| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/02/2009 | WO2009013315A3 Semiconductor substrate with through-contact and method for production thereof |
| 04/02/2009 | WO2009007929A3 Integrated circuits on a wafer and methods for manufacturing integrated circuits |
| 04/02/2009 | WO2008150775A3 Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof |
| 04/02/2009 | WO2008144856A3 Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances |
| 04/02/2009 | WO2007106653A3 Led with integral thermal via |
| 04/02/2009 | WO2006058030A3 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
| 04/02/2009 | WO2005104231A3 Multi-substrate circuit assembly |
| 04/02/2009 | WO2005048307A3 Flip chip interconnection pad layout |
| 04/02/2009 | WO2005038863A3 Method and system for treating a dielectric film |
| 04/02/2009 | WO2005038859A3 Liquid cooling system |
| 04/02/2009 | WO2005020648A3 Copper-faced modules, imprinted copper circuits, and their application to suptercomputers |
| 04/02/2009 | US20090087987 Method of making a semiconductor device having improved contacts |
| 04/02/2009 | US20090087948 Flip chip package with advanced electrical and thermal properties for high current designs |
| 04/02/2009 | US20090086206 Tunable semiconductor laser device, manufacturing method therefor, and gas detector using therewith |
| 04/02/2009 | US20090085810 Integrated circuit package including miniature antenna |
| 04/02/2009 | US20090085599 Semiconductor device having ESD protection circuit and method of testing the same |
| 04/02/2009 | US20090085446 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 04/02/2009 | US20090085233 Alignment features for proximity communication |
| 04/02/2009 | US20090085232 Method of reducing memory card edge roughness by edge coating |
| 04/02/2009 | US20090085231 Method of reducing memory card edge roughness by particle blasting |
| 04/02/2009 | US20090085230 Semiconductor device and layout method thereof |
| 04/02/2009 | US20090085229 Audio power amplifier package |
| 04/02/2009 | US20090085228 Die warpage control |
| 04/02/2009 | US20090085227 Flip-chip mounting body and flip-chip mounting method |
| 04/02/2009 | US20090085226 Method and arrangement for contact-connecting semiconductor chips on a metallic substrate |
| 04/02/2009 | US20090085225 Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same |
| 04/02/2009 | US20090085224 Stack-type semiconductor package |
| 04/02/2009 | US20090085223 Semiconductor device and semiconductor memory device |
| 04/02/2009 | US20090085222 Electronic apparatus and manufacturing method thereof |
| 04/02/2009 | US20090085221 Multi-host interface controller with USB PHY/analog functions integrated in a single package |
| 04/02/2009 | US20090085220 Semiconductor component and method of manufacturing |
| 04/02/2009 | US20090085219 Power semiconductor arrangement |
| 04/02/2009 | US20090085218 Flash memory device and fabricating method thereof |
| 04/02/2009 | US20090085217 Semiconductor device and method of making semiconductor device |
| 04/02/2009 | US20090085216 Semiconductor device |
| 04/02/2009 | US20090085215 Semiconductor component comprising copper metallizations |
| 04/02/2009 | US20090085214 Semiconductor device and method of fabricating the same |
| 04/02/2009 | US20090085213 Semiconductor device and method of fabrication |
| 04/02/2009 | US20090085212 Cladded silver and silver alloy metallization for improved adhesion electromigration resistance |
| 04/02/2009 | US20090085211 Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing |
| 04/02/2009 | US20090085210 Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits |
| 04/02/2009 | US20090085209 Semiconductor device with copper wirebond sites and methods of making same |
| 04/02/2009 | US20090085208 Semiconductor device |
| 04/02/2009 | US20090085207 Ball grid array substrate package and solder pad |
| 04/02/2009 | US20090085206 Method of forming solder bumps on substrates |
| 04/02/2009 | US20090085205 Method for manufacturing an electronic component package and electronic component package |
| 04/02/2009 | US20090085204 Wafer-level package and method of manufacturing the same |
| 04/02/2009 | US20090085203 Method for Exchanging Semiconductor Chip of Flip-Chip Module and Flip-Chip Module Suitable Therefor |
| 04/02/2009 | US20090085202 Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer |
| 04/02/2009 | US20090085201 Direct device attachment on dual-mode wirebond die |
| 04/02/2009 | US20090085200 Low loss radio frequency signal communication within a package, a board and/or a wave guide |
| 04/02/2009 | US20090085199 Integrated circuit package system with mold lock subassembly |
| 04/02/2009 | US20090085198 Nanotube based vapor chamber for die level cooling |
| 04/02/2009 | US20090085197 Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Transfer Components |
| 04/02/2009 | US20090085196 Integrated circuit chip manufaturing method and semiconductor device |
