Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/05/2009US20090057843 Semiconductor assemblies and methods of manufacturing such assemblies
03/05/2009US20090057842 Selective removal of on-die redistribution interconnects from scribe-lines
03/05/2009US20090057841 Wafer
03/05/2009US20090057840 Wafer manufacturing method, polishing apparatus, and wafer
03/05/2009US20090057838 Manufacturing Method for Semiconductor Chips, and Semiconductor Chip
03/05/2009US20090057821 Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse material
03/05/2009US20090057820 Abrupt metal-insulator transition device with parallel conducting layers
03/05/2009US20090057819 Electrical fuse device
03/05/2009US20090057815 Forming channel stop for deep trench isolation prior to deep trench etch
03/05/2009US20090057808 Semiconductor device, semiconductor element, and substrate
03/05/2009US20090057790 Package for a micro-electro mechanical device
03/05/2009US20090057768 Electrostatic discharge protection circuit
03/05/2009US20090057766 Integration of silicon boron nitride in high voltage and small pitch semiconductors
03/05/2009US20090057705 Semiconductor Element Mounting Substrate, Semiconductor Device Using the Same, and Method for Manufacturing Semiconductor Element Mounting Substrate
03/05/2009US20090057664 E-beam inspection structure for leakage analysis
03/05/2009US20090057006 Electronic unit and production method of the same
03/05/2009US20090056986 Integrated circuit (ic) carrier assembly with first and second suspension means
03/05/2009US20090056800 Surface Passivation of Silicon Based Wafers
03/05/2009DE112007000994T5 Halbleiterplättchengehäuse einschließlich mehrerer Plättchen und einer gemeinsamen Verbindungsstruktur Semiconductor die package including a plurality of laminae and a common connection structure
03/05/2009DE112004002702B4 Verfahren zum Herstellen einer Halbleiterbaugruppe und Matrixbaugruppe A method of manufacturing a semiconductor package and matrix assembly
03/05/2009DE10234155B4 Preßgespritztes Leistungsbauelement Preßgespritztes power device
03/05/2009DE102008045240A1 Plaited-Signal-Manifold-Anschlussstruktur für ein Hochfrequenzbauelement und ein solches Hochfrequenzbauelement Placard signal manifold connecting structure for a high frequency device and a high frequency device such
03/05/2009DE102008044760A1 Halbleiterelement mit Kompensationsstrom Semiconductor element with compensation current
03/05/2009DE102008039706A1 Halbleiterbauelement Semiconductor device
03/05/2009DE102008034164A1 Halbleitermodul Semiconductor module
03/05/2009DE102008025705A1 Halbleitervorrichtung Semiconductor device
03/05/2009DE102007041926A1 Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface
03/05/2009DE102007041896A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
03/05/2009DE102007041852A1 High power LED module, has semicircular hollow portion extending into transparent carrier on side of LED and having evaporable cooling agent, and electrode structures provided in transparent carrier
03/05/2009DE102007041229A1 Schaltungsanordnung und ein Verfahren zum Verkapseln derselben Circuit arrangement and a method for encapsulating the same
03/05/2009DE102007041096A1 Elektrische Baugruppe mit einem elektrischen Bauelement, einer Wärmesenke und einem Wärmeleitelement zwischen Bauelement und Wärmesenke The electrical assembly with an electrical device, a heat sink and a heat-conducting between component and heat sink
03/05/2009DE102007040875A1 Schaltungsanordnung zum Schutz vor elektrostatischen Entladungen und Verfahren zum Betreiben einer solchen Circuitry to protect against electrostatic discharges and method for operating such
03/05/2009DE102007040874A1 Light-emitting semiconductor component, particularly light emitting diode, has substrateless light emitting diode semiconductor chip, and two connections are provided for contacting of semiconductor chip
03/05/2009DE102007040791A1 Power semiconductor device comprises an internal capacitor between an internal gate electrode and an electrode, a monolithically integrated auxiliary condenser, an internal gate resistor, a vertical drift zone, and a lateral drift zone
03/05/2009DE102006006561B4 Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls Flip-chip module and method for replacing a semiconductor chip of a flip-chip module
03/05/2009DE102005028396B4 Transpondervorrichtung und Reifendrucküberwachungssystem mit Transpondervorrichtung Transponder device and tire pressure monitoring system with transponder device
03/05/2009CA2697666A1 Analyte monitoring device and methods of use
03/04/2009EP2031656A2 Device for measuring the resistivity of a metal/semi-conductor contact
03/04/2009EP2031655A2 Semiconductor device and method of manufacturing the same
03/04/2009EP2031653A2 Semiconductor device having multiple element formation regions and manufacturing method thereof
03/04/2009EP2030494A1 An arrangement and a method for cooling
03/04/2009EP2030236A1 High voltage valve group with increased breakdown strength
03/04/2009EP2030235A1 Improved metal-insulator-metal capacitors
03/04/2009EP2030234A1 Method and system for composite bond wires
03/04/2009EP2030233A1 Cooling and shielding of a high voltage converter
03/04/2009EP2030230A2 Holder for electrical component and electrical device including the holder and component
03/04/2009EP2030228A1 Method for producing an injection-moulded part comprising an integrated flexible printed circuit board
03/04/2009EP2030223A1 Symmetrical mim capacitor design
03/04/2009EP1735829A4 Device and method for joining substrates
03/04/2009EP1464082B1 Mounting assembly for a lidless semiconductor device
03/04/2009EP1309940B1 Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
03/04/2009EP1036414B1 A method of forming a chip scale package using large ductile solder balls
03/04/2009EP1009026B1 Power semiconductor module
03/04/2009CN201204786Y 液冷式散热装置 Liquid-cooled heat sink
03/04/2009CN201204785Y Device for fixing radiator
03/04/2009CN201204783Y 液冷散热器 Liquid-cooled radiator
03/04/2009CN201204781Y Radiator with heat conductance board
03/04/2009CN201204779Y Radiating module structure
03/04/2009CN201204778Y Radiating device
03/04/2009CN201204214Y Chip type LED
03/04/2009CN201204212Y LED encapsulation structure
03/04/2009CN201204210Y Encapsulation structure for light emitting diode and forming die for manufacturing the same
03/04/2009CN201204209Y LED down-lead base
03/04/2009CN201204205Y High-power LED encapsulation structure
03/04/2009CN201204203Y Radiating device for high-power LED
03/04/2009CN201204202Y Chip packaging structure
03/04/2009CN201204201Y Ultra-high-power LED die set light source bracket
03/04/2009CN201204200Y Indent radiating device for high brightness polycrystal encapsulation LED
03/04/2009CN201203371Y Hot pipe
03/04/2009CN201203086Y High power LED light fitting heat radiator
03/04/2009CN201203085Y Heat radiating device of illumination device
03/04/2009CN201203084Y LED light fitting heat radiator
03/04/2009CN201203083Y Novel high close heat radiation structure high power LED lamp
03/04/2009CN201203082Y Heat radiation lamp cup and LED sending light
03/04/2009CN201203081Y Aluminum alloy integrated LED lamp tube
03/04/2009CN201203080Y LED lamp tube
03/04/2009CN201203079Y LED lamp tube with heat radiator
03/04/2009CN201203078Y Heat radiator capable of enlarging lighting lamp angle
03/04/2009CN201203077Y Loop hot pipe apparatus for high power LED heat radiation
03/04/2009CN201203074Y Outdoor lamp
03/04/2009CN201203058Y Multiple-grain LED foam integrated gluing steady structure
03/04/2009CN201203001Y Chip type LED
03/04/2009CN101379869A Shield case and mems microphone having the same
03/04/2009CN101379612A Semiconductor apparatus
03/04/2009CN101379611A Cooling structure of power semiconductor element and inverter
03/04/2009CN101379601A Nitrogen based implants for defect reduction in strained silicon
03/04/2009CN101379591A Semiconductor device and method of manufacturing thereof
03/04/2009CN101379517A Circuit arrangement, data processing device comprising such circuit arrangement as well as method for identifying an attack on such circuit arrangement
03/04/2009CN101379107A Resin composition for semiconductor encapsulation and semiconductor device
03/04/2009CN101378645A Radiator with dedusting mechanism
03/04/2009CN101378642A Combination of radiating device
03/04/2009CN101378624A Module structure integrating perimeter circuit and manufacturing method thereof
03/04/2009CN101378191A Electrostatic discharge protecting circuit and electronic product using the same
03/04/2009CN101378085A Metal-insulator-metal capacitor and method for manufacturing the same
03/04/2009CN101378066A Nand type nonvolatile semiconductor memory device having sideface electrode shared by memory cells
03/04/2009CN101378059A Semiconductor device and a method for fabricating the same
03/04/2009CN101378058A LCD driver IC and method for manufacturing the same
03/04/2009CN101378057A Metal-insulator-metal capacitor and method for manufacturing the same
03/04/2009CN101378054A Inductor for semiconductor and manufacture method thereof
03/04/2009CN101378053A High-side and low-side nmosfets composite package
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