| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/12/2009 | US20090039502 Heatsink and semiconductor device with heatsink |
| 02/12/2009 | US20090039501 Integrated circuit with galvanically bonded heat sink |
| 02/12/2009 | US20090039500 Semiconductor package |
| 02/12/2009 | US20090039499 Heat Sink with Thermally Compliant Beams |
| 02/12/2009 | US20090039498 Power semiconductor module |
| 02/12/2009 | US20090039497 Semiconductor device package having a back side protective scheme |
| 02/12/2009 | US20090039496 Method for fabricating a semiconductor and semiconductor package |
| 02/12/2009 | US20090039495 Wiring substrate and display device including the same |
| 02/12/2009 | US20090039494 Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it |
| 02/12/2009 | US20090039493 Packaging substrate and application thereof |
| 02/12/2009 | US20090039492 Stacked memory device |
| 02/12/2009 | US20090039491 Semiconductor package having buried post in encapsulant and method of manufacturing the same |
| 02/12/2009 | US20090039490 Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpage |
| 02/12/2009 | US20090039489 method of producing optical mems |
| 02/12/2009 | US20090039488 Semiconductor package and method for fabricating the same |
| 02/12/2009 | US20090039487 Semiconductor device |
| 02/12/2009 | US20090039486 Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member |
| 02/12/2009 | US20090039485 Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader |
| 02/12/2009 | US20090039484 Semiconductor device with semiconductor chip and method for producing it |
| 02/12/2009 | US20090039483 Heat slug and semiconductor package |
| 02/12/2009 | US20090039482 Package Including a Microprocessor & Fourth Level Cache |
| 02/12/2009 | US20090039481 Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same |
| 02/12/2009 | US20090039480 Semiconductor device and methods of forming the same |
| 02/12/2009 | US20090039479 Module for integrating peripheral circuit and a manufacturing method thereof |
| 02/12/2009 | US20090039475 Apparatus and Method for Manufacturing Semiconductor |
| 02/12/2009 | US20090039474 Formation Method of Porous Insulating Film, Manufacturing Apparatus of Semiconductor Device, Manufacturing Method of Semiconductor Device, and Semiconductor Device |
| 02/12/2009 | US20090039472 Structure and method for creating reliable deep via connections in a silicon carrier |
| 02/12/2009 | US20090039471 Semiconductor device |
| 02/12/2009 | US20090039470 Stress relief of a semiconductor device |
| 02/12/2009 | US20090039464 Semiconductor device |
| 02/12/2009 | US20090039463 Fuse box and method for fabricating the same and method for repairing the same in semiconductor device |
| 02/12/2009 | US20090039451 Method for manufacturing a magnetic memory device and magnetic memory device |
| 02/12/2009 | US20090039409 Semiconductor memory device including multi-layer gate structure |
| 02/12/2009 | US20090039397 Image sensor structure |
| 02/12/2009 | US20090039348 Multiple testing bars for testing liquid crystal display and method thereof |
| 02/12/2009 | US20090039347 Programming a microchip id register |
| 02/12/2009 | US20090039275 Processing method, manufacturing method of semiconductor device, and processing apparatus |
| 02/12/2009 | US20090038997 Method for sorting integrated circuit devices |
| 02/12/2009 | US20090038843 Functional element-mounted module and a method for producing the same |
| 02/12/2009 | US20090038781 Heat Exchange System |
| 02/12/2009 | US20090038154 Thermal spreader using thermal conduits |
| 02/12/2009 | US20090038153 Thermal spreader using thermal conduits |
| 02/12/2009 | DE4129647B4 Vorderseiten-Metallisierung zum Drahtbonden für ein III-V Halbleiterbauelement und Verfahren Front-side metallization for wire bonding on a III-V semiconductor device and method |
| 02/12/2009 | DE202008015294U1 Substrat mit einem Loch mit einer Metallsilizidschicht Substrate with a hole with a metal silicide |
| 02/12/2009 | DE112007000829T5 Kühler Cooler |
| 02/12/2009 | DE112006003809T5 Zusammengesetztes Substrat und Verfahren zum Herstellen eines zusammengesetzten Substrats A composite substrate and method of manufacturing a composite substrate |
| 02/12/2009 | DE10349908C5 Verfahren zur Herstellung eines zweifach passivierten Leistungshalbleiterbauelements mit einer MESA Randstruktur A process for producing a double-passivated power semiconductor device having a mesa edge structure |
| 02/12/2009 | DE10335813B4 IC-Chip mit Nanowires IC chip with nanowires |
