| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/19/2009 | WO2009002728A3 Land grid array (lga) socket loading mechanism for mobile platforms |
| 02/19/2009 | WO2009002392A3 Rf transistor packages with internal stability network and methods of forming rf transistor packages with internal stability networks |
| 02/19/2009 | WO2009002387A3 Rf power transistor packages with internal harmonic frequency reduction and methods of forming rf power transistor packages with internal harmonic frequency reduction |
| 02/19/2009 | WO2008154582A3 Semiconductor die coating and interconnection fixture and method |
| 02/19/2009 | WO2008154580A3 Method for optimized integrated circuit chip interconnection |
| 02/19/2009 | WO2008119309A3 Heat sink, and assembly or module unit comprising a heat sink |
| 02/19/2009 | US20090049420 Dummy pattern placement apparatus, method and program and semiconductor device |
| 02/19/2009 | US20090046184 Image sensor |
| 02/19/2009 | US20090045530 Microelectronic lithographic alignment using high contrast alignment mark |
| 02/19/2009 | US20090045529 Method of manufacturing semiconductor device |
| 02/19/2009 | US20090045528 Semiconductor device |
| 02/19/2009 | US20090045527 Multi-substrate region-based package and method for fabricating the same |
| 02/19/2009 | US20090045526 Stacked memory without unbalanced temperature distributions |
| 02/19/2009 | US20090045525 Semiconductor element and semiconductor device |
| 02/19/2009 | US20090045524 Microelectronic package |
| 02/19/2009 | US20090045523 Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
| 02/19/2009 | US20090045522 Semiconductor device having via connecting between interconnects |
| 02/19/2009 | US20090045521 Semiconductor device |
| 02/19/2009 | US20090045520 IC Device having Compact Design |
| 02/19/2009 | US20090045519 Semiconductor Device and Method of Producing the Same |
| 02/19/2009 | US20090045518 Semiconductor device and method for fabricating the same |
| 02/19/2009 | US20090045517 Method for forming tungsten film, film-forming apparatus, storage medium and semiconductor device |
| 02/19/2009 | US20090045516 TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC's |
| 02/19/2009 | US20090045515 Monitoring the magnetic properties of a metal layer during the manufacture of semiconductor devices |
| 02/19/2009 | US20090045514 Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming |
| 02/19/2009 | US20090045513 Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device |
| 02/19/2009 | US20090045512 Carrier substrate and integrated circuit |
| 02/19/2009 | US20090045511 Integrated circuit including parylene material layer |
| 02/19/2009 | US20090045510 Semiconductor device and method for mounting semiconductor chip |
| 02/19/2009 | US20090045509 Electronic device |
| 02/19/2009 | US20090045508 Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package |
| 02/19/2009 | US20090045507 Flip chip interconnection |
| 02/19/2009 | US20090045506 power module comprising semiconductor device and heat spreader to be mounted in automobiles; Insulated Gate Bipolar Transistors |
| 02/19/2009 | US20090045505 Electronic device with package module |
| 02/19/2009 | US20090045504 Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 02/19/2009 | US20090045503 Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods |
| 02/19/2009 | US20090045502 Chip scale package with through-vias that are selectively isolated or connected to the substrate |
| 02/19/2009 | US20090045501 Structure on chip package to substantially match stiffness of chip |
| 02/19/2009 | US20090045500 Power semiconductor module with a connected substrate carrier and production method therefor |
| 02/19/2009 | US20090045499 Semiconductor package having a plurality input/output members |
| 02/19/2009 | US20090045498 Partitioning of electronic packages |
| 02/19/2009 | US20090045497 Semiconductor device and method of manufacturing the same |
| 02/19/2009 | US20090045496 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices |
| 02/19/2009 | US20090045495 Semiconductor device with side terminals |
| 02/19/2009 | US20090045494 Method for manufacturing a microelectronic package |
| 02/19/2009 | US20090045493 Semiconductor component and method of producing |
| 02/19/2009 | US20090045492 Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device |
| 02/19/2009 | US20090045491 Semiconductor package structure and leadframe thereof |
| 02/19/2009 | US20090045490 Power semiconductor module |
| 02/19/2009 | US20090045489 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods |
| 02/19/2009 | US20090045488 Magnetic shielding package structure of a magnetic memory device |
| 02/19/2009 | US20090045487 Semiconductor chip, method of fabricating the same and stacked package having the same |
| 02/19/2009 | US20090045484 Methods and systems involving electrically reprogrammable fuses |
| 02/19/2009 | US20090045483 Semiconductor devices having trench isolation regions and methods of manufacturing semiconductor devices having trench isolation regions |
