasma Damage |
| 02/05/2009 | US20090032095 Semiconductor Component And Method For Producing It and Use for It |
| 02/05/2009 | US20090031563 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 02/05/2009 | DE19817359B4 Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung Ceramic multi-layer circuit, and process for their preparation |
| 02/05/2009 | DE19541497B4 Lateraler Feldeffekttransistor Lateral field effect transistor |
| 02/05/2009 | DE112007000800T5 Herstellung von Halbleitervorrichtungen und elektrischen Bauteilen unter Verwendung von metallbeschichteten Drähten Fabrication of semiconductor devices and electrical components using metal-coated wires |
| 02/05/2009 | DE112006003812T5 Kühlvorrichtung Cooler |
| 02/05/2009 | DE10322745B4 Leistungshalbleiter-Bauelement mit hoher Abstrahlungseffizienz Power semiconductor device having high radiation efficiency |
| 02/05/2009 | DE10236197B4 Harzversiegelte Halbleitervorrichtung The resin-sealed semiconductor device |
| 02/05/2009 | DE102008034693A1 Integrierte Schaltung mit verbundenem Vorderseitenkontakt und Rückseitenkontakt Integrated circuit with a bandaged front contact and back contact |
| 02/05/2009 | DE102008034562A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 02/05/2009 | DE102008034159A1 Elektronikbauelement und Verfahren zu seiner Herstellung An electronics device and process for its preparation |
| 02/05/2009 | DE102008034158A1 Integrierte Schaltung mit einer Halbleiteranordnung in Dünnfilm-SOI-Technologie An integrated circuit with a semiconductor device in thin film SOI technology |
| 02/05/2009 | DE102008027466A1 Bond-Pad-Stacks für ESD unter einem Pad und Bonden einer aktiven Schaltung unterhalb eines Pads Bond pad stacks for ESD under a pad and bonding an active circuit below a pad |
| 02/05/2009 | DE102007036226A1 Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur The mounting structure for LEDs, LED module, LED module base, method for forming a mounting structure |
| 02/05/2009 | DE102007036048A1 Anordnung mit zumindest einem Halbleiterbauelement, insbesondere einem Leistungshalbleiterbauelement zur Leistungssteuerung hoher Ströme Assembly comprising at least one semiconductor component, in particular a power semiconductor device for power control of high currents |
| 02/05/2009 | DE102007036046A1 Planar electronic module, has contact conductor structure connecting component contact surface with contact surface and/or multiple contact or component contact surfaces with one another, and exhibiting electric strength of specific range |
| 02/05/2009 | DE102007036045A1 Elektronischer Baustein mit zumindest einem Bauelement, insbesondere einem Halbleiterbauelement, und Verfahren zu dessen Herstellung Electronic component with at least one component, in particular a semiconductor device, and method for its production |
| 02/05/2009 | DE102007036044A1 Chip module, particularly power module, comprises chip which is provided with main side with one or multiple chip contact surfaces, where structured sheet metal layer is provided with main side |
| 02/05/2009 | DE102007035902A1 Verfahren zum Herstellen eines elektronischen Bausteins und elektronischer Baustein A method of manufacturing an electronic component and electronic component |
| 02/05/2009 | DE102007035834A1 Halbleiterbauelement mit lokal erhöhtem Elektromigrationswiderstand in einer Verbindungsstruktur A semiconductor device with locally increased electromigration resistance in an interconnection structure |
| 02/05/2009 | DE102007035608A1 Semiconductor module, has connecting element connecting electrode of semiconductor chip with contact connection surface of substrate, and semiconductor chip, connecting element and substrate embedded in cover of flexible group layer |
| 02/05/2009 | DE102007034949A1 Einheitlich normierte Leistungspackages Uniformly normalized power packages |
