| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/08/2009 | CN100477173C Optical device and method for fabricating the same |
| 04/08/2009 | CN100477155C Method for manufacturing semiconductor device having multilevel wiring |
| 04/08/2009 | CN100477141C Semiconductor package device and method of formation and testing |
| 04/08/2009 | CN100477140C Packing component of semiconductor and preparing method thereof |
| 04/08/2009 | CN100477138C Terminal electrode forming method of chip electronic element and apparatus therefor |
| 04/08/2009 | CN100477136C Circuit board and construction structure |
| 04/08/2009 | CN100477119C Film forming method, semiconductor device manufacturing method, semiconductor device and film forming device |
| 04/08/2009 | CN100477116C Method and apparatus for forming silicon oxide film |
| 04/08/2009 | CN100476869C Method for manufacturing electronic device |
| 04/08/2009 | CN100476746C Integrated circuit with defect tolerant redundancy and measuring method thereof |
| 04/08/2009 | CN100476599C Photoetching mark structure, photoetching projection device comprising the photoetching mark structure, and method for aligning with the photoetching mark structure |
| 04/08/2009 | CN100475991C Composite material, method for producing same and member using same |
| 04/07/2009 | US7516436 Method for manufacturing a power bus on a chip |
| 04/07/2009 | US7515895 System and method for on-chip filter tuning |
| 04/07/2009 | US7515447 Method and arrangement in inverter |
| 04/07/2009 | US7515426 Heat dissipating device for an integrated circuit chip |
| 04/07/2009 | US7515416 Structures for holding cards incorporating electronic and/or micromachined components |
| 04/07/2009 | US7515411 Multi-fan airflow regulation for fan fail conditions |
| 04/07/2009 | US7515243 Display device and method for repairing line disconnection thereof |
| 04/07/2009 | US7515074 Coding information in integrated circuits |
| 04/07/2009 | US7514853 MEMS structure having a stress inverter temperature-compensated resonating member |
| 04/07/2009 | US7514802 Wiring board |
| 04/07/2009 | US7514801 Electronic device and method of manufacturing thereof |
| 04/07/2009 | US7514800 Semiconductor device and wire bonding method therefor |
| 04/07/2009 | US7514799 Connecting structure used in a chip module |
| 04/07/2009 | US7514798 Arrangement for the protection of three-dimensional structures on wafers |
| 04/07/2009 | US7514797 Multi-die wafer level packaging |
| 04/07/2009 | US7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
| 04/07/2009 | US7514795 Semiconductor integrated circuit having improved power supply wiring |
| 04/07/2009 | US7514794 Semiconductor integrated circuit and the method of designing the layout |
| 04/07/2009 | US7514793 Metal interconnection lines of semiconductor devices and methods of forming the same |
| 04/07/2009 | US7514792 Semiconductor device and manufacturing method thereof |
| 04/07/2009 | US7514791 High reliability multilayer circuit substrates |
| 04/07/2009 | US7514789 Ball grid array package-to-board interconnect co-design apparatus |
| 04/07/2009 | US7514787 Semiconductor device |
| 04/07/2009 | US7514786 Semiconductor chip electrical connection structure |
| 04/07/2009 | US7514785 Semiconductor device and manufacturing method thereof |
| 04/07/2009 | US7514784 Electronic circuit device and production method of the same |
| 04/07/2009 | US7514783 Semiconductor module |
| 04/07/2009 | US7514782 Semiconductor device |
| 04/07/2009 | US7514781 Circuit substrate and manufacturing method thereof |
| 04/07/2009 | US7514780 Power semiconductor device |
| 04/07/2009 | US7514779 Multilayer build-up wiring board |
| 04/07/2009 | US7514777 Power semiconductor module |
| 04/07/2009 | US7514776 Semiconductor/printed circuit board assembly, and computer system |
| 04/07/2009 | US7514775 Stacked structures and methods of fabricating stacked structures |
| 04/07/2009 | US7514774 Stacked multi-chip package with EMI shielding |
| 04/07/2009 | US7514773 Systems and arrangements for interconnecting integrated circuit dies |
| 04/07/2009 | US7514772 Method of manufacturing a semiconductor apparatus |
| 04/07/2009 | US7514771 Leadless lead-frame |
| 04/07/2009 | US7514770 Stack structure of carrier board embedded with semiconductor components and method for fabricating the same |
