| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/10/2009 | US7489026 Methods and apparatus for a Quad Flat No-Lead (QFN) package |
| 02/10/2009 | US7489025 Device and method for fabricating double-sided SOI wafer scale package with optical through via connections |
| 02/10/2009 | US7489024 TMOS-infrared uncooled sensor and focal plane array |
| 02/10/2009 | US7489023 Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device |
| 02/10/2009 | US7489022 Radio frequency over-molded leadframe package |
| 02/10/2009 | US7489021 Lead frame with included passive devices |
| 02/10/2009 | US7489020 Semiconductor wafer assemblies |
| 02/10/2009 | US7489016 Trench-constrained isolation diffusion for integrated circuit die |
| 02/10/2009 | US7489015 Magnetic shielding for magnetic random access memory |
| 02/10/2009 | US7489013 Destructor integrated circuit chip, interposer electronic device and methods |
| 02/10/2009 | US7489010 Semiconductor memory device |
| 02/10/2009 | US7489007 High-voltage lateral DMOS device |
| 02/10/2009 | US7488996 Thin film transistor array panel for a liquid crystal display |
| 02/10/2009 | US7488993 Semiconductor device and method of manufacturing the same |
| 02/10/2009 | US7488980 Thin film semiconductor device and fabrication method therefor |
| 02/10/2009 | US7488904 Resin molded component fitted with a metal plate and molding method therefor |
| 02/10/2009 | US7488899 Compliant contact pin assembly and card system |
| 02/10/2009 | US7488895 Method for manufacturing component built-in module, and component built-in module |
| 02/10/2009 | US7488679 Interconnect structure and process of making the same |
| 02/10/2009 | US7488674 Semiconductor device and manufacturing method thereof |
| 02/10/2009 | US7488668 Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions |
| 02/10/2009 | US7488636 Broken die detect sensor |
| 02/10/2009 | US7488633 Method for forming polysilicon by illuminating a laser beam at the amorphous silicon substrate through a mask |
| 02/10/2009 | US7488622 Method for producing a surface-mountable semiconductor component |
| 02/10/2009 | US7488619 Method and apparatus for manufacturing IC chip packaged device |
| 02/10/2009 | US7487822 Micro-chimney and thermosiphon die-level cooling |
| 02/10/2009 | US7487815 Terminal electrode forming apparatus and system for holding electronic components |
| 02/10/2009 | US7487586 Process for producing semiconductor device |
| 02/10/2009 | US7487585 Method of manufacturing a metal-ceramic circuit board |
| 02/10/2009 | US7487581 Method of manufacturing an inverter device |
| 02/10/2009 | CA2321360C Process for encapsulating electronic components |
| 02/05/2009 | WO2009018589A2 Assembly of encapsulated electronic components to a printed circuit board |
| 02/05/2009 | WO2009017999A2 Dual side cooling integrated power device package and module and methods of manufacture |
| 02/05/2009 | WO2009017835A2 Semiconductor packaging process using through silicon vias |
| 02/05/2009 | WO2009017433A1 Method for marking valuable articles |
| 02/05/2009 | WO2009017314A2 Head socket for contacting probe card and wafer test apparatus |
| 02/05/2009 | WO2009017146A1 Cu wiring film |
| 02/05/2009 | WO2009017132A1 Power conversion device and method for manufacturing the same |
| 02/05/2009 | WO2009016980A1 Plated material having metal thin film formed by electroless plating, and method for production thereof |
| 02/05/2009 | WO2009016979A1 Plated material having metal thin film formed by electroless plating, and method for production thereof |
| 02/05/2009 | WO2009016880A1 Semiconductor device |
| 02/05/2009 | WO2009016531A2 Reduced bottom roughness of stress buffering element of a semiconductor component |
| 02/05/2009 | WO2009016495A1 Semiconductor device having a bump electrode and method for its manufacture |
| 02/05/2009 | WO2009016408A1 Flexible joint |
| 02/05/2009 | WO2009016407A2 Tiled light sensing array |
| 02/05/2009 | WO2009016041A1 Method for producing an electronic component and electronic component |
| 02/05/2009 | WO2009016039A1 Electronic module having at least one component, particularly a semiconductor component, and method for the production thereof |
| 02/05/2009 | US20090036070 Multiple die integrated circuit assembly |
| 02/05/2009 | US20090035929 Method of manufacturing semiconductor device |
| 02/05/2009 | US20090035896 High power mcm package with improved planarity and heat dissipation |
| 02/05/2009 | US20090035893 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
