| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/18/2009 | CN201196956Y Heat radiating device used for LED |
| 02/18/2009 | CN201196953Y Direct packaging type camera module group |
| 02/18/2009 | CN201196952Y Multi-work LED |
| 02/18/2009 | CN201196951Y Heat radiating device with adjustable height |
| 02/18/2009 | CN201196404Y Radiating structure of LED |
| 02/18/2009 | CN201196403Y LED illumination universal light source body with cooling design |
| 02/18/2009 | CN201196402Y Luminous source with thermal conduction equipment |
| 02/18/2009 | CN201196401Y Radiator with enlarged lighting device angle |
| 02/18/2009 | CN201196400Y Cooling structure for LED lighting device |
| 02/18/2009 | CN201196399Y Stamping and fastening structure of annular heat radiating device |
| 02/18/2009 | CN201196398Y High-efficiency energy-saving LED bulb |
| 02/18/2009 | CN201196386Y High power LED lamp |
| 02/18/2009 | CN201196383Y Tubular high power LED lamp |
| 02/18/2009 | CN201196362Y Diode lamp |
| 02/18/2009 | CN201196353Y Combination structure of luminous units |
| 02/18/2009 | CN101371358A Package for a light emitting diode with integrated electrostatic discharge protection |
| 02/18/2009 | CN101371357A Stress buffering package for a semiconductor component |
| 02/18/2009 | CN101371356A Quasi-radial heatsink with rectangular form factor and uniform fin length |
| 02/18/2009 | CN101371355A Interposer and electronic device using the same |
| 02/18/2009 | CN101371354A Flip-attached and underfilled stacked semiconductor devices |
| 02/18/2009 | CN101371353A Electronic device package, module and electronic device |
| 02/18/2009 | CN101371352A Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
| 02/18/2009 | CN101371345A Semiconductor device for high frequency |
| 02/18/2009 | CN101371344A 场效应晶体管 FET |
| 02/18/2009 | CN101370870A Epoxy resin molding material for sealing and electronic component device |
| 02/18/2009 | CN101370372A Radiating device |
| 02/18/2009 | CN101370371A Heat radiation model set and radiator used for the same |
| 02/18/2009 | CN101370370A Heat radiation model set and its fin group |
| 02/18/2009 | CN101370353A Circuit board with conductive paste |
| 02/18/2009 | CN101370352A Printed circuit board and its production method, and a ball grid array bonding pad pattern |
| 02/18/2009 | CN101369625A Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same |
| 02/18/2009 | CN101369624A Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same |
| 02/18/2009 | CN101369617A LED device with high cooling property |
| 02/18/2009 | CN101369606A Thin-film transistor panel having structure that suppresses characteristic shifts and method for manufacturing the same |
| 02/18/2009 | CN101369592A Image sensor |
| 02/18/2009 | CN101369591A Image sensing element packaging body and preparation thereof |
| 02/18/2009 | CN101369590A Pixel structure |
| 02/18/2009 | CN101369589A Array substrate of thin-film transistor |
| 02/18/2009 | CN101369586A Active element array substrate |
| 02/18/2009 | CN101369585A NOR flash memory device and method for fabricating the same |
| 02/18/2009 | CN101369582A Vertical non-volatile memory and manufacturing method thereof |
| 02/18/2009 | CN101369579A Method to prevent static destruction of an active element comprised in a liquid crystal display device |
| 02/18/2009 | CN101369576A Symmetrical MIM capacitor |
| 02/18/2009 | CN101369575A Sheet type diode and preparation method thereof |
| 02/18/2009 | CN101369573A Perforation structure of chip-level electronic package |
| 02/18/2009 | CN101369572A Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same |
| 02/18/2009 | CN101369571A Semiconductor device, wafer coarse alignment mark and coarse alignment method |
| 02/18/2009 | CN101369570A Wire lead frame, semiconductor device and method for manufacturing the wire lead frame |
| 02/18/2009 | CN101369569A 载体衬底和集成电路 Carrier substrate and integrated circuit |
| 02/18/2009 | CN101369568A Packaging structure, packaging method and photosensitive device |
| 02/18/2009 | CN101369567A Packaging structure for forming array with wire frame |
| 02/18/2009 | CN101369566A Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 02/18/2009 | CN101369565A Electronic apparatus |
