Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/13/2014CN203774301U 具有沟槽侧面的引线框架 Has a groove on the side of the lead frame
08/13/2014CN203774300U 一种应用于sod323半导体封装的高密度框架 Applied to high-density semiconductor package framework sod323
08/13/2014CN203774299U 一种用于两种不同封装工艺要求的引线框架 One of the two lead frame technology requirements for different packages
08/13/2014CN203774298U 一种带电极压力装置的功率半导体模块 A power semiconductor module with a pressure device electrodes
08/13/2014CN203774297U 一种便于注塑的异型铜带 An easy-shaped copper injection
08/13/2014CN203774296U 一种多mosfet集成六桥臂封装模块 A multi-mosfet integrated six-arm package module
08/13/2014CN203774295U 一种用于半导体共晶工艺封装的背锡芯片 A semiconductor eutectic tin-chip technology package back
08/13/2014CN203774294U 一种封装结构 A packaged structure
08/13/2014CN203774293U 一种集成电路的3d封装结构 An integrated circuit packaging structure of 3d
08/13/2014CN203774292U 一种适用于高频ic芯片的qfn封装结构 One for high frequency ic chip package structure qfn
08/13/2014CN203774291U 一种金属连接件及功率半导体模块 Metal connectors and power semiconductor module
08/13/2014CN203774290U Ic电源芯片 Ic power chip
08/13/2014CN203774289U 半导体互连结构 Semiconductor interconnect structure
08/13/2014CN203774288U 一种晶体管的散热结构 Cooling structure for a transistor
08/13/2014CN203774287U 带散热功能的三维堆叠芯片 Three-dimensional stacked chips with heat function
08/13/2014CN203774286U 一种带散热装置的pop封装 Pop a package with heat sink
08/13/2014CN203774285U 一种功率模块封装用的散热基板 A power module package with heat dissipation board
08/13/2014CN203774284U 一种用于半导体封装的划片 A method for dicing a semiconductor package
08/13/2014CN203774283U 一种catv同轴器件封装结构 One kind catv coaxial device package structure
08/13/2014CN203774282U 一种基于半导体基板的3d封装装置 A packaging unit 3d based on the semiconductor substrate
08/13/2014CN203774281U 一种整体注塑封装的智能功率模块 Injection of a holistic package intelligent power module
08/13/2014CN203774280U 一种半导体塑封框架平面打胶结构 A semiconductor structure gluing plastic frame plane
08/13/2014CN203774279U 功率半导体模块 Power Semiconductor Modules
08/13/2014CN103988591A 用于固定散热器的压板 For fixing the radiator plate
08/13/2014CN103988302A 电力变换装置 The power conversion apparatus
08/13/2014CN103988301A 引线框架和使用该引线框架制造的半导体封装件 Lead frame and a semiconductor package using the lead frame produced
08/13/2014CN103988300A 具有穿模的第一级互连的3d集成电路封装件 3d die integrated circuit package having a through the first stage of interconnection
08/13/2014CN103988299A 用于操纵极薄器件晶片的方法 Manipulating method for thin device wafer
08/13/2014CN103988298A 半导体装置 Semiconductor device
08/13/2014CN103988297A 功率模块用基板、自带散热器的功率模块用基板、功率模块、助焊剂成分侵入防止层形成用浆料及接合体的接合方法 A power module substrate, the radiator comes power module substrate, a power module, a flux component to prevent intrusion of the slurry and the assembly method of joining layer
08/13/2014CN103988296A 具有多个热路径的堆叠半导体裸片组合件及相关联系统和方法 Stacked semiconductor die assemblies and systems and methods associated with a plurality of heat paths
08/13/2014CN103988294A 包括具有应力减轻结构的半导体衬底的封装组件 Package assembly comprises a semiconductor substrate having a structure of the stress mitigating
08/13/2014CN103987790A 导热性树脂组合物 The thermally conductive resin composition
08/13/2014CN103987785A 可固化组合物 The curable composition
