Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/06/2014CN203760464U 一种通用预封装基板结构、封装结构 A universal pre-packaged substrate structure, package structure
08/06/2014CN203760463U 用于绑定集成电路芯片的柔性电路板和显示装置 The flexible circuit board and integrated circuit chips used to bind a display device
08/06/2014CN203760462U 指纹辨识芯片封装模块 Fingerprint chip package module
08/06/2014CN203760461U 引线框架版件 Leadframe edition pieces
08/06/2014CN203760460U 集成电路引线框架版 IC lead frame version
08/06/2014CN203760459U 大电流半导体器件结构 High current semiconductor device structure
08/06/2014CN203760458U 一种整流扁桥模块 One kind of flat bridge rectifier module
08/06/2014CN203760457U 一种语音芯片用打线图装置 A voice chip device with a wire diagram
08/06/2014CN203760456U 无引线球脚表贴式高密度厚膜混合集成电路 Leadless surface mount foot ball high density thick film hybrid integrated circuits
08/06/2014CN203760455U 功率驱动芯片及其封装组件 Power driver chip and package assembly
08/06/2014CN203760454U 一种叠层片式电子元器件 A laminated chip electronic components
08/06/2014CN203760453U 一种电子元器件液冷散热系统 An electronic component liquid cooling system
08/06/2014CN203760452U 适用于电动汽车逆变器的igbt模块 Suitable for electric vehicle inverter igbt module
08/06/2014CN203760451U 一种热沉块 A heat sink block
08/06/2014CN203760450U 一种散热器型材 Radiator profile
08/06/2014CN203760449U 一种容量为16M×16bit的立体封装NOR FLASH存储器 One kind of capacity is 16M × 16bit stereo package NOR FLASH memory
08/06/2014CN203759639U 计算机芯片散热装置 Computer chip cooling device
08/06/2014CN203754410U 电共轭流体微型泵 Electric conjugate fluid micropump
08/06/2014CN103975433A 具有集成电容器的电源转换器 Having integrated capacitor power converter
08/06/2014CN103975431A 微通道冷却器件、微通道冷却系统以及电子装置 Microchannel cooling devices, micro-channel cooling system and an electronic device
08/06/2014CN103975430A 半导体装置及车载用功率转换装置 Semiconductor device and in-vehicle power conversion apparatus for
08/06/2014CN103975429A 导热性片以及导热性片的制造方法 And a method of manufacturing a thermally conductive sheet thermal conductivity sheet
08/06/2014CN103975428A 具有增强型热管理的半导体裸片组合件、包含所述半导体裸片组合件的半导体装置及相关方法 Semiconductor die assembly having enhanced thermal management, comprising the semiconductor die assembly of the semiconductor device and related method
08/06/2014CN103975427A 互连衬底的功率管理应用 Power management applications interconnection substrate
08/06/2014CN103974992A 环氧树脂组合物、其固化物以及光半导体装置 Epoxy resin composition, cured product thereof and an optical semiconductor device
08/06/2014CN103974539A 集成电路贴片及其制造方法 IC placement and manufacturing method thereof
08/06/2014CN103973131A 半导体系统 Semiconductor Systems
08/06/2014CN103972276A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/06/2014CN103972272A 高可靠性表面安装器件 High reliability surface mount devices
08/06/2014CN103972243A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing the display device
08/06/2014CN103972242A 一种阵列基板、显示装置及阵列基板的制作方法 An array substrate, the display device and method of manufacturing the array substrate
08/06/2014CN103972239A 显示器 Monitor
08/06/2014CN103972229A 形成带有散热器的半导体器件组合件的方法 Forming a semiconductor device assembly method with a radiator
08/06/2014CN103972226A 半导体集成电路 The semiconductor integrated circuit
08/06/2014CN103972218A 集成无源器件扇出型晶圆级封装结构及制作方法 Integrated passives fan-out wafer level package structure and method of making
08/06/2014CN103972217A 集成无源电容扇出型晶圆级封装结构及制作方法 Integrated passive capacitors fan-out wafer level package structure and method of making