| 02/18/2009 | CN101369564A Semi-conductor device |
| 02/18/2009 | CN101369563A Semi-conductor element and method of producing a metal semi-conductor contact |
| 02/18/2009 | CN101369562A Plate-type heat-pipe radiator and use thereof |
| 02/18/2009 | CN101369561A Semiconductor chip package, electronic device and methods of fabricating the electronic device |
| 02/18/2009 | CN101369560A Packed electronic element |
| 02/18/2009 | CN101369559A Semiconductor packaging construction with weld crack restraint ring |
| 02/18/2009 | CN101369552A Protection method for shallow plough groove isolation structure and protection layer using the same |
| 02/18/2009 | CN101369547A Method for manufacturing semiconductor device |
| 02/18/2009 | CN101369543A Image sensor package and method for forming the same |
| 02/18/2009 | CN101369542A Wiring board and manufacturing method therefor, and semiconductor device and manufacturing method therefor |
| 02/18/2009 | CN101368716A Cooling structure for street lamp using light emitting diode |
| 02/18/2009 | CN100463587C Method for forming bump on electrode pad with use of double-layered film |
| 02/18/2009 | CN100463239C Light emitted semiconductor assembly package structure and producing method thereof |
| 02/18/2009 | CN100463228C 化合物半导体装置及其制造方法 The compound semiconductor device and manufacturing method |
| 02/18/2009 | CN100463224C Thin-film semiconductor substrate, method of manufacturing the thin-film semiconductor substrate,thin-film semiconductor device, and method of manufacturing the thin-film semiconductor device |
| 02/18/2009 | CN100463207C Flat panel display device |
| 02/18/2009 | CN100463206C Solid imaging device |
| 02/18/2009 | CN100463203C Method for forming semiconductor structure |
| 02/18/2009 | CN100463193C TFT array structure and its producing method |
| 02/18/2009 | CN100463185C Dynamic random access memory, and manufacturing method |
| 02/18/2009 | CN100463175C ESD protection device in high voltage and manufacturing method for the same |
| 02/18/2009 | CN100463173C 半导体器件 Semiconductor devices |
| 02/18/2009 | CN100463171C Optical semiconductor device and method for manufacturing the same, electronic device, |
| 02/18/2009 | CN100463169C Mixed integrated circuit device and its manufacturing method |
| 02/18/2009 | CN100463167C Semiconductor package and method for forming the same |
| 02/18/2009 | CN100463166C A chip |
| 02/18/2009 | CN100463165C Fuse of a semiconductor memory device and repair process for the same |
| 02/18/2009 | CN100463164C Semiconductor structure and its forming method |
| 02/18/2009 | CN100463163C Semiconductor device |
| 02/18/2009 | CN100463162C Semiconductor structure and method for manufacturing the same |
| 02/18/2009 | CN100463161C Semiconductor device |
| 02/18/2009 | CN100463160C Dual damascene wiring and method |
| 02/18/2009 | CN100463159C Mounting structure of electronic component |
| 02/18/2009 | CN100463158C Thin-film flip-chip packaging construction and multilayer circuit rewinding structure |
| 02/18/2009 | CN100463157C Encapsulation structure for preventing adhesive crystal glue from polluting wafer welding cushion and substrate thereof |
| 02/18/2009 | CN100463156C Chip packaging structure and manufacturing method therefor |
| 02/18/2009 | CN100463155C Electronic device for the embedded semiconductor encapsulation part |
| 02/18/2009 | CN100463154C Bond pad structure and making method thereof |
| 02/18/2009 | CN100463153C Device with circuit bonding pad and method of manufacturing the same |
| 02/18/2009 | CN100463152C Method for making a direct chip attach device and structure |
| 02/18/2009 | CN100463151C Heat exchanger for liquid cooling |
| 02/18/2009 | CN100463150C Heat sink device |
| 02/18/2009 | CN100463149C Processor heat sink retention module and assembly |
| 02/18/2009 | CN100463148C Heat radiator |
| 02/18/2009 | CN100463147C Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device |
| 02/18/2009 | CN100463132C Chip packaging structure and manufacturing method therefor |
| 02/18/2009 | CN100463128C Semiconductor chip buried base plate 3D construction and its manufacturing method |