08/13/2014CN103987781A 光学材料用树脂组合物 The resin composition for optical material
08/13/2014CN103987752A 环氧树脂混合物、环氧树脂组合物、预浸料及它们的固化物 The mixture of epoxy resin, the epoxy resin composition, a prepreg cured product thereof
08/13/2014CN103987657A 表面修饰金属氧化物粒子材料及光半导体元件密封组合物以及光半导体装置 Surface modification of metal oxide particles and the material of the composition for sealing an optical semiconductor element and an optical semiconductor device
08/13/2014CN103985747A GaAs/AlGaAs半导体异质结结构体及其制作方法 GaAs / AlGaAs semiconductor heterojunction structure and manufacturing method thereof
08/13/2014CN103985740A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/13/2014CN103985717A 一种阵列基板及其制备方法、显示装置 One kind of array substrate and its preparation method, a display device
08/13/2014CN103985714A 阵列基板及其制造方法 The method of manufacturing the array substrate and
08/13/2014CN103985710A 一种双向scr结构的esd防护器件 Esd protection device is a two-way scr structure
08/13/2014CN103985708A 薄膜晶体管阵列基板及其制作方法 The thin film transistor array substrate and manufacturing method thereof
08/13/2014CN103985704A 一种采用对称型并联的电力电子模块 A symmetrical parallel power electronic modules
08/13/2014CN103985703A 功率晶体管布置以及具有该布置的封装体 Power transistor arrangement and the arrangement of having the package
08/13/2014CN103985702A 电容器结构 Capacitor structure
08/13/2014CN103985701A 封装基板及其检测方法 Package substrate and detection methods
08/13/2014CN103985700A 封装结构的联机构件及其制法 Online member Jiqizhifa package structure
08/13/2014CN103985699A 银合金线 Silver alloy wire
08/13/2014CN103985698A 具有嵌入式滤波器的多层电子结构 Multilayer electronic structure with embedded filter
08/13/2014CN103985697A 互连接触结构及其制造方法 Interconnection contact structure and its manufacturing method
08/13/2014CN103985696A 具有金属-绝缘体-金属电容器的封装件及其制造方法 Having a metal - insulator - metal package and method for manufacturing a capacitor
08/13/2014CN103985695A 一种扇出型封装结构及其制作工艺 One kind of fan-out package structure and production process
08/13/2014CN103985694A 集成电路组件及其封装组件 IC assembly and packaging components
08/13/2014CN103985693A 无刷直流电机集成驱动电路的封装结构及其封装方法 Package and packaging method integrated brushless DC motor drive circuit
08/13/2014CN103985692A Ac-dc电源电路的封装结构及其封装方法 Package and packaging method Ac-dc power supply circuit
08/13/2014CN103985691A 半导体装置 Semiconductor device
08/13/2014CN103985690A 树脂密封型半导体装置及其制造方法 Resin sealing type semiconductor device and manufacturing method
08/13/2014CN103985689A 电子装置及其封装结构 Electronic device and a package structure
08/13/2014CN103985688A 芯片封装结构 Chip package structure
08/13/2014CN103985687A 用于半导体封装的银合金焊接导线 Silver alloy welding wire for semiconductor package
08/13/2014CN103985686A 一种igbt模块封装焊接结构 One kind of welded structures igbt module package
08/13/2014CN103985685A 功率半导体芯片的铜金属化结构及其制备方法 Power semiconductor chip copper metallization structure and preparation method
08/13/2014CN103985684A 晶片封装结构及其制作方法 Chip package structure and production methods
08/13/2014CN103985683A 晶片封装体 Chip package
08/13/2014CN103985682A 基板结构及其制造方法 Substrate structure and manufacturing method
08/13/2014CN103985681A 一种强化传热微通道 An enhanced heat transfer microchannel
08/13/2014CN103985680A 适用于发热器件的散热装置及其制备方法 The heat sink and its preparation method is applicable to the heat generating device