| 04/07/2009 | US7514769 Micro surface mount die package and method |
| 04/07/2009 | US7514768 Package structure for a semiconductor device incorporating enhanced solder bump structure |
| 04/07/2009 | US7514767 Fan out type wafer level package structure and method of the same |
| 04/07/2009 | US7514765 Solution of power consumption reduction for inverter covered by metal case |
| 04/07/2009 | US7514764 Materials and methods for creating imaging layers |
| 04/07/2009 | US7514751 SiGe DIAC ESD protection structure |
| 04/07/2009 | US7514750 Semiconductor device and fabrication method suitable therefor |
| 04/07/2009 | US7514749 Semiconductor device and a method of manufacturing the same |
| 04/07/2009 | US7514747 Silicon-on-insulator semiconductor device |
| 04/07/2009 | US7514724 Solid state light source having a variable number of dies |
| 04/07/2009 | US7514713 Liquid crystal display panel |
| 04/07/2009 | US7514671 Optical disk apparatus |
| 04/07/2009 | US7514355 Multilayer interconnection structure and method for forming the same |
| 04/07/2009 | US7514352 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases |
| 04/07/2009 | US7514350 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
| 04/07/2009 | US7514335 Semiconductor device and method of manufacturing the same |
| 04/07/2009 | US7514322 Shielded gate field effect transistor |
| 04/07/2009 | US7514300 Mold compound cap in a flip chip multi-matrix array package and process of making same |
| 04/07/2009 | US7514298 Printed wiring board for mounting semiconductor |
| 04/07/2009 | US7514292 Individualized low parasitic power distribution lines deposited over active integrated circuits |
| 04/07/2009 | US7514289 Methods and structures for facilitating proximity communication |
| 04/07/2009 | US7514279 Optoelectronic component and method for producing it |
| 04/07/2009 | US7514274 Enhanced uniqueness for pattern recognition |
| 04/07/2009 | US7514273 Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel |
| 04/07/2009 | US7513437 Security marking and security mark |
| 04/07/2009 | US7513298 Cooling element for eliminating electromagnetic noise |
| 04/07/2009 | US7513037 Method of embedding components in multi-layer circuit boards |
| 04/07/2009 | US7513031 Method for forming an inductor in a ceramic substrate |
| 04/07/2009 | US7513022 Method for manufacturing surface acoustic wave device |
| 04/02/2009 | WO2009042835A1 Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing |
| 04/02/2009 | WO2009042546A2 Stacked dual-die packages, methods of making, and systems incorporating said packages |
| 04/02/2009 | WO2009042500A2 Method for stacking semiconductor chips |
| 04/02/2009 | WO2009041950A1 Method of manufacturing a mems package using partially reactivated desiccant |
| 04/02/2009 | WO2009041472A1 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
| 04/02/2009 | WO2009041300A1 Heat conductive sheet and power module |
| 04/02/2009 | WO2009041197A1 Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy |
| 04/02/2009 | WO2009041159A1 Element mounting substrate, method for manufacturing element mounting substrate, circuit device, method for manufacturing circuit device, and portable device |
| 04/02/2009 | WO2009041044A1 Semiconductor module, method for manufacturing semiconductor module, and portable device |
| 04/02/2009 | WO2009040366A1 Directly injected forced convection cooling for electronics |
| 04/02/2009 | WO2009039921A1 Method for the production of a device, use of a mechanical alternating field during the production of a device, and device |
| 04/02/2009 | WO2009039774A1 A manufacturing method of a heat transfer device without pouring tube |
| 04/02/2009 | WO2009039631A1 Carrier chip with cavity |
| 04/02/2009 | WO2009039554A1 Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards |
| 04/02/2009 | WO2009039550A1 Method of wire bond encapsulation profiling |
| 04/02/2009 | WO2009020755A3 Intermetallic conductors |
| 04/02/2009 | WO2009017999A3 Dual side cooling integrated power device package and module and methods of manufacture |
| 04/02/2009 | WO2009017314A3 Head socket for contacting probe card and wafer test apparatus |
| 04/02/2009 | WO2009016531A3 Reduced bottom roughness of stress buffering element of a semiconductor component |
| 04/02/2009 | WO2009014985A3 Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires |