| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/11/2009 | CN101364605A Image apparatus |
| 02/11/2009 | CN101364604A Display device |
| 02/11/2009 | CN101364603A TFT array substrate construction and manufacturing method thereof |
| 02/11/2009 | CN101364601A Method for improving SRAM function of high-voltage product and solving problem of unqualified voltage |
| 02/11/2009 | CN101364593A Staggered offset stacking encapsulation construction having multistage omnibus bar in conductive wire support |
| 02/11/2009 | CN101364592A Electrostatic discharging protection circuit |
| 02/11/2009 | CN101364591A Extrusion failure monitor structures |
| 02/11/2009 | CN101364590A Fuse circuit |
| 02/11/2009 | CN101364589A Fuse box and method for fabricating the same and method for repairing the same in semiconductor device |
| 02/11/2009 | CN101364588A Electric fuse-wire device capable of reprogramming |
| 02/11/2009 | CN101364587A Circuit board construction for embedding capacitor element and preparation thereof |
| 02/11/2009 | CN101364586A Construction for packaging substrate and preparation thereof |
| 02/11/2009 | CN101364585A Support, chip packaging construction having the support and manufacturing method therefor |
| 02/11/2009 | CN101364584A Semiconductor device |
| 02/11/2009 | CN101364583A Capacitor embedded semi-conductor package substrate construction and preparation thereof |
| 02/11/2009 | CN101364582A Loading board construction embedded with chip and preparation thereof |
| 02/11/2009 | CN101364581A Loading board construction embedded with chip and preparation thereof |
| 02/11/2009 | CN101364580A Package and semiconductor device |
| 02/11/2009 | CN101364579A Semiconductor package, method of manufacturing the same and system containing the package |
| 02/11/2009 | CN101364578A Semiconductor device and method of manufacturing the same |
| 02/11/2009 | CN101364577A Chip module group, active element array substrate and LCD panel |
| 02/11/2009 | CN101364576A Radiator for semi-conductor electronic device |
| 02/11/2009 | CN101364575A Semiconductor device |
| 02/11/2009 | CN101364574A Semiconductor device package having a back side protective scheme |
| 02/11/2009 | CN101364573A Test construction and test method |
| 02/11/2009 | CN101364571A Semiconductor device and method for fabricating the same |
| 02/11/2009 | CN101364569A Method for manufacturing a magnetic memory device and magnetic memory device |
| 02/11/2009 | CN101364554A Method of evaluating thermal stress resistance of semiconductor device, and semiconductor wafer having test element |
| 02/11/2009 | CN101364550A Multi-chip stacking structure having silicon channel and preparation thereof |
| 02/11/2009 | CN101364532A MIM capacitor and manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 02/11/2009 | CN101364016A Thin-film transistor LCD pixel structure and its making method |
| 02/11/2009 | CN101363610A LED bulb |
| 02/11/2009 | CN101363609A Light source assembly high-power LED lamp and installation method thereof in lamp holder |
| 02/11/2009 | CN101363606A High-efficiency heat radiation LED lamp and system thereof |
| 02/11/2009 | CN101363605A LED lamp and heat radiation structure thereof |
| 02/11/2009 | CN101363604A Radiating module for LED lamp |
| 02/11/2009 | CN101363603A LED lamp group |
| 02/11/2009 | CN101363601A Illuminating apparatus with heat radiation protection loop |
| 02/11/2009 | CN101363600A LED lamp |
| 02/11/2009 | CN101362585A Semiconductor device, lead frame, and microphone package therefor |
| 02/11/2009 | CN101362004A Health physical therapy chip module |
| 02/11/2009 | CN100461995C Array jetting micro heat exchanger |
| 02/11/2009 | CN100461576C ESD protection circuit and layout thereof |
| 02/11/2009 | CN100461474C Packing structure of chip inverted-mounted light-emitting diode and packing method thereof |
| 02/11/2009 | CN100461464C Semiconductor structure for imaging detectors |
| 02/11/2009 | CN100461433C TFI array structure and manufacturing method thereof |
| 02/11/2009 | CN100461429C Array baseplate of film transistor with electrostatic protection |
| 02/11/2009 | CN100461423C Memory element and forming method thereof |