| 04/02/2009 | US20090085195 Method of Making Microelectronic Package Using Integrated Heat Spreader Stiffener Panel and Microelectronic Package Formed According to the Method |
| 04/02/2009 | US20090085194 Wafer level packaged mems device |
| 04/02/2009 | US20090085193 Heat-releasing printed circuit board and semiconductor chip package |
| 04/02/2009 | US20090085192 Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof |
| 04/02/2009 | US20090085191 Environment-Resistant Module, Micropackage And Methods Of Manufacturing Same |
| 04/02/2009 | US20090085190 Semiconductor Device and Method for Making Same |
| 04/02/2009 | US20090085189 Power semiconductor module |
| 04/02/2009 | US20090085188 Power semiconductor module |
| 04/02/2009 | US20090085187 Loading mechanism for bare die packages and lga socket |
| 04/02/2009 | US20090085186 Semiconductor Device and Methods of Manufacturing Semiconductor Devices |
| 04/02/2009 | US20090085185 Stack-type semiconductor package, method of forming the same and electronic system including the same |
| 04/02/2009 | US20090085184 Semiconductor package and method of fabricating the same |
| 04/02/2009 | US20090085183 Integrated-circuit package for proximity communication |
| 04/02/2009 | US20090085182 Semiconductor device and method for manufacturing the same |
| 04/02/2009 | US20090085181 Integrated circuit package system with multiple die |
| 04/02/2009 | US20090085180 Packaging carrier with high heat dissipation and method for manufacturing the same |
| 04/02/2009 | US20090085179 Semiconductor device |
| 04/02/2009 | US20090085178 Integrated circuit packaging system with base structure device |
| 04/02/2009 | US20090085177 Integrated circuit package system with leadframe array |
| 04/02/2009 | US20090085175 Semiconductor device containing a buried threshold voltage adjustment layer and method of forming |
| 04/02/2009 | US20090085174 Structural body and manufacturing method thereof |
| 04/02/2009 | US20090085173 Sidewall protection layer |
| 04/02/2009 | US20090085172 Deposition Method, Deposition Apparatus, Computer Readable Medium, and Semiconductor Device |
| 04/02/2009 | US20090085170 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device |
| 04/02/2009 | US20090085168 Semiconductor device and method for manufacturing same |
| 04/02/2009 | US20090085164 Wiring board |
| 04/02/2009 | US20090085152 Three dimensional vertical e-fuse structures and methods of manufacturing the same |
| 04/02/2009 | US20090085139 Solid-state image sensing device and method for manufacturing the same |
| 04/02/2009 | US20090085138 Glass cap molding package, manufacturing method thereof and camera module |
| 04/02/2009 | US20090085116 Semiconductor device and method of manufacturing the same |
| 04/02/2009 | US20090085082 Controlled intermixing of hfo2 and zro2 dielectrics enabling higher dielectric constant and reduced gate leakage |
| 04/02/2009 | US20090085061 High-voltage semiconductor switching element |
| 04/02/2009 | US20090085038 Substrate for display device, manufacturing method for same and display device |
| 04/02/2009 | US20090085031 Wafer-Shaped Measuring Apparatus and Method for Manufacturing the Same |
| 04/02/2009 | DE202009000528U1 Schutzdeckel für Kühlkörper Protective cover for heat sink |
| 04/02/2009 | DE202007018748U1 Teststruktur für Messfühler für differentielle Signale Test structure for measuring probe for differential signals |
| 04/02/2009 | DE19921230B4 Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten A method of handling of the thinned chip for insertion into chip cards |
| 04/02/2009 | DE19831458B4 Elektrischer Schalter, insbesondere für ein Akku-Elektrowerkzeug Electric switch, in particular for a cordless power tool |
| 04/02/2009 | DE112007000352T5 Mehrchip-Modul für Batterie-Leistungsregelung A multi-chip module for battery-power control |
| 04/02/2009 | DE112006003861T5 Halbleiterbaugruppe und Verfahren zur Herstellung einer Halbleiterbaugruppe A semiconductor package and method for manufacturing a semiconductor package |
| 04/02/2009 | DE112005001365T5 Wärmeableitungseinrichtung mit verbesserter Siede/Kondensationsstruktur Heat dissipation device with improved boiling / condensation structure |
| 04/02/2009 | DE102008046864A1 Halbleiterbauelement mit Kondensator A semiconductor device having capacitor |
| 04/02/2009 | DE102008046724A1 Semiconductor device for converting alternating current into direct current produced by alternator arranged in vehicle, has solder connection section connecting part of device with semiconductor element |
| 04/02/2009 | DE102008045744A1 Halbleiterbauelement mit einer an eine Rückseite eines Chips gekoppelten Elektronikkomponente A semiconductor device having a coupled to a backside of a chip electronic component |
| 04/02/2009 | DE102008045551A1 Elektronischer Schaltkreis und Verfahren zum Herstellen eines elektronischen Schaltkreises The electronic switching circuit and method for producing an electronic circuit |