| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/2009 | CN100479131C Method for manufacturing trajectory with enlarged capacitive coupling and corresponding trajectory |
| 04/15/2009 | CN100479124C Semiconductor device |
| 04/15/2009 | CN100479114C Method for forming copper wiring |
| 04/15/2009 | CN100479094C Method of forming a low thermal resistance device and structure |
| 04/14/2009 | US7518881 Interposer containing bypass capacitors for reducing voltage noise in an IC device |
| 04/14/2009 | US7518875 Securing heat sinks to a device under test |
| 04/14/2009 | US7518874 Heat sink assembly |
| 04/14/2009 | US7518873 Heat spreader, semiconductor package module and memory module having the heat spreader |
| 04/14/2009 | US7518867 Electronic device cooling device and electronic device cooling method |
| 04/14/2009 | US7518842 Circuits and methods that attenuate coupled noise |
| 04/14/2009 | US7518252 Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, method of crystallization, apparatus for crystallization, thin-film semiconductor device, and method of manufacturing thin-film semiconductor device |
| 04/14/2009 | US7518251 Stacked electronics for sensors |
| 04/14/2009 | US7518250 Semiconductor device and a method for manufacturing of the same |
| 04/14/2009 | US7518249 Electric component with a flip-chip construction |
| 04/14/2009 | US7518248 Inductive filters and methods of fabrication therefor |
| 04/14/2009 | US7518247 Semiconductor device and its manufacturing method |
| 04/14/2009 | US7518246 Atomic layer deposition of CeO2/Al2O3 films as gate dielectrics |
| 04/14/2009 | US7518245 Contact structure of a semiconductor device |
| 04/14/2009 | US7518244 Reducing line to line capacitance using oriented dielectric films |
| 04/14/2009 | US7518243 Semiconductor device with multilayer interconnection structure |
| 04/14/2009 | US7518242 Semiconductor testing device |
| 04/14/2009 | US7518241 Wafer structure with a multi-layer barrier in an UBM layer network device with power supply |
| 04/14/2009 | US7518240 Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication |
| 04/14/2009 | US7518239 Semiconductor device with substrate having penetrating hole having a protrusion |
| 04/14/2009 | US7518238 Mounting flexible circuits onto integrated circuit substrates |
| 04/14/2009 | US7518237 Microfeature systems including adhered microfeature workpieces and support members |
| 04/14/2009 | US7518236 Power circuit package and fabrication method |
| 04/14/2009 | US7518235 Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
| 04/14/2009 | US7518234 MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
| 04/14/2009 | US7518233 Sealing structure for multi-chip module |
| 04/14/2009 | US7518231 Differential chip performance within a multi-chip package |
| 04/14/2009 | US7518230 Semiconductor chip and semiconductor device |
| 04/14/2009 | US7518229 Versatile Si-based packaging with integrated passive components for mmWave applications |
| 04/14/2009 | US7518228 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 04/14/2009 | US7518227 Multiple die stack apparatus employing T-shaped interposer elements |
| 04/14/2009 | US7518226 Integrated circuit packaging system with interposer |
| 04/14/2009 | US7518225 Chip system architecture for performance enhancement, power reduction and cost reduction |
| 04/14/2009 | US7518224 Offset integrated circuit package-on-package stacking system |
| 04/14/2009 | US7518223 Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
| 04/14/2009 | US7518222 Apparatus and system for an IC substrate, socket, and assembly |
| 04/14/2009 | US7518221 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
| 04/14/2009 | US7518220 Substrate for an FBGA semiconductor component |
| 04/14/2009 | US7518219 Integrated heat spreader lid |
| 04/14/2009 | US7518218 Total ionizing dose suppression transistor architecture |
| 04/14/2009 | US7518217 Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
| 04/14/2009 | US7518209 Isolation of a high-voltage diode between a high-voltage region and a low-voltage region of an integrated circuit |
| 04/14/2009 | US7518205 Semiconductor package and method for manufacturing the same |
| 04/14/2009 | US7518200 Semiconductor integrated circuit chip with a nano-structure-surface passivation film |
| 04/14/2009 | US7518193 SRAM array and analog FET with dual-strain layers comprising relaxed regions |
