Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/05/2009WO2008155726A3 A carrier for electric packages and a method of structuring a carrier
03/05/2009WO2008147825A3 Thermal interconnect and interface materials, methods of production and uses thereof
03/05/2009WO2008145804A3 Interference shielded electronics module and method for providing the same
03/05/2009WO2008142081A3 Component with mechanically loadable connection surfaces
03/05/2009WO2008140562A3 Electroactive biopolymer optical and electro-optical devices and method of manufacturing the same
03/05/2009US20090064078 Method of designing a semiconductor integrated circuit having a dummy area and the semiconductor integrated circuit thereof
03/05/2009US20090062639 Automated vessel repair system, devices and methods
03/05/2009US20090062634 Analyte monitoring device and methods of use
03/05/2009US20090061628 Laser trimming problem suppressing semiconductor device manufacturing apparatus and method
03/05/2009US20090061564 Method of packaging an integrated circuit die
03/05/2009US20090061563 Method of manufacturing a semiconductor device including plural semiconductor chips
03/05/2009US20090060703 Method for sorting integrated circuit devices
03/05/2009US20090059055 Optical device and method for fabricating the same
03/05/2009US20090058568 High speed electronics interconnect and method of manufacture
03/05/2009US20090058567 High speed electronics interconnect and method of manufacture
03/05/2009US20090057929 Semiconductor device
03/05/2009US20090057928 Semiconductor Chip with Stratified Underfill
03/05/2009US20090057927 Method for forming interlayer insulating film in semiconductor device
03/05/2009US20090057926 Semiconductor apparatus
03/05/2009US20090057925 Semiconductor apparatus
03/05/2009US20090057924 Semiconductor device, semiconductor mounting structure, and electro-optical device
03/05/2009US20090057923 Methods of Fabricating Semiconductor Devices and Structures Thereof
03/05/2009US20090057922 Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package
03/05/2009US20090057921 Flip chip for electrical function test and manufacturing method thereof
03/05/2009US20090057920 Low-noise flip-chip packages and flip chips thereof
03/05/2009US20090057919 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
03/05/2009US20090057918 Stack-type semiconductor package, method of forming the same and electronic system including the same
03/05/2009US20090057917 Semiconductor device
03/05/2009US20090057916 Semiconductor package and apparatus using the same
03/05/2009US20090057915 Semiconductor device
03/05/2009US20090057914 Multiple chip semiconductor device
03/05/2009US20090057913 Packaging substrate structure with electronic components embedded therein and method for fabricating the same
03/05/2009US20090057912 Partitioned through-layer via and associated systems and methods
03/05/2009US20090057911 Method for manufacturing a semiconductor arrangement, use of a trench structure, and semiconductor arrangement
03/05/2009US20090057910 Method of embedding passive component within via
03/05/2009US20090057909 Under bump metallization structure having a seed layer for electroless nickel deposition
03/05/2009US20090057908 Wire bond pads
03/05/2009US20090057907 Interconnection structure
03/05/2009US20090057906 Encapsulated silicidation for improved SiC processing and device yield
03/05/2009US20090057905 Semiconductor Device and Method of Manufacturing the Same
03/05/2009US20090057904 Copper metal line in semicondcutor device and method of forming same
03/05/2009US20090057903 Semiconductor module, method for manufacturing semiconductor modules, semiconductor apparatus, method for manufacturing semiconductor apparatuses, and portable device
03/05/2009US20090057902 Method and structure for increased wire bond density in packages for semiconductor chips
03/05/2009US20090057901 Structure of high performance combo chip and processing method
03/05/2009US20090057900 Stacked Chip Package With Redistribution Lines
03/05/2009US20090057899 Semiconductor integrated circuit device and method of fabricating the same
03/05/2009US20090057898 Semiconductor device and method of manufacturing the same
03/05/2009US20090057897 High strength solder joint formation method for wafer level packages and flip applications
03/05/2009US20090057896 Nail-Shaped Pillar for Wafer-Level Chip-Scale Packaging
03/05/2009US20090057895 Post passivation structure for a semiconductor device and packaging process for same