| 02/11/2009 | CN100461408C Integrated circuit device with sealed-ring corner structure |
| 02/11/2009 | CN100461404C 半导体器件 Semiconductor devices |
| 02/11/2009 | CN100461402C Circuit device and method for manufacturing same |
| 02/11/2009 | CN100461400C Static protection device suitable for programmable element |
| 02/11/2009 | CN100461399C Electrostatic-discharging protective component structure |
| 02/11/2009 | CN100461398C Semiconductor package with crossing conductor assembly and method of manufacture |
| 02/11/2009 | CN100461397C Semiconductor device having a wire bond pad and method therefor |
| 02/11/2009 | CN100461396C Semiconductor device and method of manufacturing the same |
| 02/11/2009 | CN100461395C Integrated circuit element and method for forming same |
| 02/11/2009 | CN100461394C Multiprocessor chip with bidirectional ring interconnection |
| 02/11/2009 | CN100461393C Method and structure for combining copper with metal-insulator-metal capacitor |
| 02/11/2009 | CN100461392C 半导体封装 The semiconductor package |
| 02/11/2009 | CN100461391C Semiconductor device |
| 02/11/2009 | CN100461390C Flip chip semiconductor package device and manufacturing method thereof |
| 02/11/2009 | CN100461389C Planar pad design and production method |
| 02/11/2009 | CN100461388C Electronic power module comprising a rubber seal and corresponding production method |
| 02/11/2009 | CN100461387C LED pixel module set casing with heat dissipating function |
| 02/11/2009 | CN100461385C Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device |
| 02/11/2009 | CN100461384C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 02/11/2009 | CN100461383C 多层印刷线路板 Multilayer printed circuit boards |
| 02/11/2009 | CN100461382C Package for integrated circuit lead |
| 02/11/2009 | CN100461381C Semiconductor wafer |
| 02/11/2009 | CN100461380C Solid-state imaging device and method for manufacturing the same |
| 02/11/2009 | CN100461379C Picture element structure of liquid crystal display and producing method thereof |
| 02/11/2009 | CN100461357C Through electrode and method for forming the same |
| 02/11/2009 | CN100461356C Semiconductor component with at least one semiconductor chip on base chip serving as substrate and method for production thereof |
| 02/11/2009 | CN100461355C Flexible contact-connection device |
| 02/11/2009 | CN100461353C Method for manufacturing hybrid integrated circuit device |
| 02/11/2009 | CN100461352C Interconnect structures and forming method thereof |
| 02/11/2009 | CN100461000C Method for forming metal pattern with low resistivity |
| 02/11/2009 | CN100460361C Multi-layer ceramic substrate and manufacturing method thereof |
| 02/10/2009 | US7489524 Assembly including vertical and horizontal joined circuit panels |
| 02/10/2009 | US7489521 Multilayer printed wiring board |
| 02/10/2009 | US7489518 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 02/10/2009 | US7489517 Die down semiconductor package |
| 02/10/2009 | US7489044 Semiconductor package and fabrication method thereof |
| 02/10/2009 | US7489043 Semiconductor chip package and fabrication method thereof |
| 02/10/2009 | US7489041 Copper interconnect |
| 02/10/2009 | US7489040 Interconnection structure of semiconductor device |
| 02/10/2009 | US7489039 Metal fill region of a semiconductor chip |
| 02/10/2009 | US7489038 Design of BEOL patterns to reduce the stresses on structures below chip bondpads |
| 02/10/2009 | US7489037 Semiconductor device and fabrication method thereof |
| 02/10/2009 | US7489036 Thin-film device |
| 02/10/2009 | US7489035 Integrated circuit chip package having a ring-shaped silicon decoupling capacitor |
| 02/10/2009 | US7489034 Integrated circuit cooling system and method |
| 02/10/2009 | US7489033 Electronic assembly with hot spot cooling |
| 02/10/2009 | US7489032 Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same |
| 02/10/2009 | US7489031 High power radiation emitter device and heat dissipating package for electronic components |
| 02/10/2009 | US7489030 Stacked semiconductor device |
| 02/10/2009 | US7489029 Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device |
| 02/10/2009 | US7489028 Die package |
| 02/10/2009 | US7489027 Accessible electronic storage apparatus |