Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/12/2014US8805132 Integrated circuit package connected to a data transmission medium
08/12/2014US8804336 Heat disspating apparatus and electronic device
08/12/2014US8804316 Electronic device package, electronic device, and electronic apparatus
08/12/2014US8803340 Geometric diode, applications and method
08/12/2014US8803339 Bump out for differential signals
08/12/2014US8803338 Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
08/12/2014US8803337 Integrated circuit structure having dies with connectors
08/12/2014US8803336 Semiconductor package
08/12/2014US8803334 Semiconductor package including a semiconductor chip with a through silicon via
08/12/2014US8803333 Three-dimensional chip stack and method of forming the same
08/12/2014US8803332 Delamination resistance of stacked dies in die saw
08/12/2014US8803330 Integrated circuit package system with mounting structure
08/12/2014US8803329 Semiconductor package and stacked semiconductor package
08/12/2014US8803328 Random coded integrated circuit structures and methods of making random coded integrated circuit structures
08/12/2014US8803326 Chip package
08/12/2014US8803325 Stacked semiconductor package
08/12/2014US8803322 Through substrate via structures and methods of forming the same
08/12/2014US8803321 Dual damascene dual alignment interconnect scheme
08/12/2014US8803319 Pillar structure having a non-planar surface for semiconductor devices
08/12/2014US8803318 Semiconductor chips including passivation layer trench structure
08/12/2014US8803317 Structures for improving current carrying capability of interconnects and methods of fabricating the same
08/12/2014US8803316 TSV structures and methods for forming the same
08/12/2014US8803315 High-frequency module and communication apparatus
08/12/2014US8803314 Hermetic packaging of integrated circuit components
08/12/2014US8803313 Group III nitride based flip-chip integrated circuit and method for fabricating
08/12/2014US8803312 Method for manufacturing semiconductor devices having a glass substrate
08/12/2014US8803311 Wiring boards and semiconductor packages including the same
08/12/2014US8803310 Embedded electronic device package structure
08/12/2014US8803309 Preamplifier integrated circuit on flex circuit for magnetic media storing devices
08/12/2014US8803308 Semiconductor device having chip crack detection structure
08/12/2014US8803307 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
08/12/2014US8803306 Fan-out package structure and methods for forming the same
08/12/2014US8803305 Hybrid package construction with wire bond and through silicon vias
08/12/2014US8803304 Semiconductor package and manufacturing method thereof
08/12/2014US8803303 Semiconductor device
08/12/2014US8803301 Semiconductor package
08/12/2014US8803300 Integrated circuit packaging system with protective coating and method of manufacture thereof
08/12/2014US8803299 Stacked integrated circuit package system
08/12/2014US8803298 Semiconductor device and manufacturing method of the same
08/12/2014US8803297 Semiconductor device including a stress relief layer and method of manufacturing
08/12/2014US8803296 Coatings for relatively movable surfaces
08/12/2014US8803290 Double broken seal ring
08/12/2014US8803282 Electronic device including a nonvolatile memory structure having an antifuse component
08/12/2014US8803281 Semiconductor device
08/12/2014US8803276 Electrostatic discharge (ESD) device and method of fabricating
08/12/2014US8803269 Wafer scale packaging platform for transceivers
08/12/2014US8803238 Plasma-induced damage (PID) protective diode in an open region of a well guard to increase the degree of integration of transustor of semiconductor device
08/12/2014US8803212 Three-dimensional crossbar array
08/12/2014US8803208 Method for fabricating contact electrode and semiconductor device
08/12/2014US8803206 3D semiconductor device and structure
08/12/2014US8802576 Semiconductor device and method of manufacturing the same
08/12/2014US8802558 Copper interconnect structures and methods of making same
08/12/2014US8802556 Barrier layer on bump and non-wettable coating on trace
08/12/2014US8802554 Patterns of passivation material on bond pads and methods of manufacture thereof
08/12/2014US8802513 Fin field effect transistors having a nitride containing spacer to reduce lateral growth of epitaxially deposited semiconductor materials
08/12/2014US8802507 Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure
08/12/2014US8802498 Method of manufacturing semiconductor package having no chip pad
08/12/2014US8802478 Method for manufacturing semiconductor device and method for manufacturing solid state image sensor using multiple insulation films
08/12/2014US8802476 Semiconductor thermocouple and sensor
08/12/2014US8801279 Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof
08/12/2014US8800640 Cooled base plate for electric components
08/07/2014WO2014121191A1 Aluminum printed circuit board for lighting and display backplanes
08/07/2014WO2014121090A1 Microelectronic package having wire bond vias, method of making and stiffening layer for same
08/07/2014WO2014121054A1 Led light fixture with integrated light shielding
08/07/2014WO2014121049A1 Led lighting fixture
08/07/2014WO2014120899A1 Alignment mark recovery with reduced topography
08/07/2014WO2014120896A1 Discrete component assembly
08/07/2014WO2014120894A1 Circuit assembly
08/07/2014WO2014120883A1 Multi-die wirebond packages with elongated windows
08/07/2014WO2014120807A1 High thermal conductivity materials for thermal management applications
08/07/2014WO2014120592A1 3d assembly for interposer bow
08/07/2014WO2014120484A1 Top package of a package-on-package for memory dies
08/07/2014WO2014120483A1 ULTRA THIN PoP PACKAGE
08/07/2014WO2014120195A1 Selecting circuits of a multi-level integrated circuit
08/07/2014WO2014120182A1 Liquid cooling
08/07/2014WO2014074933A3 Microelectronic assembly with thermally and electrically conductive underfill
08/07/2014US20140220776 Multi-Direction Design for Bump Pad Structures
08/07/2014US20140220774 Method of forming external terminals of a package and apparatus for performing the same
08/07/2014US20140220743 Power module package and method for manufacturing the same
08/07/2014US20140220742 Method for forming a thin semiconductor device
08/07/2014US20140220740 Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure
08/07/2014US20140220738 Lead frame array package with flip chip die attach
08/07/2014US20140220736 Power module package and method for fabricating the same
08/07/2014US20140220422 Stretchable electronic systems with fluid containment
08/07/2014US20140219523 Apparatus and method for fingerprinting sensing
08/07/2014US20140218885 Device Including a Semiconductor Chip and Wires
08/07/2014US20140218102 Integrated circuit
08/07/2014US20140218100 A New E-fuse Structure Design in Electrical Programmable Redundancy for Embedded Memory Circuit
08/07/2014US20140217622 Semiconductor Package Resin Composition and Usage Method Thereof
08/07/2014US20140217621 Encapsulation film
08/07/2014US20140217620 Semiconductor device and method for manufacturing the same
08/07/2014US20140217619 Microelectronic package having wire bond vias and stiffening layer
08/07/2014US20140217618 Method for making electronic device with liquid crystal polymer and related devices
08/07/2014US20140217615 Method of making a system-in-package device, and a system-in-package device
08/07/2014US20140217614 Integrated circuit film and method of manufacturing the same
08/07/2014US20140217613 Integrated device and fabrication process thereof
08/07/2014US20140217612 Electronic fuse having a damaged region
08/07/2014US20140217611 Stacked multilayer structure and manufacturing method thereof
08/07/2014US20140217610 3D Semiconductor Package Interposer with Die Cavity
08/07/2014US20140217609 Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street
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