03/05/2009US20090057894 Structure of Gold Bumps and Gold Conductors on one IC Die and Methods of Manufacturing the Structures
03/05/2009US20090057893 Semiconductor apparatus
03/05/2009US20090057892 Electrode structure in semiconductor device and related technology
03/05/2009US20090057891 Semiconductor device and manufacturing method thereof
03/05/2009US20090057890 Semiconductor device
03/05/2009US20090057889 Semiconductor Device Having Wafer Level Chip Scale Packaging Substrate Decoupling
03/05/2009US20090057888 IC Package Having IC-to-PCB Interconnects on the Top and Bottom of the Package Substrate
03/05/2009US20090057887 Wafer level packaging of semiconductor chips
03/05/2009US20090057886 Semiconductor device and substrate
03/05/2009US20090057885 Semiconductor device
03/05/2009US20090057884 Multi-Chip Package
03/05/2009US20090057883 Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package
03/05/2009US20090057882 Fluid cooled semiconductor power module having double-sided cooling
03/05/2009US20090057881 Microelectronic package and method of cooling same
03/05/2009US20090057880 Semiconductor device, semiconductor package, stacked module, card, system and method of manufacturing the semiconductor device
03/05/2009US20090057879 Structure and process for electrical interconnect and thermal management
03/05/2009US20090057878 Semiconductor die package including heat sinks
03/05/2009US20090057877 Semiconductor Device with Gel-Type Thermal Interface Material
03/05/2009US20090057876 Stacked package structure for reducing package volume of an acoustic micro-sensor
03/05/2009US20090057875 Semiconductor device
03/05/2009US20090057874 Semiconductor module including semiconductor chips in a plastic housing in separate regions
03/05/2009US20090057873 Packaging substrate structure with electronic component embedded therein and method for manufacture of the same
03/05/2009US20090057872 Through-Chip Via Interconnects for Stacked Integrated Circuit Structures
03/05/2009US20090057871 Ball Grid Array Package Enhanced With a Thermal and Electrical Connector
03/05/2009US20090057870 Stacked semiconductor package with a reduced volume
03/05/2009US20090057869 Co-packaged high-side and low-side nmosfets for efficient dc-dc power conversion
03/05/2009US20090057868 Wafer Level Chip Size Package For MEMS Devices And Method For Fabricating The Same
03/05/2009US20090057867 Integrated Circuit Package with Passive Component
03/05/2009US20090057866 Microelectronic Package Having Second Level Interconnects Including Stud Bumps and Method of Forming Same
03/05/2009US20090057865 Sandwiched organic lga structure
03/05/2009US20090057864 Integrated circuit package system employing an offset stacked configuration
03/05/2009US20090057863 Integrated circuit package-on-package system with anti-mold flash feature
03/05/2009US20090057862 Integrated circuit package-in-package system with carrier interposer
03/05/2009US20090057861 Integrated circuit package-in-package system with side-by-side and offset stacking
03/05/2009US20090057860 Semiconductor memory package
03/05/2009US20090057859 Window-type ball grid array package structure and fabricating method thereof
03/05/2009US20090057858 Low cost lead frame package and method for forming same
03/05/2009US20090057857 Lead frame, semiconductor device, and method of manufacturing semiconductor device
03/05/2009US20090057856 Bonding-patterned device and electronic component
03/05/2009US20090057855 Semiconductor die package including stand off structures
03/05/2009US20090057854 Self locking and aligning clip structure for semiconductor die package
03/05/2009US20090057853 Semiconductor power module with flexible circuit leadframe
03/05/2009US20090057852 Thermally enhanced thin semiconductor package
03/05/2009US20090057851 Method of manufacturing semiconductor device
03/05/2009US20090057850 Surface Mountable Semiconductor Package with Solder Bonding Features
03/05/2009US20090057849 Interconnect in a multi-element package
03/05/2009US20090057848 Redistribution structures for microfeature workpieces
03/05/2009US20090057847 Gallium nitride wafer
03/05/2009US20090057845 Apparatus to saw wafer and having nozzle to remove burrs in scribe lanes, method of sawing wafer, and semiconductor package fabricated by the same
03/05/2009US20090057844 Semiconductor device and method of manufacturing semiconductor device
1 ... 805 806 807 808 809 810 811 812 813 814 815 816 817 818 819 820 821 822 823 824 825 ... 2262