| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/29/2009 | CN101419966A Semiconductor integrated circuit device |
| 04/29/2009 | CN101419965A Circuit device and method of manufacturing the same |
| 04/29/2009 | CN101419964A Device with a plurality of semiconductor chips |
| 04/29/2009 | CN101419963A Wafer-wafer encapsulation body and manufacturing process therefor |
| 04/29/2009 | CN101419962A LED, production method therefore and illuminator manufactured by the LED |
| 04/29/2009 | CN101419961A Heat radiating device for LED and manufacturing method therefor |
| 04/29/2009 | CN101419960A Method for eliminating alternate word line bridging |
| 04/29/2009 | CN101419959A Chip encapsulation construction, chip bearing belt and flattening method therefor |
| 04/29/2009 | CN101419958A Semiconductor device and its fabrication process |
| 04/29/2009 | CN101419957A Semiconductor device and its fabrication process |
| 04/29/2009 | CN101419956A Semiconductor device |
| 04/29/2009 | CN101419955A Bonded structure and production method thereof |
| 04/29/2009 | CN101419954A Contraposition device for chip encapsulation construction |
| 04/29/2009 | CN101419953A Junction construction used for an encapsulation device |
| 04/29/2009 | CN101419952A Wafer stage chip encapsulation method and encapsulation construction |
| 04/29/2009 | CN101419951A Heat radiating device used for semiconductor power module |
| 04/29/2009 | CN101419950A Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
| 04/29/2009 | CN101419949A Circuit apparatus and method of manufacturing the same |
| 04/29/2009 | CN101419948A Semiconductor device and method for fabricating the same |
| 04/29/2009 | CN101419947A Transition metal oxide p-n hetero-junction and preparation method thereof |
| 04/29/2009 | CN101419935A Method for fabricating metal line of the semiconductor device |
| 04/29/2009 | CN101419934A Method for improving contact window electricity leakage due to short circuit in integrated circuit device and contact window thereof |
| 04/29/2009 | CN101419920A Method for manufacturing a semiconductor component and structure therefor |
| 04/29/2009 | CN101419919A Semiconductor chip mounting method, method for producing semiconductor mounting routing board and semicondonductor mounting routing board |
| 04/29/2009 | CN101419918A Method of manufacturing printed circuit board and printed circuit board manufactured by the same |
| 04/29/2009 | CN101418948A Heat radiation method for LED module |
| 04/29/2009 | CN101418947A Heat radiation structure and LED lamp |
| 04/29/2009 | CN101418946A Structure of LED heat radiating module, processing method and high heat radiation LED lamp |
| 04/29/2009 | CN101418937A High heat radiation aluminium-based copper foil coated laminated plate for LED illumination and fabrication technology thereof |
| 04/29/2009 | CN101418206A Encapsulating material composition of LED |
| 04/29/2009 | CN101417785A Wafer-level sensing element packaging structure and method for producing the same |
| 04/29/2009 | CN100484381C Method for combining radiating fin with heat-transfer pipe |
| 04/29/2009 | CN100484380C Heat sink |
| 04/29/2009 | CN100484379C Heat sink and test fixture of using the same |
| 04/29/2009 | CN100484378C Method for manufacturing radiator |
| 04/29/2009 | CN100484377C Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
| 04/29/2009 | CN100484363C Wiring circuit board and production method thereof |
| 04/29/2009 | CN100484199C Camera assembly package |
| 04/29/2009 | CN100483727C Wafer level chip scale package of image sensor and manufacturing method thereof |
| 04/29/2009 | CN100483726C Image sensing device packaging digital camera module group using the same |
| 04/29/2009 | CN100483725C Image sensing device packaging digital camera module group using the same |
| 04/29/2009 | CN100483723C Pixel structure |
| 04/29/2009 | CN100483721C Semiconductor device and method of fabricating the same |
| 04/29/2009 | CN100483715C CMOS compatible shallow-trench e-fuse structure and method of manufacturing the same |
| 04/29/2009 | CN100483711C Surge protector for containing packed semiconductor |
| 04/29/2009 | CN100483709C Light emitting diode packaging structure |
| 04/29/2009 | CN100483708C Structure of integrated circuit |
| 04/29/2009 | CN100483707C Lead frame for semiconductor device |
| 04/29/2009 | CN100483706C An integrated circuit package substrate having a thin film capacitor structure |
