Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/07/2014US20140217608 Semiconductor module, circuit board
08/07/2014US20140217607 Reduced stress tsv and interposer structures
08/07/2014US20140217606 Three-dimensional monolithic electronic-photonic integrated circuit
08/07/2014US20140217605 Interconnection structure for package and fabrication method thereof
08/07/2014US20140217604 Package Structure and Methods of Forming Same
08/07/2014US20140217603 Semiconductor Device and Method of Fabricating the Same
08/07/2014US20140217602 Semiconductor device
08/07/2014US20140217601 Semiconductor device
08/07/2014US20140217600 Semiconductor device and method of manufacturing the same
08/07/2014US20140217599 Bbul material integration in-plane with embedded die for warpage control
08/07/2014US20140217598 Semiconductor memory device and method for manufacturing same
08/07/2014US20140217597 Semiconductor Device and Method of Forming Stress Relieving Vias for Improved Fan-Out WLCSP Package
08/07/2014US20140217596 Power transistor arrangement and method for manufacturing the same
08/07/2014US20140217595 Mounting structure and manufacturing method for same
08/07/2014US20140217594 Semiconductor device
08/07/2014US20140217593 Electrical Connecting Element and Method for Manufacturing the Same
08/07/2014US20140217592 Interconnect structure and method of making same
08/07/2014US20140217591 Multi-layer barrier layer for interconnect structure
08/07/2014US20140217590 Through silicon via metallization
08/07/2014US20140217589 Support structure for barrier layer of semiconductor device
08/07/2014US20140217588 Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device
08/07/2014US20140217587 Wafer Leveled Chip Packaging Structure and Method Thereof
08/07/2014US20140217586 Package-on-package device
08/07/2014US20140217585 3d integrated circuit package with through-mold first level interconnects
08/07/2014US20140217584 Flow underfill for microelectronic packages
08/07/2014US20140217583 Semiconductor device including a buffer layer structure for reducing stress
08/07/2014US20140217582 Semiconductor device
08/07/2014US20140217581 Electronic component, mother substrate, and electronic component manufacturing method
08/07/2014US20140217580 Semiconductor device and method of fabricating the same
08/07/2014US20140217579 High density package interconnects
08/07/2014US20140217578 Semiconductor package process and structure thereof
08/07/2014US20140217577 Semiconductor Device and Method for Manufacturing a Semiconductor Device
08/07/2014US20140217576 Semiconductor package
08/07/2014US20140217575 3DIC Package Comprising Perforated Foil Sheet
08/07/2014US20140217574 Composites comprised of aligned carbon fibers in chain-aligned polymer binder
08/07/2014US20140217573 Low cost and high performance flip chip package
08/07/2014US20140217572 Heat Sink Package
08/07/2014US20140217571 Low profile zero/low insertion force package top side flex cable connector architecture
08/07/2014US20140217570 Transistor outline housing and method for producing same
08/07/2014US20140217569 Semiconductor device and method of manufacturing the same
08/07/2014US20140217568 Semiconductor Package with Cantilever Leads
08/07/2014US20140217567 Semiconductor device and manufacturing method of the same
08/07/2014US20140217566 Double-sided package
08/07/2014US20140217565 Electrical connectivity of die to a host substrate
08/07/2014US20140217564 Semiconductor device with integrated antenna and manufacturing method therefor
08/07/2014US20140217563 Multifunction semiconductor package structure and method of manufacturing the same
08/07/2014US20140217560 Semiconductor device
08/07/2014US20140217559 Semiconductor Devices Having Through Silicon Vias and Methods of Fabricating the Same
08/07/2014US20140217557 Method and Apparatus for a Seal Ring Structure
08/07/2014US20140217556 Methods for dicing a compound semiconductor wafer, and diced wafers and die obtained thereby
08/07/2014US20140217523 Housing for a Semiconductor Chip and Semiconductor Chip with a Housing
08/07/2014US20140217473 Device comprising nanostructures and method of manufacturing thereof
08/07/2014US20140217426 Semiconductor integrated circuit device, electronic apparatus, and display apparatus
08/07/2014US20140217410 Array Substrate, Display Device and Manufacturing Method Thereof
08/07/2014US20140217199 Method and apparatus for reducing acoustic noise in a synthetic jet
08/07/2014US20140217156 Joining method and semiconductor device manufacturing method
08/07/2014US20140217152 Lead frame support plate and window clamp for wire bonding machines
