| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/25/2009 | CN100464435C LED and negative-light mould set therewith |
| 02/25/2009 | CN100464423C Memory part, its making method and operation method |
| 02/25/2009 | CN100464420C Variable inductor for integrated circuit and printed circuit board |
| 02/25/2009 | CN100464419C Laminated semiconductor device |
| 02/25/2009 | CN100464417C Semiconductor device with silicon-containing copper wiring layer and manufacturing method thereof |
| 02/25/2009 | CN100464416C Packing method for preventing elements in semiconductor plastic sealer from delaminating |
| 02/25/2009 | CN100464415C Non-pin packaging structure of semiconductor element and packaging technology thereof |
| 02/25/2009 | CN100464414C Soft soldering method for semiconductor components and semiconductor device |
| 02/25/2009 | CN100464413C Circuit and chip for inter-changing chip pin function |
| 02/25/2009 | CN100464412C Chip packaging structure |
| 02/25/2009 | CN100464411C Encapsulation method and structure of light emitting diode |
| 02/25/2009 | CN100464410C Thermal interfacial material and radiating device combination using the same thermal interfacial material |
| 02/25/2009 | CN100464408C Radiating apparatus |
| 02/25/2009 | CN100464407C Radiating module |
| 02/25/2009 | CN100464406C Package for electronic device and method for manufacturing electronic device |
| 02/25/2009 | CN100464405C Method and structure for packaging power module |
| 02/25/2009 | CN100464402C Method for manufacturing semiconductor device |
| 02/25/2009 | CN100464400C Semiconductor package stacking structure and its preparing method |
| 02/25/2009 | CN100464399C Lug process and wafer structure of protective detection welding pad |
| 02/25/2009 | CN100464398C Underfill and mold compounds including siloxane-based aromatic diamines |
| 02/25/2009 | CN100464236C Structure of semiconductor chip and display device using the same |
| 02/24/2009 | US7496878 Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package |
| 02/24/2009 | US7495928 Semiconductor device and printed circuit board |
| 02/24/2009 | US7495921 Fan bracket and heat dissipation apparatus incorporating the same |
| 02/24/2009 | US7495920 Heat dissipation device |
| 02/24/2009 | US7495918 Plasma display device |
| 02/24/2009 | US7495916 Low cost cold plate with film adhesive |
| 02/24/2009 | US7495526 Apparatus and method for reducing propagation delay in a conductor system selectable to carry a single signal or independent signals |
| 02/24/2009 | US7495348 Process for producing copy protection for an electronic circuit |
| 02/24/2009 | US7495346 Semiconductor package |
| 02/24/2009 | US7495345 Semiconductor device-composing substrate and semiconductor device |
| 02/24/2009 | US7495344 Semiconductor apparatus |
| 02/24/2009 | US7495343 Pad over active circuit system and method with frame support structure |
| 02/24/2009 | US7495342 Angled flying lead wire bonding process |
| 02/24/2009 | US7495341 Methods and apparatus for packaging integrated circuit devices |
| 02/24/2009 | US7495340 Metal layer structure of semiconductor device |
| 02/24/2009 | US7495339 Connection structure and method for fabricating the same |
| 02/24/2009 | US7495337 Dual-gate device and method |
| 02/24/2009 | US7495335 Method of reducing process steps in metal line protective structure formation |
| 02/24/2009 | US7495334 Stacking system and method |
| 02/24/2009 | US7495333 Seal cover structure comprising a nickel-tin (Ni—Sn) alloy barrier layer formed between a nickel (Ni) plating layer and a gold-tin (Au—Sn) brazing layer having Sn content of 20.65 to 25 WT % formed on the seal cover main body |
| 02/24/2009 | US7495332 Multilayer printed wiring board |
| 02/24/2009 | US7495331 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus |
| 02/24/2009 | US7495330 Substrate connector for integrated circuit devices |
| 02/24/2009 | US7495329 Semiconductor memory card |
| 02/24/2009 | US7495328 Micromechanical component |
| 02/24/2009 | US7495327 Chip stacking structure |
| 02/24/2009 | US7495326 Stacked electronic structures including offset substrates |
| 02/24/2009 | US7495325 Optical die-down quad flat non-leaded package |
| 02/24/2009 | US7495324 Power semiconductor module |
| 02/24/2009 | US7495323 Semiconductor package structure having multiple heat dissipation paths and method of manufacture |
| 02/24/2009 | US7495322 Light-emitting device |
| 02/24/2009 | US7495321 Leaded stacked packages having elevated die paddle |
