Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/04/2009CN101378052A Integrated circuit package with passive component
03/04/2009CN101378051A Semiconductor device and manufacturing method thereof
03/04/2009CN101378050A Multi-substrate chunk type packaging piece and manufacturing method thereof
03/04/2009CN101378049A Inner-burying type multifunctional integration type structure and preparation method thereof
03/04/2009CN101378048A Packaging structure for stacking multiple chips
03/04/2009CN101378047A Interconnection structure
03/04/2009CN101378046A Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier
03/04/2009CN101378045A Enhancement structure for packaging rewinding type chip
03/04/2009CN101378044A Wiring board, method of designing the same, and electronic apparatus
03/04/2009CN101378043A Semiconductor device
03/04/2009CN101378042A Semiconductor device, semiconductor element and substrate
03/04/2009CN101378041A Semiconductor device and substrate
03/04/2009CN101378040A 半导体装置 Semiconductor device
03/04/2009CN101378039A Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package
03/04/2009CN101378023A 半导体封装件及其制法 The semiconductor package Jiqizhifa
03/04/2009CN101378015A Group III nitride semiconductor and a manufacturing method thereof
03/04/2009CN101377827A Ic卡 Ic Card
03/04/2009CN101377826A Radio frequency and/or radio frequency identification electronic filemark/ apparatus with integration substrate, and manufacturing and using method thereof
03/04/2009CN101377294A Heat radiation structure of LED lamp
03/04/2009CN101377293A Lamp cup of LED light fitting and LED light fitting using the same
03/04/2009CN100466895C Radiator structure
03/04/2009CN100466894C Auxiliary radiator
03/04/2009CN100466893C Heat radiating apparatus
03/04/2009CN100466884C Anisotropic conductive sheet and the manufacturing method thereof
03/04/2009CN100466291C Thin film transistor (TFT) device structure for reducing starting voltage deviation and the manufacturing method thereof
03/04/2009CN100466284C Biasing circuits, solid state imaging devices, and the production method thereof
03/04/2009CN100466272C Image sensor module and camera module package
03/04/2009CN100466271C Semiconductor device
03/04/2009CN100466268C Pixel array substrate
03/04/2009CN100466266C A TFT LCD array base plate and the manufacturing method thereof
03/04/2009CN100466265C Diode-less array for one-time programmable memory
03/04/2009CN100466260C Semiconductor device and the manufacturing method thereof
03/04/2009CN100466253C Semiconductor device provided with overheat protection circuit and electronic circuit using the semiconductor device
03/04/2009CN100466251C Electrical fuse circuit capable of multiple-time fuse and multiple-time electrical fuse executing method
03/04/2009CN100466250C Electronic elements with self-assembling microstructures
03/04/2009CN100466249C Electrostatic discharge protecting circuit
03/04/2009CN100466248C Semiconductor device and the production method thereof
03/04/2009CN100466247C Internal connection wire structure and the manufacturing method thereof
03/04/2009CN100466246C Flexible substrate used for packaging
03/04/2009CN100466245C Method for improving device lamination inside semiconductor plastic packer efficiently
03/04/2009CN100466244C The production method for producing semiconductor package
03/04/2009CN100466243C Semiconductor device and the manufacturing method thereof
03/04/2009CN100466242C 电子回路装置 Electronic circuit device
03/04/2009CN100466241C 半导体器件 Semiconductor devices
03/04/2009CN100466240C Thermal transfer device and the producing method thereof and electronic device
03/04/2009CN100466239C Temp regulator of semiconductor substrate
03/04/2009CN100466238C Method and apparatus for thermal characterization under non-uniform heat load
03/04/2009CN100466237C Semiconductor device and semiconductor device producing substrate and the production method for producing the substrate
03/04/2009CN100466236C Structure of semiconductor element
03/04/2009CN100466235C Semiconductor package with two semiconductor tube cores arranged in a pubic clamps
03/04/2009CN100466225C Substrate contact and the production method thereof
03/04/2009CN100466219C Adjustable self-aligned air gap dielectric for low capacitance wiring
03/04/2009CN100466212C Semiconductor package and the production method thereof
03/04/2009CN100466210C Radiating semiconductor packer and the production method thereof
03/04/2009CN100466209C Semiconductor device and the processing and packaging method thereof
03/04/2009CN100466205C Semiconductor devices and the production method thereof
03/04/2009CN100466168C Method for identifying semiconductor integrated circuit device, the production method thereof and and semiconductor chip
03/04/2009CN100466121C Integrated electronic component
03/04/2009CN100465704C A contact structure and a manufacturing method, a thin film transistor array panel and a manufacturing Method
03/04/2009CN100465130C An underlay substrate material for the illuminating and heat radiating of a semiconductor
03/04/2009CN100464973C A multi-layer substrate and a semi-conductor device using the multi-layer substrate
03/03/2009US7499340 Semiconductor memory device and defect remedying method thereof
03/03/2009US7499280 Heat dissipating device
03/03/2009US7499278 Method and apparatus for dissipating heat from an electronic device
03/03/2009US7499275 Electronic apparatus having a detachable filter
03/03/2009US7499270 Lock for portable music player or other personal electronic device
03/03/2009US7499269 Security clamp lock for notebook computer or other personal electronic device
03/03/2009US7498680 Test structure
03/03/2009US7498679 Package substrate and semiconductor package using the same
03/03/2009US7498678 Electronic assemblies and systems with filled no-flow underfill
03/03/2009US7498677 Semiconductor device
03/03/2009US7498676 Semiconductor device
03/03/2009US7498675 Semiconductor component having plate, stacked dice and conductive vias
03/03/2009US7498674 Semiconductor module having a coupling substrate, and methods for its production
03/03/2009US7498673 Heatplates for heatsink attachment for semiconductor chips
03/03/2009US7498672 Micropin heat exchanger
03/03/2009US7498671 Power semiconductor module
03/03/2009US7498670 Semiconductor structures having electrophoretically insulated vias
03/03/2009US7498669 Semiconductor device
03/03/2009US7498668 Stacked semiconductor device and lower module of stacked semiconductor device
03/03/2009US7498667 Stacked integrated circuit package-in-package system
03/03/2009US7498666 Stacked integrated circuit
03/03/2009US7498665 Integrated circuit leadless package system
03/03/2009US7498664 Semiconductor package having increased resistance to electrostatic discharge
03/03/2009US7498663 Semiconductor integrated circuit
03/03/2009US7498662 Dielectric media including surface-treated metal oxide particles
03/03/2009US7498661 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus
03/03/2009US7498660 Semiconductor device
03/03/2009US7498659 Semiconductor device, method of manufacturing the same, and phase shift mask
03/03/2009US7498656 Electromagnetic shielding structure
03/03/2009US7498647 Packaged microelectronic imagers and methods of packaging microelectronic imagers
03/03/2009US7498644 Prevention of tampering in electronic devices
03/03/2009US7498641 Partial replacement silicide gate
03/03/2009US7498638 ESD protection circuit for semiconductor device
03/03/2009US7498604 Deposition stop time detection apparatus and methods for fabricating copper using the same
03/03/2009US7498520 Semiconductor multilayer wiring board and method of forming the same
03/03/2009US7498376 Thermal transient suppression material and method of production
03/03/2009US7498249 Method of forming a connecting conductor and wirings of a semiconductor chip
03/03/2009US7498218 Semiconductor device with low contact resistance and method for fabricating the same
03/03/2009US7498204 Structure and method for improved heat conduction for semiconductor devices
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