| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/01/2009 | CN100474767C Elastic wave device and package substrate |
| 04/01/2009 | CN100474758C LC oscillator |
| 04/01/2009 | CN100474652C Active matrix electroluminescence device and method for fabricating the same |
| 04/01/2009 | CN100474596C Solid-state imaging device and method for making the same |
| 04/01/2009 | CN100474595C Semiconductor device |
| 04/01/2009 | CN100474589C Semiconductor anti-static protection structure |
| 04/01/2009 | CN100474582C Mixed integrated circuit device and manufacturing method thereof |
| 04/01/2009 | CN100474581C Bridging multi-chip packaging structure |
| 04/01/2009 | CN100474579C 电路装置 Circuit means |
| 04/01/2009 | CN100474578C Electrostatic-proof protection structure using NMOS |
| 04/01/2009 | CN100474577C Base board and electric test method therefor |
| 04/01/2009 | CN100474576C Semiconductor device |
| 04/01/2009 | CN100474575C Semiconductor device and manufacturing method thereof |
| 04/01/2009 | CN100474574C Chip package |
| 04/01/2009 | CN100474573C Semiconductor device and manufacturing method thereof |
| 04/01/2009 | CN100474572C Connector for making electrical contact at semiconductor scales and method for forming the same |
| 04/01/2009 | CN100474571C Semiconductor device and power supply system |
| 04/01/2009 | CN100474570C Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby |
| 04/01/2009 | CN100474566C Radio chip |
| 04/01/2009 | CN100474561C Method for integrating insulation film between fluorine doped silicon oxide glass layers |
| 04/01/2009 | CN100474559C Wiring over substrate, semiconductor device, and methods for manufacturing thereof |
| 04/01/2009 | CN100474544C Semiconductor device and method of making the same |
| 04/01/2009 | CN100474543C Semiconductor device and method of making the same |
| 04/01/2009 | CN100474542C Method for forming conduction protruding block and structure of the conduction protruding block |
| 04/01/2009 | CN100474539C Wafer-level coated copper stud bumps |
| 04/01/2009 | CN100474530C Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film |
| 04/01/2009 | CN100474519C Three beam MEMS device and correlation method |
| 04/01/2009 | CN100474514C Fabrication method of semiconductor integrated circuit device |
| 04/01/2009 | CN100474509C Integrated circuit with a capacitor and method for the production thereof |
| 04/01/2009 | CN100474459C Surface mounted high-molecular based circuit protector and preparing process thereof |
| 04/01/2009 | CN100474414C Heat source , optical pickup assembly employing the heat source and method for reducing temperature therein |
| 04/01/2009 | CN100474080C Liquid crystal display device and method of fabricating the same |
| 03/31/2009 | US7512422 RF generator with commutation inductor |
| 03/31/2009 | US7511982 High speed OTP sensing scheme |
| 03/31/2009 | US7511383 An inorganic porous fine particle supporting a preferably triphosphazene-modified, phenol end-capped polyether, and an encapsulating epoxy or bismaleimide resin; bromine and antimony-free; nontoxic; improved hydrolysis resistance in high humidity |
| 03/31/2009 | US7511382 Semiconductor chip arrangement and method |
| 03/31/2009 | US7511381 Thin film transistor and method of manufacturing the same |
| 03/31/2009 | US7511380 Semiconductor chip and method manufacturing the same |
| 03/31/2009 | US7511379 Surface mountable direct chip attach device and method including integral integrated circuit |
| 03/31/2009 | US7511378 Enhancement of performance of a conductive wire in a multilayered substrate |
| 03/31/2009 | US7511377 Semiconductor integrated circuit device and process for manufacturing the same |
| 03/31/2009 | US7511376 Circuitry component with metal layer over die and extending to place not over die |
| 03/31/2009 | US7511375 Semiconductor device carrier unit and semiconductor socket provided therewith |
| 03/31/2009 | US7511374 Microelectronic imaging units having covered image sensors |
| 03/31/2009 | US7511373 Cap package for micro electro-mechanical system |