08/06/2014CN103972216A 一种可控自形成MnSi<sub>x</sub>O<sub>y</sub>/Cu<sub>3</sub>Ge双层扩散阻挡层制备工艺 Since the formation of a controlled MnSi <sub> x </ sub> O <sub> y </ sub> / Cu <sub> 3 </ sub> Ge double diffusion barrier layer preparation process
08/06/2014CN103972215A 半导体装置 Semiconductor device
08/06/2014CN103972214A 具有低应力薄膜间隙的贯穿硅穿孔装置及其形成方法 Through perforation device has a low-stress silicon thin film and method of forming the gap
08/06/2014CN103972213A 具有多级互连的半导体器件及其形成方法 Semiconductor device having a multi-level interconnect and method of forming
08/06/2014CN103972212A 用于封装件中的传输线的方法和装置 Method and device package of the transmission line for
08/06/2014CN103972211A 半导体装置 Semiconductor device
08/06/2014CN103972210A 半导体装置、半导体装置的制造方法 The method of manufacturing a semiconductor device, a semiconductor device
08/06/2014CN103972209A 电感器装置和半导体装置 Inductor device and a semiconductor device
08/06/2014CN103972208A 用于改进的沉积选择性的保护层 Improved deposition of a protective layer for the selective
08/06/2014CN103972207A 堆叠管芯之间的螺旋形螺旋电感器 Spiral spiral inductors between stacked die
08/06/2014CN103972206A 半导体装置 Semiconductor device
08/06/2014CN103972205A 布线结构体、液滴喷头以及液滴喷出装置 Wiring structure, liquid droplet ejection head of the droplet ejection apparatus
08/06/2014CN103972204A 封装基板、半导体封装件及其制法 Package substrate, a semiconductor package Jiqizhifa
08/06/2014CN103972203A 嵌埋有电子组件的线路板结构及其制法 There are board structure embedded electronic components Jiqizhifa
08/06/2014CN103972202A 电路装置及pcb板 Circuit device and pcb board
08/06/2014CN103972201A 封装结构与显示模组 Package and display module
08/06/2014CN103972200A 引线框架结构 Leadframe structure
08/06/2014CN103972199A 线键合方法和结构 Wire bonding method and structure
08/06/2014CN103972198A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device
08/06/2014CN103972197A 半导体器件及其制造方法、引线和制作该引线的方法 Semiconductor device and manufacturing method thereof, and methods of making the leads of the lead
08/06/2014CN103972196A 利用倒装芯片片芯附接的阵列引线框架封装 The use of flip chip die arrays attached leadframe package
08/06/2014CN103972195A 半导体装置及其装配方法 Semiconductor device and method of assembly
08/06/2014CN103972194A 一种封装结构 A packaged structure
08/06/2014CN103972193A 功率晶体管装置和用于制造功率晶体管装置的方法 Power transistor device and a method of manufacturing apparatus for power transistors
08/06/2014CN103972192A 包括半导体芯片和接线的器件 Including semiconductor chips and wiring devices
08/06/2014CN103972191A 具有环绕封装通孔端部的开口的管芯封装件及层叠封装件 Die package having a through hole opening surrounding the package and the end portion of the stacked package
08/06/2014CN103972190A 一种大电流半导体器件及其封装方法 One kind of high-current semiconductor device and packaging method
08/06/2014CN103972189A 半导体器件、其制造方法及半导体器件封装 Semiconductor device, manufacturing method thereof and a semiconductor device package
08/06/2014CN103972188A 具有冷却材料的功率半导体设备 Having a cooling material of power semiconductor devices
08/06/2014CN103972187A 芯片封装及其制造方法 Chip package and manufacturing method thereof
08/06/2014CN103972186A 封装结构 Package
08/06/2014CN103972185A 集成器件及其制造方法 Integrated device and manufacturing method thereof
08/06/2014CN103972184A 芯片布置和芯片封装 Chip layout and chip packaging
08/06/2014CN103972183A 电子封装件 Electronic package