| 02/19/2009 | US20090045481 Semiconductor device having breakdown voltage maintaining structure and its manufacturing method |
| 02/19/2009 | US20090045464 ESD protection for high voltage applications |
| 02/19/2009 | US20090045463 Active device array substrate |
| 02/19/2009 | US20090045446 Power semiconductor device |
| 02/19/2009 | US20090045444 Integrated device and circuit system |
| 02/19/2009 | US20090045432 Circuit board for light emitting device package and light emitting unit using the same |
| 02/19/2009 | US20090045403 Contact structure and semiconductor device |
| 02/19/2009 | US20090045400 Method for monitoring fuse integrity in a semiconductor die and related structure |
| 02/19/2009 | US20090044858 Method of Manufacture of Semiconductor Device and Conductive Compositions Used Therein |
| 02/19/2009 | US20090044405 Interposer with Electrical Contact Button and Method |
| 02/19/2009 | DE202008000388U1 Vorrichtung zum Erzeugen einer Einhausung wenigstens eines elektronischen Bauelements An apparatus for generating an enclosure of at least one electronic component |
| 02/19/2009 | DE112006003771T5 Auf Chipebene integrierte passive Hochfrequenzelemente, Verfahren zu ihrer Herstellung und Systeme, die diese enthalten At the chip level built-in passive radio frequency elements, to processes for their preparation and to systems incorporating these |
| 02/19/2009 | DE10214068B4 ESD-Schutzschaltung für Radiofrequenz-Ausgangsanschlüsse in einer integrierten Schaltung ESD protection circuit for the radio frequency output ports in an integrated circuit |
| 02/19/2009 | DE102008036285A1 Integrierte Schaltung mit galvanisch verbundenem Kühlkörper Integrated circuit with electrically Associated heatsink |
| 02/19/2009 | DE102008035252A1 Cooling device for cooling power semiconductor device e.g. insulated gate bipolar transistor (IGBT), has lower cavity and upper cavity having cross sectional area that decreases and increases in downstream direction respectively |
| 02/19/2009 | DE102008002909A1 Halbleiterbauelement-Einheit mit Pseudochip Semiconductor device unit with pseudo chip |
| 02/19/2009 | DE102007038911A1 Kühlvorrichtung und Beleuchtungseinrichtung Cooler and lighting equipment |
| 02/19/2009 | DE102007038909A1 Wärmeleitrohr und Anordnung mit Wärmeleitrohr Heat pipe and heat pipe arrangement with |
| 02/19/2009 | DE102007037297A1 Schaltungsträgeraufbau mit verbesserter Wärmeableitung Circuit carrier assembly with improved heat dissipation |
| 02/19/2009 | DE102007036566A1 Federkontaktierung von elektrischen Kontaktflächen eines elektronischen Bauteils Spring contact of the electrical contact areas of an electronic component |
| 02/19/2009 | DE102007015731B4 Verfahren zur Herstellung einer Halbleitervorrichtung, sowie hiermit hergestellte Halbleitervorrichtung A process for producing a semiconductor device, and semiconductor device produced therewith |
| 02/19/2009 | DE102006038980B4 Kühlkörper für Halbleiterbauelemente sowie Verfahren zu seiner Herstellung Heat sink for semiconductor devices and processes for its preparation |
| 02/19/2009 | DE102006023998B4 Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen Electronic circuitry and methods for producing such |
| 02/19/2009 | DE10014308B4 Vorrichtung zum gleichzeitigen Herstellen von mindestens vier Bondverbindungen und Verfahren dazu An apparatus for simultaneously producing at least four bonds and method thereof |
| 02/18/2009 | EP2026385A1 Method for manufacturing light receiving apparatus |
| 02/18/2009 | EP2026381A2 Fully integrated RF transceiver integrated circuit |
| 02/18/2009 | EP2026380A2 Method of manufacturing semiconductor device |
| 02/18/2009 | EP2026379A1 Multilayer ceramic electronic component and method for manufacturing same |
| 02/18/2009 | EP2026164A1 Thermal solution for electronic devices |
| 02/18/2009 | EP2025644A1 Ceramic powder and method of using the same |
| 02/18/2009 | EP2024998A1 Electronic package and method of preparing same |
| 02/18/2009 | EP2024997A2 Double-sided integrated circuit chips |
| 02/18/2009 | EP2024990A1 Method of increasing the quality factor of an inductor in a semiconductor device |
| 02/18/2009 | EP1882269B1 Apparatus for attenuating reflections of electromagnetic waves. method for its manufacture and its use |
| 02/18/2009 | EP1629532A4 Integrated heat spreader lid |
| 02/18/2009 | EP1448745B1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| 02/18/2009 | CN201197257Y Heat radiating device of far-end radio frequency module |
| 02/18/2009 | CN201197256Y Riveted radiator |
| 02/18/2009 | CN201197255Y Crossing sheet-insertion type radiator |
| 02/18/2009 | CN201197254Y Heat conduction structure of portable electronic apparatus |
| 02/18/2009 | CN201197253Y Radiating module of power supply |
| 02/18/2009 | CN201197252Y Fastener structure of radiator |
| 02/18/2009 | CN201197251Y Magnetofluid flat plate heat pipe soaking device |
| 02/18/2009 | CN201197250Y Water cooling radiator of high power electric power electronic component |
| 02/18/2009 | CN201197248Y Water cooling head |
| 02/18/2009 | CN201197247Y Cooling apparatus |