H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/11/2009	CN100468752C Semiconductor component and manufacturing method thereof
03/11/2009	CN100468750C Thin film transistor substrates and making method
03/11/2009	CN100468749C Bigrid layout structure for thin film transistor
03/11/2009	CN100468745C Semiconductor device and manufacture method thereof
03/11/2009	CN100468735C Net of power supply ground for integrated circuit, and arrangement method
03/11/2009	CN100468734C Circuit arrangement and method for protecting an integrated semiconductor circuit
03/11/2009	CN100468732C Output circuit
03/11/2009	CN100468728C Multiple chip semi-conductor packaging structure and encapsulation method
03/11/2009	CN100468727C Stacking structure for semiconductor packaging assembly
03/11/2009	CN100468726C Electronic device and use thereof
03/11/2009	CN100468725C Anti-electrostatic discharging radiating module and system thereof
03/11/2009	CN100468724C Electrostatic protective circuit and semiconductor integrated circuit using the same
03/11/2009	CN100468723C Static discharge protective circuit and method in integrated circuit
03/11/2009	CN100468722C Security-sensitive semiconductor product, particularly a smart-card chip
03/11/2009	CN100468721C Test circuit built-in semiconductor chip
03/11/2009	CN100468720C Bit-cell and method for programming
03/11/2009	CN100468719C Overlappable semiconductor device and method of manufacturing the same
03/11/2009	CN100468718C Semiconductor device and its making method
03/11/2009	CN100468717C A planar inductive component and an integrated circuit comprising the planar inductive component
03/11/2009	CN100468716C Electronic device
03/11/2009	CN100468715C Connection structure for connecting semiconductor element, wiring board and semiconductor device
03/11/2009	CN100468714C Manufacturing method of semiconductor element
03/11/2009	CN100468713C Semiconductor wafer welding material projected block structure and its production
03/11/2009	CN100468712C Through electrode, spacer provided with the through electrode, and method of manufacturing the same
03/11/2009	CN100468711C Semiconductor package with the heat radiation device and its making method
03/11/2009	CN100468710C Integrated liquid cooling heat radiator
03/11/2009	CN100468709C Luminous modular and its light source device
03/11/2009	CN100468708C Heat radiator
03/11/2009	CN100468707C Circular heat tube radiator
03/11/2009	CN100468706C Circuit board and method for manufacturing the same, semiconductor package, component built-in module
03/11/2009	CN100468691C Filling method for concave slot and its structure
03/11/2009	CN100468689C Novel nitride barrier layer to prevent metal leakage issue in a dual damascene structure
03/11/2009	CN100468679C A semiconductor device, a manufacturing method thereof, and an evaluation method of the semiconductor device
03/11/2009	CN100468671C Method for fabrication of a contact structure
03/11/2009	CN100468670C Connection technique for power semiconductors comprising large-area terminals
03/11/2009	CN100468669C Method of forming a semiconductor package and leadframe therefor
03/11/2009	CN100468668C Method for mounting semiconductor device, circuit board, electrooptic device, and electronic device
03/11/2009	CN100468666C Process for fabricating electronic components using liquid injection molding and electronic components fabricated by the method
03/11/2009	CN100468627C Method of producing a nitride semiconductor device and nitride semiconductor device
03/11/2009	CN100468614C A low thermal resistance device and method of forming the same
03/11/2009	CN100468612C Semiconductor device and method of manufacturing the same
03/11/2009	CN100468609C Super heat-conductive pipe lamp
03/11/2009	CN100468283C Method and apparatus for cooling a circuit component
03/11/2009	CN100467994C Cooling device, electronic equipment, and method of manufacturing cooling device
03/10/2009	US7503018 Method of switching a power supply of voltage domains of a semiconductor circuit, and corresponding semiconductor circuit
03/10/2009	US7502231 Thin printed circuit board for manufacturing chip scale package
03/10/2009	US7502229 Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
03/10/2009	US7502007 Electro-optical device, electronic apparatus, and electro-optical shielding device
03/10/2009	US7501924 Self-shielding inductor
03/10/2009	US7501711 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