| 02/12/2009 | DE102008036561A1 Semiconductor device for use with system, has isolating body, semiconductor chip with active surface and back side that is opposite to active surface, where semiconductor chip is arranged in isolating body |
| 02/12/2009 | DE102008021672A1 Gatesteuerung für ein Halbleiterbauelement mit großem Bandabstand Gate control for a semiconductor device with a large bandgap |
| 02/12/2009 | DE102007037841A1 Support module i.e. sensor support module, has module housing provided with contact surface, and support element connected with module housing by adhesive layer that exhibits anisotropic electrical conductivity |
| 02/12/2009 | DE102007037538A1 Baugruppe sowie Herstellung einer Baugruppe Assembly and manufacture of an assembly |
| 02/12/2009 | DE102007036841A1 Semiconductor component comprises a semiconductor chip with contacts on its upper side, external contacts, connecting elements arranged together on a single-piece structural element, and a chip carrier having an upper side and a backside |
| 02/11/2009 | EP2023415A2 LED package |
| 02/11/2009 | EP2023413A1 Electronic component and method for manufacturing same |
| 02/11/2009 | EP2023390A1 Semiconductor device |
| 02/11/2009 | EP2023389A2 Integrated heat sink for semiconductor modules |
| 02/11/2009 | EP2023388A2 Semiconductor package |
| 02/11/2009 | EP2023387A1 Semiconductor device, electronic parts module, and method for manufacturing the semiconductor device |
| 02/11/2009 | EP2023384A1 Electronic component, semiconductor package and electronic device |
| 02/11/2009 | EP2022758A1 Ceramic powder and method of using the same |
| 02/11/2009 | EP2022432A2 Electrosurgical systems and printed circuit boards for use therewith |
| 02/11/2009 | EP2022302A1 Temperature managing for electronic components |
| 02/11/2009 | EP2022092A1 Adjustable on-chip sub-capacitor design |
| 02/11/2009 | EP2022090A1 Dual wired integrated circuit chips |
| 02/11/2009 | EP2021848A1 Optically-enabled integrated circuit package |
| 02/11/2009 | EP2021682A1 Work light |
| 02/11/2009 | EP1803154A4 Wireless chip |
| 02/11/2009 | EP1620497B1 Object with a stratified composite material |
| 02/11/2009 | CN201194463Y Heat radiator |
| 02/11/2009 | CN201194462Y Heat radiator for acoustics |
| 02/11/2009 | CN201194461Y Heat radiator |
| 02/11/2009 | CN201194460Y Heat radiator |
| 02/11/2009 | CN201194459Y Novel enclosed machine box |
| 02/11/2009 | CN201194229Y Semiconductor package for integrated antenna |
| 02/11/2009 | CN201194228Y Lead frame construction for surface pasting type double diode package |
| 02/11/2009 | CN201194227Y Rectifying diode |
| 02/11/2009 | CN201194226Y Highly reliable diode device applying lead wire pre-welding construction |
| 02/11/2009 | CN201194225Y Package construction for micro semiconductor diode and transistor |
| 02/11/2009 | CN201194224Y Micro diode pin construction |
| 02/11/2009 | CN201194223Y Cyclic vacuum CPU heat radiating device |
| 02/11/2009 | CN201193813Y Heat pipe radiator, high-power LED street lamp, factory building lamp and tunnel lamp |
| 02/11/2009 | CN201193812Y High-power LED illumination lamp with air cooling device |
| 02/11/2009 | CN201193800Y LED car lamp core and additive heat radiating device thereof |
| 02/11/2009 | CN101366117A Chip on lead frame for small package speed sensor |
| 02/11/2009 | CN101366116A Dual-damascene process to fabricate thick wire structure |
| 02/11/2009 | CN101366115A On-chip interconnect-stack cooling using sacrificial interconnect segments |
| 02/11/2009 | CN101365650A Bulk assembly of oriented carbon nanotube, method of manufacturing the same and application thereof |
| 02/11/2009 | CN101365328A Heatsink and semiconductor device with heatsink |
| 02/11/2009 | CN101365321A Locking device |
| 02/11/2009 | CN101365320A Heat radiating assembly |
| 02/11/2009 | CN101365319A Heat radiating assembly |
| 02/11/2009 | CN101365318A Heat radiating assembly |
| 02/11/2009 | CN101365317A Fixing construction and heat radiating device |
| 02/11/2009 | CN101365316A Heat Radiating device |
| 02/11/2009 | CN101365314A Heat radiating device and fan fixing rack thereof |
| 02/11/2009 | CN101365293A Electromagnetic bandgap structure and printed curcuit board |
| 02/11/2009 | CN101364629A Semiconductor light emitting apparatus |
| 02/11/2009 | CN101364622A High-power LED encapsulation construction |
| 02/11/2009 | CN101364609A Light emitting display device and method of fabricating the same |