08/13/2014CN103985679A 包括穿孔箔片的3dic 封装件 Including 3dic perforated foil package
08/13/2014CN103985678A 电子控制单元和旋转电机 The electronic control unit and the rotary motor
08/13/2014CN103985677A 超薄塑封半导体元器件框架、元器件及其制备方法 Ultra-thin plastic semiconductor components framework, components and preparation method
08/13/2014CN103985676A 复合晶片及其制造方法 Composite and method of manufacturing a wafer
08/13/2014CN103985675A 半导体装置 Semiconductor device
08/13/2014CN103985674A 一种安全芯片防攻击结构及防攻击的方法 Structure and anti-attack attack a security chip proof method
08/13/2014CN103985671A 阵列基板制备方法和阵列基板、显示装置 Preparation array substrate and the array substrate, a display device
08/13/2014CN103985669A 金属互连结构及其制造方法 Metal interconnect structure and manufacturing method
08/13/2014CN103985667A 电性连接结构及其制备方法 Electrical connection structure and preparation method
08/13/2014CN103985645A 一种半导体封装件及制造方法 A semiconductor package and method of manufacture
08/13/2014CN103985644A 树脂密封型半导体装置的制造方法以及引脚架 The method of manufacturing a resin sealing type semiconductor device and a lead frame
08/13/2014CN103985641A 穿过衬底形成导电通孔的方法及由其产生的结构和组合件 Forming conductive vias through the substrate and the structure and method of assembly is produced by
08/13/2014CN103984442A 内嵌式有源矩阵有机发光二极管触控面板 Embedded active matrix organic light emitting diode touch panel
08/13/2014CN103978348A 一种电脑显示器背板左侧基板的加工方法及其结构 A method of processing a computer monitor back on the left side of the substrate and its structure
08/13/2014CN102593085B 芯片封装结构以及芯片封装制程 Chip package and chip packaging process
08/13/2014CN102569262B 一种纳米线围栅器件散热特性的测试结构和测试方法 A nano-wire fence device test structures and test methods of heat dissipation characteristics
08/13/2014CN102543961B 防静电破坏及防电磁波干扰的封装件及其制法 Anti-static and anti-electromagnetic interference undermine package Jiqizhifa
08/13/2014CN102437105B 具有部分冗余通孔的集成电路制作方法及集成电路 An integrated circuit and integrated circuit production method having the through-hole portion of the redundant
08/13/2014CN102412208B 芯片尺寸封装件及其制法 Chip size package Jiqizhifa
08/13/2014CN102348736B 半导体封装用树脂组合物和半导体装置 The resin composition for semiconductor encapsulation and a semiconductor device
08/13/2014CN102347358B 半导体器件结构及其制造方法 The semiconductor device structure and manufacturing method
08/13/2014CN102254928B 像素结构及电性桥接结构 Pixel structure and electrical bridge structure
08/13/2014CN102237354B 电路基板 Circuit board
08/13/2014CN102201394B 半导体晶片及其制造方法、以及半导体芯片 And a manufacturing method of a semiconductor wafer, and a semiconductor chip
08/13/2014CN102163583B 一种半导体器件的加热方法及装置 Heating method and apparatus for a semiconductor device
08/13/2014CN102157475B 电子器件及电子设备 Electronic devices and electronic equipment
08/13/2014CN102136479B Sram单元 Sram unit
08/13/2014CN102099282B 晶圆级封装半导体的方法 Wafer-level packaging method of a semiconductor
08/13/2014CN102034806B 静电放电防护装置 Electrostatic discharge protection device
08/13/2014CN101877683B 电容型隔离电路 Capacitive isolation circuit
08/13/2014CN101870444B 具有功能连结导线的微机电系统芯片 Connecting wires with functional MEMS chip
08/12/2014US8806420 In-grid on-device decoupling for BGA
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