03/10/2009	US7501710 Semiconductor integrated circuit and method of manufacturing the same
03/10/2009	US7501709 BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance
03/10/2009	US7501708 Microelectronic device connection structure
03/10/2009	US7501707 Multichip semiconductor package
03/10/2009	US7501706 Semiconductor devices to reduce stress on a metal interconnect
03/10/2009	US7501705 Configuration terminal for integrated devices and method for configuring an integrated device
03/10/2009	US7501704 Integrated circuit chip with external pads and process for fabricating such a chip
03/10/2009	US7501703 Acoustic transducer module
03/10/2009	US7501702 Integrated transistor module and method of fabricating same
03/10/2009	US7501701 Rewiring substrate strip having a plurality of semiconductor component positions
03/10/2009	US7501700 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
03/10/2009	US7501699 Method and apparatus for electrical isolation of semiconductor device
03/10/2009	US7501698 Method and system for an improved power distribution network for use with a semiconductor device
03/10/2009	US7501697 Integrated circuit package system
03/10/2009	US7501696 Semiconductor chip-embedded substrate and method of manufacturing same
03/10/2009	US7501695 High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same
03/10/2009	US7501694 Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same
03/10/2009	US7501693 LDO regulator with ground connection through package bottom
03/10/2009	US7501692 Semiconductor lead frame, semiconductor package having the same, and method of plating the same
03/10/2009	US7501691 Trench insulation structures including an oxide liner and oxidation barrier
03/10/2009	US7501689 Upper-layer metal power standard cell
03/10/2009	US7501675 Semiconductor device and method of manufacturing the same
03/10/2009	US7501668 Semiconductor memory devices having contact pads with silicide caps thereon
03/10/2009	US7501651 Test structure of semiconductor device
03/10/2009	US7501585 Semiconductor device support element with fluid-tight boundary
03/10/2009	US7501334 Semiconductor devices having a pocket line and methods of fabricating the same
03/10/2009	US7501313 Method of making semiconductor BGA package having a segmented voltage plane
03/10/2009	US7501311 Fabrication method of a wafer structure
03/10/2009	US7501310 Structure of image sensor module and method for manufacturing of wafer level package
03/10/2009	US7501309 Standoffs for centralizing internals in packaging process
03/10/2009	US7501183 Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts
03/10/2009	US7501086 Encapsulation method for leadless semiconductor packages
03/10/2009	CA2401299C Morphing fillers and thermal interface materials
03/10/2009	CA2200251C A system to monitor the temperature of an integrated circuit and to dissipate heat generated thereby
03/07/2009	CA2639299A1 Heat spreader and method of making the same
03/05/2009	WO2009029662A1 Analyte monitoring device and methods of use
03/05/2009	WO2009029566A2 Semiconductor device having wafer level chip scale packaging substrate decoupling
03/05/2009	WO2009029542A1 Corner i/o pad density
03/05/2009	WO2009029397A1 Thermally enhanced thin semiconductor package
03/05/2009	WO2009028800A1 Electrostatic discharge protection device of output driver stage
03/05/2009	WO2009028596A1 Passive element built-in substrate, manufacturing method, and semiconductor device
03/05/2009	WO2009028578A2 Semiconductor device including semiconductor constituent and manufacturing method thereof
03/05/2009	WO2009028463A1 Spacer, and its manufacturing method
03/05/2009	WO2009028239A1 Structure for mounting semiconductor device and method for mounting semiconductor device
03/05/2009	WO2009028156A1 Wiring member, metal component with resin and resin sealed semiconductor device, and processes for producing them
03/05/2009	WO2009027888A2 Solderable structure
03/05/2009	WO2009027488A1 Plaited-signal-manifold-connection structure for a high frequency component and high frequency component thereto
03/05/2009	WO2009027038A1 Electrical device, method and use
03/05/2009	WO2009026998A2 Connection of a chip comprising pads and bumps to a substrate comprising metallic strip conductors
03/05/2009	WO2009007928A3 Methods for manufacturing integrated circuits

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