| 02/24/2009 | US7495320 System and method for providing a power bus in a wirebond leadframe package |
| 02/24/2009 | US7495319 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same |
| 02/24/2009 | US7495318 Apparatus and method for improving AC coupling on circuit boards |
| 02/24/2009 | US7495317 Semiconductor package with ferrite shielding structure |
| 02/24/2009 | US7495315 Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
| 02/24/2009 | US7495310 Fuse-data reading circuit |
| 02/24/2009 | US7495309 Semiconductor device and manufacturing method thereof |
| 02/24/2009 | US7495304 Chip package |
| 02/24/2009 | US7495296 Semiconductor integrated circuit device |
| 02/24/2009 | US7495291 Strained dislocation-free channels for CMOS and method of manufacture |
| 02/24/2009 | US7495288 Semiconductor apparatus including a radiator for diffusing the heat generated therein |
| 02/24/2009 | US7495276 Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement |
| 02/24/2009 | US7495275 Semiconductor device and dram integrated circuit device |
| 02/24/2009 | US7495254 Test structure and method for detecting and studying crystal lattice dislocation defects in integrated circuit devices |
| 02/24/2009 | US7495183 Electronic circuit apparatus |
| 02/24/2009 | US7495179 Components with posts and pads |
| 02/24/2009 | US7494915 Back end interconnect with a shaped interface |
| 02/24/2009 | US7494909 Method of manufacturing a chip |
| 02/24/2009 | US7494908 Apparatus for integration of barrier layer and seed layer |
| 02/24/2009 | US7494867 Semiconductor device having MIM capacitive elements and manufacturing method for the same |
| 02/24/2009 | US7494854 Turn-on-efficient bipolar structures for on-chip ESD protection |
| 02/24/2009 | US7494848 Flip-chip packaging of a photo-sensor die on a transparent substrate |
| 02/24/2009 | US7494847 Method for making a semiconductor multi-package module having inverted wire bond carrier second package |
| 02/24/2009 | US7494845 Method of forming a thin wafer stack for a wafer level package |
| 02/24/2009 | US7494838 Manufacturing method for magnetic sensor and lead frame therefor |
| 02/24/2009 | US7494830 Method and device for wafer backside alignment overlay accuracy |
| 02/24/2009 | US7494825 Top contact alignment in semiconductor devices |
| 02/24/2009 | US7494712 Compressed composite; heating, pressurization, curing; electronic heater |
| 02/24/2009 | US7494635 Boron nitride agglomerated powder |
| 02/24/2009 | US7494607 electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein said glass frit is Pb-free; dispersed in (d) an organic medium |
| 02/24/2009 | US7493937 Heat sink mounting device |
| 02/19/2009 | WO2009023649A1 Packaged integrated circuits and methods to form a packaged integrated circuit |
| 02/19/2009 | WO2009023462A1 Semiconductor device and method for manufacturing thereof |
| 02/19/2009 | WO2009023284A2 Interconnection element with plated posts formed on mandrel |
| 02/19/2009 | WO2009023283A2 Interconnection element with posts formed by plating |
| 02/19/2009 | WO2009023051A1 Ceramic composite thin films |
| 02/19/2009 | WO2009022718A1 Interlayer insulation film and wiring structure, and their manufacturing method |
| 02/19/2009 | WO2009022583A1 Porous silica precursor composition and method for preparing the same, porous silica film and method for forming the same, semiconductor device, image display device, and liquid crystal display device |
| 02/19/2009 | WO2009022581A1 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus and storage medium |
| 02/19/2009 | WO2009022509A1 Mos transistor and semiconductor integrated circuit device using the same |
| 02/19/2009 | WO2009022503A1 Thin film capacitor, and display and memory cell employing the film capacitor, and mehtods for fabricating the thin film capacitor, the display and the memory cell |
| 02/19/2009 | WO2009022498A1 Electronic component manufacturing method |
| 02/19/2009 | WO2009022461A1 Circuit device, circuit device manufacturing method and portable device |
| 02/19/2009 | WO2009022441A1 Twin chip-mounted diode |
| 02/19/2009 | WO2009022438A1 Electrode and method for manufacturing the same, lead wiring using the electrode and method for connecting the same, and related electronic components and electronic equipment |
| 02/19/2009 | WO2009022252A2 Bond pad arrangement of an integrated circuit |
| 02/19/2009 | WO2009021633A1 Electrical device and drive |