08/07/2014US20140217066 Silicon substrate processing method, element embedded substrate, and channel forming substrate
08/07/2014DE112012003829T5 Vorrichtung zum Einfüllen von Metall An apparatus for filling with metal
08/07/2014DE112006003788B4 Elektronisches Bauteil mit Leadframe mit nichtleitenden Verbindungsstegen und Verfahren zur Herstellung des elektronischen Bauteils An electronic part having lead frame with non-conductive tie bars and processes for making the electronic component
08/07/2014DE102014201227A1 Halbleitervorrichtung und verfahren zum herstellen derselben A semiconductor device and method of manufacturing the same
08/07/2014DE102014101552A1 Elektrisches verbindungselement und verfahren zum herstellen desselben An electrical connection element of the same and methods for making
08/07/2014DE102014101283A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
08/07/2014DE102014101034A1 Wärmeabstrahlungsstruktur einer elektrischen Vorrichtung und Verfahren zum Herstellen derselben Heat radiation structure of an electric apparatus and method for manufacturing the same
08/07/2014DE102014100931A1 Bauelement, das einen Halbleiterchip und Drähte beinhaltet Component that includes a semiconductor chip and wires
08/07/2014DE102013225135A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
08/07/2014DE102013219959A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
08/07/2014DE102013201931A1 Laserbauelement und Verfahren zu seiner Herstellung Laser device and method for its preparation
08/07/2014DE102013201899A1 Verfahren zur Herstellung eines Leadframes A process for preparing a lead frame
08/07/2014DE102013200868A1 Verfahren zur Herstellung einer stoffschlüssigen Verbindung und einer elektrischen Verbindung A process for producing a material-locking connection and an electrical connection
08/07/2014DE102013104663A1 Haltestruktur für eine Barrierenschicht einer Halbleitervorrichtung Support structure for a barrier layer of a semiconductor device
08/07/2014DE102013100576A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
08/07/2014DE102013009241A1 Kupferpastenzusammensetzung und ihre Verwendung in einem Verfahren zum Bilden von Kupferleitern auf Substraten The copper paste composition and its use in a method of forming copper conductors on substrates
08/07/2014DE102004037817B4 Elektrisches Bauelement in Flip-Chip-Bauweise The electrical component in flip-chip-type
08/07/2014DE102004021862B4 Stromsenor Current Senor
08/06/2014EP2763518A1 Component embedded substrate mounting body, method for manufacturing same and component embedded substrate
08/06/2014EP2763514A1 Interposer substrate and method of manufacturing the same
08/06/2014EP2763169A1 Chip packaging structure and method for electromagnetic shielding
08/06/2014EP2763168A1 Cooling device problem detection device and problem detection method
08/06/2014EP2763167A1 Heat-dissipating material and method for producing same, and electronic device and method for producing same
08/06/2014EP2763166A1 Heat dissipation structure, power module, method for manufacturing heat dissipation structure and method for manufacturing power module
08/06/2014EP2763165A1 Power module
08/06/2014EP2763164A1 Wiring material and semiconductor module using same
08/06/2014EP2763163A2 Double-sided package
08/06/2014EP2762994A1 Buckle and heat dissipation module having the same
08/06/2014EP2762840A1 Portable electronic device with sensors chip and through-silicon vias
08/06/2014EP2762511A1 Epoxy resin composition and electronic component device
08/06/2014EP2761653A1 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability
08/06/2014EP2761652A1 Method for producing a solder joint
08/06/2014EP2761651A1 Method for handling very thin device wafers
08/06/2014EP2761650A2 Layer composite for connecting electronic components comprising a compensation layer, linking layers and connection layers
08/06/2014EP2761539A1 Method of manufacturing a data carrier provided with a microcircuit
08/06/2014EP2761056A2 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/06/2014EP2761046A1 Tamper resistant amorphous alloy joining
08/06/2014DE202014103436U1 Optoelektronische Baugruppe mit Wärmesenke The optoelectronic assembly with heat sink
08/06/2014CN203761684U 一种球栅阵列结构的印制电路板封装及显示装置 Printed circuit board and a display device encapsulated ball grid array structure
08/06/2014CN203760870U 直流防雷配电柜防反二极管的散热系统 Distribution Cabinet blocking diode cooling system
08/06/2014CN203760484U 改进结构的平面工艺二极管 Improved diode structure planar process
08/06/2014CN203760474U 一种特殊cmos esd原件结构 A special cmos esd original structure
08/06/2014CN203760465U 一种新型功率半导体模块 A novel power semiconductor module
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