| 04/29/2009 | CN100483705C Method against device lamination inside semiconductor plastic packer |
| 04/29/2009 | CN100483704C Module for EPAS/EHPAS applications |
| 04/29/2009 | CN100483703C Piled semiconductor packing structure and its production |
| 04/29/2009 | CN100483702C Semiconductor device, display device and method for manufacturing thereof, and television device |
| 04/29/2009 | CN100483701C An encapsulation image compensation method and device for ball array encapsulation welding tray |
| 04/29/2009 | CN100483700C Conductive oxide electrode material and its preparation method |
| 04/29/2009 | CN100483699C Semiconductor device package utilizing proud interconnect material |
| 04/29/2009 | CN100483698C Porous low-K dielectric interconnect structures |
| 04/29/2009 | CN100483697C Structure and method for fabrication of leadless multi-die carrier |
| 04/29/2009 | CN100483696C Heat radiation material and its production method |
| 04/29/2009 | CN100483695C Direct chip attach structure and method |
| 04/29/2009 | CN100483694C Package for semiconductor devices |
| 04/29/2009 | CN100483693C Semiconductor package and method for manufacturing the same |
| 04/29/2009 | CN100483692C IC card and its producing method |
| 04/29/2009 | CN100483678C Semiconductor structure and method of forming the same |
| 04/29/2009 | CN100483661C Package method for preventing chip interference and its package structure |
| 04/29/2009 | CN100483658C Mold compound cap in a flip chip multi-matrix array package and process of making same |
| 04/29/2009 | CN100483653C Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias |
| 04/29/2009 | CN100483648C Semiconductor device and producing method and electroplating liquid |
| 04/29/2009 | CN100483629C Semiconductor device and method of manufacturing the same |
| 04/29/2009 | CN100482866C Surface-treated al sheet excellent in solderability, heat sink using the same, and method for producing surface-treated al sheet excellent in solderability |
| 04/28/2009 | US7525817 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 04/28/2009 | US7525804 Semiconductor device and method of manufacturing the same |
| 04/28/2009 | US7525330 Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identity of the semiconductor device |
| 04/28/2009 | US7525202 Quantum computational systems |
| 04/28/2009 | US7525201 Semiconductor chip having solder bumps and dummy bumps |
| 04/28/2009 | US7525200 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
| 04/28/2009 | US7525199 Packaging for proximity communication positioned integrated circuits |
| 04/28/2009 | US7525198 Wiring structure of a semiconductor device |
| 04/28/2009 | US7525196 Protection of seedlayer for electroplating |
| 04/28/2009 | US7525194 System including self-assembled interconnections |
| 04/28/2009 | US7525193 Semiconductor device and method of manufacturing the same |
| 04/28/2009 | US7525192 Printed circuit board with quartz crystal oscillator |
| 04/28/2009 | US7525191 Semiconductor light source device |
| 04/28/2009 | US7525190 Printed wiring board with wiring pattern having narrow width portion |
| 04/28/2009 | US7525189 Semiconductor device, wiring board, and manufacturing method thereof |
| 04/28/2009 | US7525188 Multilayer circuit board and production method for same |
| 04/28/2009 | US7525187 Apparatus and method for connecting components |
| 04/28/2009 | US7525186 Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same |
| 04/28/2009 | US7525185 Semiconductor device package having multi-chips with side-by-side configuration and method of the same |
| 04/28/2009 | US7525184 Semiconductor device and its manufacturing method |
| 04/28/2009 | US7525183 Surface mount multichip devices |
| 04/28/2009 | US7525182 Multi-package module and electronic device using the same |
| 04/28/2009 | US7525181 Tape wiring substrate and tape package using the same |
| 04/28/2009 | US7525180 Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package |
| 04/28/2009 | US7525179 Lead frame structure with aperture or groove for flip chip in a leaded molded package |
| 04/28/2009 | US7525178 Semiconductor device with capacitively coupled field plate |
| 04/28/2009 | US7525167 Semiconductor device with simplified constitution |
| 04/28/2009 | US7525159 Turn-on-efficient bipolar structures for on-chip ESD protection |
| 04/28/2009 | US7525156 Shallow trench isolation fill by liquid phase deposition of SiO2 |
| 04/28/2009 | US7525151 Vertical DMOS device in integrated circuit |