08/06/2014CN103972182A 半导体装置及其制造方法以及粘接面强度的评估方法 Semiconductor device and manufacturing method, and a method to assess the strength of the adhesive surface
08/06/2014CN103972181A 内含表面包覆玻璃层的硅晶片的封装器件及其封装方法 Packaged device and packaging method containing glass layer coated silicon wafer
08/06/2014CN103972180A 电子装置的制造方法、电子装置、电子设备以及移动体 The method of manufacturing an electronic device, an electronic device, the electronic device and the movable body
08/06/2014CN103972159A 三维封装结构及其形成方法 Package structure and method of forming a three-dimensional
08/06/2014CN103972158A 用于半导体器件的互连结构及其制造方法和半导体器件 Interconnect structure for a semiconductor device and its manufacturing method and a semiconductor device
08/06/2014CN103972156A 半导体互连结构及其制作方法 Semiconductor interconnect structure and fabrication method thereof
08/06/2014CN103972140A 封装方法及封装半导体器件 Packaging method and packaging a semiconductor device
08/06/2014CN103972115A 半导体器件以及制造半导体器件的方法 A semiconductor device and a method of manufacturing a semiconductor device
08/06/2014CN103972114A 半导体封装制造过程及其结构 The semiconductor package manufacturing process and its structure
08/06/2014CN103966543A 铝硅/铝碳化硅复合材料及其制备方法、电子封装装置 Al-Si / Al SiC composite material and preparation method, electronic packaging devices
08/06/2014CN103966542A 铝硅/铝碳化硅复合材料及其制备方法、电子封装装置 Al-Si / Al SiC composite material and preparation method, electronic packaging devices
08/06/2014CN103966538A 用于电子封装和热沉材料的钨铜复合材料及其制备方法 Tungsten-copper composite material and method for electronic packaging and heat sink material
08/06/2014CN103965794A 光半导体用片和光半导体装置 An optical semiconductor chip and the optical semiconductor device
08/06/2014CN103965793A 各向异性导电膜和半导体装置 The anisotropic conductive film and a semiconductor device
08/06/2014CN103965584A 薄片的制造方法 Sheet manufacturing method
08/06/2014CN103964365A 用于密封环结构的方法和装置 Method and apparatus for the sealing ring structure
08/06/2014CN103155735B 冷却结构体 Cooling structure
08/06/2014CN102687264B 半导体装置 Semiconductor device
08/06/2014CN102646628B 用于制造半导体装置的方法 The method for manufacturing a semiconductor device
08/06/2014CN102569187B 一种低温多晶硅显示装置及其制作方法 An apparatus and a method of making low-temperature polysilicon display
08/06/2014CN102549038B 聚氨酯树脂组合物、固化体及使用了固化体的光半导体装置 Urethane resin composition, cured and an optical semiconductor device using the cured body
08/06/2014CN102528314B 锡- 锑- 银- 镍合金态箔状钎料的制备方法 Tin - antimony - silver - nickel alloy brazing foil state preparation
08/06/2014CN102460685B 半导体封装件以及该半导体封装件的安装构造 Structure for mounting the semiconductor package and the semiconductor package
08/06/2014CN102422729B 电路基板及其制造方法 Circuit board and manufacturing method thereof
08/06/2014CN102403295B 金属键接的半导体封装及其方法 Semiconductor package and method for a metal bonded
08/06/2014CN102332468B 电流传感器、逆变器电路以及具有其的半导体器件 Current sensors, an inverter circuit and a semiconductor device having its
08/06/2014CN102315196B 多晶粒堆栈封装结构 Multi-grain stack package
08/06/2014CN102280436B 薄膜金属层接线结构及其制造方法和阵列基板 Thin-film metal-layer wiring structure and its manufacturing method and array substrate
08/06/2014CN102277124B 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Adhesive composition, a circuit connecting material, a circuit member connection structure and a semiconductor device
08/06/2014CN102222622B 半导体装置和半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
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