| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/26/2009 | DE102008032953A1 Integrierte Schaltung, Schaltungssystem und Herstellungsverfahren An integrated circuit, circuit system and production method |
| 02/26/2009 | DE102008032395A1 Halbleiterbauelement Semiconductor device |
| 02/26/2009 | DE102008030348A1 Chipstapelstruktur und Verfahren zu ihrer Herstellung Stack structure and process for their preparation |
| 02/26/2009 | DE102008029318A1 Lichtemittierende Vorrichtungsgehäuse, die Lichtstreupartikel unterschiedlicher Grösse verwenden A light emitting device housing using light scattering particles of different size |
| 02/26/2009 | DE102007039916A1 Aufbau- und Verbindungstechnik von Modulen mittels dreidimensional geformter Leadframes Packaging technology of modules using three-dimensional molded leadframe |
| 02/26/2009 | DE102006033870B4 Elektronisches Bauteil mit mehreren Substraten sowie ein Verfahren zur Herstellung desselben The same electronic component having a plurality of substrates, and a process for preparing |
| 02/26/2009 | DE102006005746B4 Elektronische Baugruppe, insbesondere elektronisches Sensorsystem, vorzugsweise für Positions- und Winkelmesssysteme Electronic assembly, in particular electronic sensor system, preferably for position and angle measuring systems |
| 02/26/2009 | DE102004054818B4 Verfahren zum reversiblen Oxidationsschutz von Mikro-Bauelementen A method for reversible oxidation protection of micro-components |
| 02/26/2009 | DE10164943B4 Halbleitervorrichtung, umfassend als Zwischenschicht-Isolationsfilm einen Film mit niedriger Dielektrizitätskonstante A semiconductor device comprising, as an interlayer insulation film a low dielectric constant film |
| 02/26/2009 | DE10126734B4 Umverdrahtungsverfahren und damit hergestelltes Bauelement Umverdrahtungsverfahren and thus component produced |
| 02/26/2009 | DE10063876B4 Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle For a variety of light-emitting diodes existing light source |
| 02/25/2009 | EP2028692A1 Semiconductor device |
| 02/25/2009 | EP2028691A2 Sacrificial structures for crack propagation confinement in a substrate comprising a plurality of ICs |
| 02/25/2009 | EP2028690A2 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| 02/25/2009 | EP2028689A2 System and method for supporting one or more heat-generating electrical devices |
| 02/25/2009 | EP2028688A1 Ceramic compact, ceramic part, method for porducing ceramic compact, and method for producing ceramicpart |
| 02/25/2009 | EP2028684A2 Semiconductor integrated circuit device and method of manufacturing the same |
| 02/25/2009 | EP2027948A1 Method for producing a flat section, in particular a cooling body for semiconductor elements or similar components, and section for same |
| 02/25/2009 | EP2027762A1 Electrical device with screen |
| 02/25/2009 | EP2027600A1 Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element |
| 02/25/2009 | EP1573799A4 Three-dimensional device fabrication method |
| 02/25/2009 | EP1540828B1 Coding of information in integrated circuits |
| 02/25/2009 | CN201199769Y Heat radiator |
| 02/25/2009 | CN201199767Y Heat radiator |
| 02/25/2009 | CN201199766Y Combined radiating module |
| 02/25/2009 | CN201199765Y Inserting-fin type radiator |
| 02/25/2009 | CN201199763Y Heat-dissipating cream cover |
| 02/25/2009 | CN201199522Y Support structure of LED |
| 02/25/2009 | CN201199521Y Combination type internal memory radiating device |
| 02/25/2009 | CN201199520Y Internal memory radiating fins for full buffer die set |
| 02/25/2009 | CN201199022Y LED lamp |
| 02/25/2009 | CN201199020Y LED circular illuminating lamp bulb |
| 02/25/2009 | CN201199018Y Natural convection type heat pipe radiator |
| 02/25/2009 | CN201199017Y Water cooling LED road lamp |
| 02/25/2009 | CN201199016Y Lamp source base capable of presenting variation surface and light fitting thereof |
| 02/25/2009 | CN201199002Y LED lamp board structure improvement of paste type support |
| 02/25/2009 | CN201198978Y Automobile lamp cap with heat radiating device |
| 02/25/2009 | CN101375651A Cooling apparatus of electronic device |
| 02/25/2009 | CN101375650A Liquid-cooled heat radiation device |
| 02/25/2009 | CN101375646A Passive impedance equalization of high speed serial links |
| 02/25/2009 | CN101375396A Substrate and method for mounting silicon device |
| 02/25/2009 | CN101375395A Heat dissipating material and semiconductor device using same |
| 02/25/2009 | CN101375394A Warpage-reducing packaging design |
| 02/25/2009 | CN101375393A Hollow package made of resin, and manufacturing method thereof |
| 02/25/2009 | CN101375392A Package of light emitting diode and method for manufacturing the same |