| 02/05/2009 | US20090033840 Chip module, active device array substrate and liquid crystal display panel |
| 02/05/2009 | US20090033495 Moldable radio frequency identification device |
| 02/05/2009 | US20090033354 Multi-purpose poly edge test structure |
| 02/05/2009 | US20090033353 Systems and methods for electrical characterization of inter-layer alignment |
| 02/05/2009 | US20090032979 Semiconductor device having alignment mark and its manufacturing method |
| 02/05/2009 | US20090032978 Microelectronic structure including dual damascene structure and high contrast alignment mark |
| 02/05/2009 | US20090032977 Semiconductor device |
| 02/05/2009 | US20090032976 Semiconductor device manufacturing method |
| 02/05/2009 | US20090032975 Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution |
| 02/05/2009 | US20090032974 Method and structure to reduce cracking in flip chip underfill |
| 02/05/2009 | US20090032973 Semiconductor stack package having wiring extension part which has hole for wiring |
| 02/05/2009 | US20090032972 Semiconductor device |
| 02/05/2009 | US20090032971 Die Stacking Apparatus and Method |
| 02/05/2009 | US20090032970 Stacking of integrated circuits using glassy metal bonding |
| 02/05/2009 | US20090032969 Arrangement of Integrated Circuit Dice and Method for Fabricating Same |
| 02/05/2009 | US20090032968 Via configurable architecture for customization of analog circuitry in a semiconductor device |
| 02/05/2009 | US20090032967 Semiconductor Device with Dynamic Array Section |
| 02/05/2009 | US20090032966 Method of fabricating a 3-D device and device made thereby |
| 02/05/2009 | US20090032965 Seminconductor device having P-N column portion |
| 02/05/2009 | US20090032964 System and method for providing semiconductor device features using a protective layer |
| 02/05/2009 | US20090032963 Semiconductor structures including tight pitch contacts and methods to form same |
| 02/05/2009 | US20090032962 Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation |
| 02/05/2009 | US20090032961 Semiconductor device having a locally enhanced electromigration resistance in an interconnect structure |
| 02/05/2009 | US20090032960 Semiconductor devices and methods of manufacturing semiconductor devices |
| 02/05/2009 | US20090032959 Electrical fuses and resistors having sublithographic dimensions |
| 02/05/2009 | US20090032958 Intermetallic conductors |
| 02/05/2009 | US20090032957 Semiconductor device and method of manufacturing the semiconductor device |
| 02/05/2009 | US20090032956 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics |
| 02/05/2009 | US20090032955 Semiconductor device, its manufacturing method and display apparatus |
| 02/05/2009 | US20090032954 Semiconductor device and method of fabricating the same |
| 02/05/2009 | US20090032953 Semiconductor device and method of manufacturing the same |
| 02/05/2009 | US20090032952 TANTALUM AMIDO-COMPLEXES WITH CHELATE LIGANDS USEFUL FOR CVD AND ALD OF TaN AND Ta205 THIN FILMS |
| 02/05/2009 | US20090032951 Small Area, Robust Silicon Via Structure and Process |
| 02/05/2009 | US20090032950 Film forming method, semiconductor device manufacturing method, semiconductor device, program and recording medium |
| 02/05/2009 | US20090032949 Method of depositing Tungsten using plasma-treated tungsten nitride |
| 02/05/2009 | US20090032948 Semiconductor chip package and method for designing the same |
| 02/05/2009 | US20090032947 Semiconductor device and method of manufacturing |
| 02/05/2009 | US20090032946 Integrated circuit |
| 02/05/2009 | US20090032945 Solder bump on a semiconductor substrate |
| 02/05/2009 | US20090032944 Electronic device, method of producing the same, and semiconductor device |
| 02/05/2009 | US20090032943 Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication |
| 02/05/2009 | US20090032942 Semiconductor chip with solder bump and method of fabricating the same |
| 02/05/2009 | US20090032941 Under Bump Routing Layer Method and Apparatus |
| 02/05/2009 | US20090032940 Conductor Bump Method and Apparatus |
| 02/05/2009 | US20090032939 Method of forming a stud bump over passivation, and related device |
| 02/05/2009 | US20090032938 Electronic Package With Direct Cooling Of Active Electronic Components |
| 02/05/2009 | US20090032937 Cooling systems for power semiconductor devices |
| 02/05/2009 | US20090032936 Semiconductor device, method for the same, and heat radiator |
| 02/05/2009 | US20090032935 Semiconductor device |