| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/18/2009 | CN100463127C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 02/18/2009 | CN100463125C Lead frame routed chip pads for semiconductor packages and manufacturing method thereof |
| 02/18/2009 | CN100463018C Active matrix substrate, display device, and pixel defect correcting method |
| 02/18/2009 | CN100462840C Cover structure with air-vent |
| 02/18/2009 | CN100462823C Thin film transistor and electronic device and producing method thereof |
| 02/18/2009 | CN100462730C Integrated module with delayed components and method for setting signal, time and position therein |
| 02/18/2009 | CN100462402C Epoxy resin composition for semiconductor encapsulation, semiconductor device, and process for producing semiconductor device |
| 02/18/2009 | CN100462401C Epoxy resin molding material for sealing and semiconductor device |
| 02/17/2009 | US7492599 Heat sink for LED lamp |
| 02/17/2009 | US7492598 Heatsink attachment mechanism |
| 02/17/2009 | US7492049 Multi-layer registration and dimensional test mark for scatterometrical measurement |
| 02/17/2009 | US7492047 Semiconductor device and its manufacture method |
| 02/17/2009 | US7492046 Electric fuses using CNTs (carbon nanotubes) |
| 02/17/2009 | US7492045 Semiconductor module, method for manufacturing semiconductor modules and mobile device |
| 02/17/2009 | US7492044 System and method for decreasing stress on solder holding BGA module to computer motherboard |
| 02/17/2009 | US7492043 Power module flip chip package |
| 02/17/2009 | US7492042 Integrated circuit cooling and insulating device and method |
| 02/17/2009 | US7492041 Diamond-silicon hybrid integrated heat spreader |
| 02/17/2009 | US7492040 Glass lid, and package provided with such a lid, for the encapsulation of electronic components |
| 02/17/2009 | US7492039 Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads |
| 02/17/2009 | US7492038 Semiconductor device |
| 02/17/2009 | US7492037 Package structure and lead frame using the same |
| 02/17/2009 | US7492036 Semiconductor chip and semiconductor device including the same |
| 02/17/2009 | US7492032 Fuse regions of a semiconductor memory device and methods of fabricating the same |
| 02/17/2009 | US7492030 Techniques to create low K ILD forming voids between metal lines |
| 02/17/2009 | US7492020 Micro structure with interlock configuration |
| 02/17/2009 | US7492016 Protection against charging damage in hybrid orientation transistors |
| 02/17/2009 | US7492012 Light emitting device and method of manufacturing the same |
| 02/17/2009 | US7492011 Semiconductor device and manufacturing method of semiconductor device |
| 02/17/2009 | US7492009 Semiconductor device having silicon on insulator structure and method of fabricating the same |
| 02/17/2009 | US7492006 Semiconductor transistors having surface insulation layers and methods of fabricating such transistors |
| 02/17/2009 | US7491986 Semiconductor integrated circuit device |
| 02/17/2009 | US7491970 IC with comparator receiving expected and mask data from pads |
| 02/17/2009 | US7491895 Wiring substrate and method of fabricating the same |
| 02/17/2009 | US7491894 Hybrid integrated circuit device |
| 02/17/2009 | US7491774 reacting a phenol compound and epihalohydrin, then purifying and pulverizing to obtain particles exhibiting excellent fluidity during molding because of its low melt viscosity and allows easy handling because it hardly causes blocking during storage and transportation and also relates to a package |
| 02/17/2009 | US7491642 Electrical passivation of silicon-containing surfaces using organic layers |
| 02/17/2009 | US7491622 Process of forming an electronic device including a layer formed using an inductively coupled plasma |
| 02/17/2009 | US7491620 Method and structures for indexing dice |
| 02/17/2009 | US7491588 Method and structure for buried circuits and devices |
| 02/17/2009 | US7491585 Electrical fuse and method of making |
| 02/17/2009 | US7491572 Method for fabricating an image sensor mounted by mass reflow |
| 02/17/2009 | US7491570 Die package having an adhesive flow restriction area |
| 02/17/2009 | US7491427 Polyimidesiloxane solution composition |
| 02/17/2009 | US7490402 Technique for laminating multiple substrates |
| 02/12/2009 | WO2009021184A2 Methods and apparatus to support an overhanging region of a stacked die |
| 02/12/2009 | WO2009021091A1 Corrugated interfaces for multilayered interconnects |
| 02/12/2009 | WO2009020911A1 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners |
| 02/12/2009 | WO2009020755A2 Intermetallic conductors |
| 02/12/2009 | WO2009020713A1 Stress relief of a semiconductor device |
| 02/12/2009 | WO2009020253A1 Heat-resistant adhesive sheet |
| 02/12/2009 | WO2009020241A1 Semiconductor device and manufacturing method thereof |
| 02/12/2009 | WO2009020169A1 Method for producing wiring board and wiring board |
| 02/12/2009 | WO2009020124A1 Ic mounting substrate and method for manufacturing the same |
| 02/12/2009 | WO2009020061A1 High efficiency module |
| 02/12/2009 | WO2009019931A1 Sealing material for optical component and light-emitting device |
| 02/12/2009 | WO2009019827A1 Semiconductor device and manufacturing method thereof |
| 02/12/2009 | WO2009019190A1 Spring contact-connection of electrical contact areas of an electronic component |
| 02/12/2009 | WO2009019091A1 Unit and production of a unit |
| 02/12/2009 | WO2009019063A1 Electromigration resistant interconnect structure |
| 02/12/2009 | WO2009002381A3 Mold compound circuit structure for enhanced electrical and thermal performance |
| 02/12/2009 | WO2009000106A1 Led lighting device |
| 02/12/2009 | WO2008150898A3 Electronic assemblies without solder and methods for their manufacture |
| 02/12/2009 | WO2008135142A4 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 02/12/2009 | US20090044162 Semiconductor integrated circuit device and fabrication method thereof |
| 02/12/2009 | US20090043029 Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts |
| 02/12/2009 | US20090042386 Semiconductor device using metal nitride as insulating film and its manufacture method |
| 02/12/2009 | US20090042355 Semiconductor wafer and manufacturing method therefor |
| 02/12/2009 | US20090042338 Capping Coating for 3D Integration Applications |
| 02/12/2009 | US20090039533 Adhesion structure for a package apparatus |
| 02/12/2009 | US20090039532 Semiconductor device package having a back side protective scheme |
| 02/12/2009 | US20090039531 Flip-chip package covered with tape |
| 02/12/2009 | US20090039530 Near chip scale package integration process |
| 02/12/2009 | US20090039529 Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package |
| 02/12/2009 | US20090039528 Wafer level stacked packages with individual chip selection |
| 02/12/2009 | US20090039527 Sensor-type package and method for fabricating the same |
| 02/12/2009 | US20090039526 Package and the method for making the same, and a stacked package |
| 02/12/2009 | US20090039525 Method of Welding Together at Least Two Stacked Members |
| 02/12/2009 | US20090039524 Methods and apparatus to support an overhanging region of a stacked die |
| 02/12/2009 | US20090039523 Packaged integrated circuit devices with through-body conductive vias, and methods of making same |
| 02/12/2009 | US20090039522 Bipolar and cmos integration with reduced contact height |
| 02/12/2009 | US20090039521 Semiconductor structure and semiconductor manufacturing method |
| 02/12/2009 | US20090039520 Semiconductor circuit device, wiring method for semiconductor circuit device and data processing system |
| 02/12/2009 | US20090039519 Semiconductor device, photomask, semiconductor device production method, and pattern layout method |
| 02/12/2009 | US20090039518 Method for forming a damascene structure |
| 02/12/2009 | US20090039517 Chemical vapor deposition of titanium |
| 02/12/2009 | US20090039516 Power semiconductor component with metal contact layer and production method therefor |
| 02/12/2009 | US20090039515 Ionizing radiation blocking in ic chip to reduce soft errors |
| 02/12/2009 | US20090039514 Semiconductor device and method for manufacturing the same |
| 02/12/2009 | US20090039513 Contacting Method for Semiconductor Material and Semiconductor Device |
| 02/12/2009 | US20090039512 Electromigration resistant interconnect structure |
| 02/12/2009 | US20090039511 Semiconductor device and method for fabricating the same |
| 02/12/2009 | US20090039510 Semiconductor device and manufacturing method thereof |
| 02/12/2009 | US20090039509 Semiconductor device and method of manufacturing the same |
| 02/12/2009 | US20090039508 Larger than die size wafer-level redistribution packaging process |
| 02/12/2009 | US20090039507 Electronic Element, Electronic Element Device Using the Same, and Manufacturing Method Thereof |
| 02/12/2009 | US20090039506 Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof |
| 02/12/2009 | US20090039505 Thermally insulating bonding pad structure for solder reflow connection |
| 02/12/2009 | US20090039504 Semiconductor device |
| 02/12/2009 | US20090039503 Semiconductor device |