| 02/25/2009 | CN101375391A Multiple chip module and package stacking method for storage devices |
| 02/25/2009 | CN101375378A Al-base alloy wiring material and element structure using the same |
| 02/25/2009 | CN101374402A Rack system and method for circuit board heat exchanger |
| 02/25/2009 | CN101374401A Controllable heat transmission medium system used with a circuit and method thereof |
| 02/25/2009 | CN101374397A Apparatus for cooling miniature fluid and used micro liquid droplet generator thereof |
| 02/25/2009 | CN101374396A Combination of radiating device |
| 02/25/2009 | CN101374395A Radiating device |
| 02/25/2009 | CN101374394A Combination of fastening device |
| 02/25/2009 | CN101373921A Generator-motor apparatus, drive system including generator-motor apparatus, and computer-readable recording medium |
| 02/25/2009 | CN101373807A Preparation of conductive metallic layer on semiconductor device |
| 02/25/2009 | CN101373805A LED chip with overvoltage protection structure |
| 02/25/2009 | CN101373803A LED base with cooling fin |
| 02/25/2009 | CN101373784A Photodiode array, method for manufacturing same, and radiation detector |
| 02/25/2009 | CN101373783A Photodiode array, method for manufacturing same, and radiation detector |
| 02/25/2009 | CN101373778A Display device and its manufacturing method |
| 02/25/2009 | CN101373777A Thin-film transistor substrate, electric moistening type display apparatus method for manufacturing the thin-film transistor substrate |
| 02/25/2009 | CN101373768A Semiconductor device |
| 02/25/2009 | CN101373767A Semiconductor device |
| 02/25/2009 | CN101373766A Semiconductor device |
| 02/25/2009 | CN101373764A 半导体器件 Semiconductor devices |
| 02/25/2009 | CN101373762A 功率半导体模块 Power semiconductor module |
| 02/25/2009 | CN101373761A Multi-chip module package |
| 02/25/2009 | CN101373760A High heat dissipation memory module structure |
| 02/25/2009 | CN101373759A Semiconductor-packaged stacking combination and used stacked semiconductor packaging piece thereof |
| 02/25/2009 | CN101373758A Shield wiring structure |
| 02/25/2009 | CN101373757A Mask target and method for forming the same |
| 02/25/2009 | CN101373756A Test structure and method for sunken phenomena of metal procedure technique |
| 02/25/2009 | CN101373755A 半导体集成电路 The semiconductor integrated circuit |
| 02/25/2009 | CN101373754A An integrated circuit chip using magnetic logic devices |
| 02/25/2009 | CN101373753A Switching assembly for an aircraft ignition system |
| 02/25/2009 | CN101373752A Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof |
| 02/25/2009 | CN101373751A Electronic device and electronic apparatus |
| 02/25/2009 | CN101373750A Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers |
| 02/25/2009 | CN101373749A Wafer-class encapsulation structure and preparation method thereof |
| 02/25/2009 | CN101373748A Wafer-class encapsulation structure and preparation method thereof |
| 02/25/2009 | CN101373747A Device with through-hole interconnection and method for manufacturing the same |
| 02/25/2009 | CN101373746A Mounting structure of electronic component |
| 02/25/2009 | CN101373745A Fixed structure for radiating module |
| 02/25/2009 | CN101373744A Chip module and display apparatus with the same |
| 02/25/2009 | CN101373743A Unit in unit set and manufacturing method thereof |
| 02/25/2009 | CN101373742A Semiconductor device having seal ring structure and method of forming the same |
| 02/25/2009 | CN101373741A Semiconductor shielding structure and manufacturing method thereof |
| 02/25/2009 | CN101373737A Method for preparing CMOS image sensing element |
| 02/25/2009 | CN101373736A Interconnect, interconnect forming method, thin film transistor, and display device |
| 02/25/2009 | CN101373733A Method for forming integrated circuit device structure and corresponding structure |
| 02/25/2009 | CN101373722A Semiconductor device and manufacturing method for the same |
| 02/25/2009 | CN101373720A Method of manufacturing semiconductor device |
| 02/25/2009 | CN101373719A Manufacturing method of semiconductor device having relay board |
| 02/25/2009 | CN101373063A Heat radiating device of long service life and energy-saving LED sending light |
| 02/25/2009 | CN101373062A LED lamp with heat radiation fins and manufacturing method thereof |
| 02/25/2009 | CN101373061A LED light fitting |
| 02/25/2009 | CN101372608A Epoxy resin encapsulation adhesive and use thereof |
| 02/25/2009 | CN101372554A Composite plastic and use thereof |
| 02/25/2009 | CN100464622C Method for preassembling fastener on radiator |
| 02/25/2009 | CN100464620C Heat radiator |