| 04/14/2009 | US7518192 Asymmetrical layout structure for ESD protection |
| 04/14/2009 | US7518190 Grounding front-end-of-line structures on a SOI substrate |
| 04/14/2009 | US7518164 Current-triggered low turn-on voltage SCR |
| 04/14/2009 | US7518157 Optoelectronic component assembly |
| 04/14/2009 | US7518156 Semiconductor device |
| 04/14/2009 | US7517797 Carrier for wafer-scale package, wafer-scale package including the carrier, and methods |
| 04/14/2009 | US7517792 Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof |
| 04/14/2009 | US7517790 Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification |
| 04/14/2009 | US7517788 System, apparatus, and method for advanced solder bumping |
| 04/14/2009 | US7517787 C4 joint reliability |
| 04/14/2009 | US7517783 Molybdenum-doped indium oxide structures and methods |
| 04/14/2009 | US7517778 Structure of high performance combo chip and processing method |
| 04/14/2009 | US7517763 Semiconductor device having fuse and capacitor at the same level and method of fabricating the same |
| 04/14/2009 | US7517762 Semiconductor device capable of preventing moisture-absorption of fuse area thereof and method for manufacturing the fuse area |
| 04/14/2009 | US7517749 Method for forming an array with polysilicon local interconnects |
| 04/14/2009 | US7517738 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor |
| 04/14/2009 | US7517734 Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device |
| 04/14/2009 | US7517722 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds |
| 04/14/2009 | US7517712 Wafer-level hermetic micro-device packages |
| 04/14/2009 | US7517620 Method for fabricating array substrate having color filter on thin film transistor structure for liquid crystal display device |
| 04/14/2009 | US7517606 Fuel cells and batteries including metal-carbon composite powders |
| 04/14/2009 | US7517568 Packaging for dilute hypochlorite |
| 04/14/2009 | US7517444 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 04/14/2009 | US7517225 Connector with wipe |
| 04/14/2009 | US7516878 Bump formation method and bump forming apparatus for semiconductor wafer |
| 04/09/2009 | WO2009046030A1 Stackable integrated circuit package |
| 04/09/2009 | WO2009045803A1 Ball grid array assembly and solder pad |
| 04/09/2009 | WO2009045763A1 Systems, methods and devices for arbitrating die stack position in a multi-die stack device |
| 04/09/2009 | WO2009045716A1 Proximity communication package for processor, cache and memory |
| 04/09/2009 | WO2009045711A1 Alignment features for proximity communication |
| 04/09/2009 | WO2009045693A1 Multi-chip module and proximity communication between chips in the module |
| 04/09/2009 | WO2009045626A1 Packaged integrated circuit devices with through- body conductive vias, and methods of making same |
| 04/09/2009 | WO2009045362A1 Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure |
| 04/09/2009 | WO2009045342A1 Semiconductor package having a bridged plate interconnection |
| 04/09/2009 | WO2009045008A2 Circuit protection device |
| 04/09/2009 | WO2009044987A1 Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package |
| 04/09/2009 | WO2009044822A1 Copper alloy plate material for electric and electronic components |
| 04/09/2009 | WO2009044737A1 Electronic component |
| 04/09/2009 | WO2009044583A1 Active matrix substrate, method for manufacturing active matrix substrate, and liquid crystal display device |
| 04/09/2009 | WO2009044529A1 Method for producing hydrophobilized porous film |
| 04/09/2009 | WO2009043670A2 Electronic circuit composed of sub-circuits and method for producing the same |
| 04/09/2009 | WO2009022252A3 Bond pad arrangement of an integrated circuit |
| 04/09/2009 | WO2009018016A3 Solar heat management in photovoltaic systems using phase change materials |
| 04/09/2009 | WO2009006284A3 Semiconductor die having a redistribution layer |
| 04/09/2009 | WO2009001280A3 A method for the production of a microelectronic sensor device |
| 04/09/2009 | WO2008045177A3 Electronic device and lead frame |
| 04/09/2009 | WO2007145790A3 An integrated circuit device having barrier and method of fabricating the same |
| 04/09/2009 | WO2007039892A3 Microelectronic intercionnect substrate and packaging techniques |
| 04/09/2009 | WO2007009024A3 Folded frame carrier for mosfet bga |
| 04/09/2009 | WO2006084177A3 Nested integrated circuit package on package system |
| 04/09/2009 | WO2006050439A3 Multichip semiconductor package |