| 02/05/2009 | DE102007034847A1 Leistungshalbleitermodul mit Verbindungseinrichtungen Power semiconductor module with connection means |
| 02/05/2009 | DE102007034491A1 Modul mit elektronischem Bauelement zwischen zwei Substraten, insbesondere DCB-Keramiksubstraten, dessen Herstellung und Kontaktierung Module with electronic device between two substrates, in particular DCB ceramic substrates, its preparation and contacting |
| 02/05/2009 | CA2694676A1 Method for marking valuable articles |
| 02/04/2009 | EP2020684A2 Semiconductor device and offset voltage adjusting method |
| 02/04/2009 | EP2020683A1 Semiconductor device and method for manufacturing same |
| 02/04/2009 | EP2020033A2 Semiconductor device with improved contact fuse |
| 02/04/2009 | EP2020029A2 Improved cmos diodes with dual gate conductors, and methods for forming the same |
| 02/04/2009 | EP2020028A2 Assembly, chip and method of operating |
| 02/04/2009 | EP2020027A2 Structure and method for creating reliable via contacts for interconnect applications |
| 02/04/2009 | EP2019810A1 Chip housing with reduced coupled-in vibration |
| 02/04/2009 | EP1817439B1 Non-evaporable getter alloys for hydrogen sorption |
| 02/04/2009 | EP1247292B1 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 02/04/2009 | EP1169735B1 Semiconductor radiation emitter package |
| 02/04/2009 | CN201191963Y 热管散热器 Heat pipe radiator |
| 02/04/2009 | CN201191961Y Three-dimensional temperature equalizing heat transferring device |
| 02/04/2009 | CN201191960Y Improvement of water cooling head structure |
| 02/04/2009 | CN201191959Y Heat conducting construction |
| 02/04/2009 | CN201191612Y Anti-static LED having protection function |
| 02/04/2009 | CN201191611Y Full-colored SMD |
| 02/04/2009 | CN201191610Y RGB LED construction |
| 02/04/2009 | CN201191609Y RGB LED construction |
| 02/04/2009 | CN201191608Y Semiconductor piece connected by insulative wire |
| 02/04/2009 | CN201191607Y SMA patch diode |
| 02/04/2009 | CN201191606Y Water cooling radiator for semiconductor |
| 02/04/2009 | CN201191605Y Foldable sheet connection structure of CPU heat radiator |
| 02/04/2009 | CN201191604Y Ultra-thin large current ceramic housing |
| 02/04/2009 | CN201190981Y Radiating structure of LED |
| 02/04/2009 | CN201190979Y LED light-emitting device with high thermal diffusivity |
| 02/04/2009 | CN201190977Y LED fluorescent tube |
| 02/04/2009 | CN201190976Y Led lamp and heat radiation model set thereof with heat convection and thermal conduction |
| 02/04/2009 | CN201190965Y Surface type led lamp |
| 02/04/2009 | CN201189085Y Electric pressure cooker capable of quickly cooling |
| 02/04/2009 | CN101361221A High-frequency semiconductor device |
| 02/04/2009 | CN101361198A Pixel structure for a solid state light emitting device |
| 02/04/2009 | CN101361186A Structure and method for making high density mosfet circuits with different height contact lines |
| 02/04/2009 | CN101361185A Mounting device for a semiconductor package |
| 02/04/2009 | CN101361184A Aluminum/silicon carbide composite and heat radiation part making use of the same |
| 02/04/2009 | CN101361183A Integrated electronic device and cooling device for an integrated electronic device |
| 02/04/2009 | CN101361182A Interposer with built-in passive part |
| 02/04/2009 | CN101361181A Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
| 02/04/2009 | CN101361180A High frequency device module and method for manufacturing the same |
| 02/04/2009 | CN101361163A Metal cuboid semiconductor device and method |
| 02/04/2009 | CN101360413A Fastener module and heat radiating device with the same |
| 02/04/2009 | CN101360412A Micro liquid cooling device and micro-liquid-drop generator adopted thereby |
| 02/04/2009 | CN101360411A Heat Radiating device |
| 02/04/2009 | CN101360393A Circuit board construction embedded with semi-conductor chip and preparation thereof |