| 03/31/2009 | US7511372 Microelectronic die cooling device including bonding posts and method of forming same |
| 03/31/2009 | US7511371 Multiple die integrated circuit package |
| 03/31/2009 | US7511370 Power gridding scheme |
| 03/31/2009 | US7511369 BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same |
| 03/31/2009 | US7511368 Carrier device for electronic chip |
| 03/31/2009 | US7511367 Optical device and method for fabricating the same |
| 03/31/2009 | US7511366 Multi-row substrate strip and method for manufacturing the same |
| 03/31/2009 | US7511365 Thermal enhanced low profile package structure |
| 03/31/2009 | US7511364 Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same |
| 03/31/2009 | US7511363 Copper interconnect |
| 03/31/2009 | US7511362 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 03/31/2009 | US7511361 DFN semiconductor package having reduced electrical resistance |
| 03/31/2009 | US7511359 Dual die package with high-speed interconnect |
| 03/31/2009 | US7511355 Semiconductor device having fuse element |
| 03/31/2009 | US7511352 Rail Schottky device and method of making |
| 03/31/2009 | US7511351 Semiconductor device and method for fabricating the same |
| 03/31/2009 | US7511349 Contact or via hole structure with enlarged bottom critical dimension |
| 03/31/2009 | US7511345 Bulk resistance control technique |
| 03/31/2009 | US7511344 Field effect transistor |
| 03/31/2009 | US7511340 Semiconductor devices having gate structures and contact pads that are lower than the gate structures |
| 03/31/2009 | US7511338 Semiconductor device and manufacturing method of the same |
| 03/31/2009 | US7511330 Semiconductor device and method of fabricating the same |
| 03/31/2009 | US7511329 NAND-type non-volatile memory |
| 03/31/2009 | US7511320 Semiconductor device and manufacturing method of the same |
| 03/31/2009 | US7511315 Semiconductor device and manufacturing method therefor |
| 03/31/2009 | US7511304 Substrate for display device having a protective layer provided between the pixel electrodes and wirings of the active matrix substrate and display device |
| 03/31/2009 | US7511302 TFT array panel |
| 03/31/2009 | US7511300 Array substrate, display device having the same and method of manufacturing the same |
| 03/31/2009 | US7511299 Packaged integrated circuit with raised test points |
| 03/31/2009 | US7511261 Image sensor module structure with lens holder having vertical inner and outer sidewalls |
| 03/31/2009 | US7511232 Substrate for mounting electronic part and electronic part |
| 03/31/2009 | US7510969 Electrode line structure having fine line width and method of forming the same |
| 03/31/2009 | US7510963 Semiconductor device having multilayer interconnection structure and manufacturing method thereof |
| 03/31/2009 | US7510961 Utilization of energy absorbing layer to improve metal flow and fill in a novel interconnect structure |
| 03/31/2009 | US7510959 Method of manufacturing a semiconductor device having damascene structures with air gaps |
| 03/31/2009 | US7510920 Manufacturing method for a thin film transistor that uses a pulse oscillation laser crystallize an amorphous semiconductor film |
| 03/31/2009 | US7510911 Semiconductor apparatus and method of manufacturing the same |
| 03/31/2009 | US7510910 Semiconductor device and production method thereof |
| 03/31/2009 | US7510909 Fabricating method of wafer protection layers |
| 03/31/2009 | US7510341 Temperature calibration method for baking processing apparatus, adjustment method for development processing apparatus, and method of manufacturing semiconductor apparatus |
| 03/31/2009 | US7510323 Multi-layered thermal sensor for integrated circuits and other layered structures |
| 03/31/2009 | US7510176 Submount assembly and method of preparing optical module |
| 03/31/2009 | US7510124 Wafer identification mark |
| 03/31/2009 | US7510108 Method of making an electronic assembly |
| 03/26/2009 | WO2009039523A1 Interconnect structures containing patternable low-k dielectrics and methods of fabricating same |
| 03/26/2009 | WO2009039184A2 Link processing with high speed beam deflection |
| 03/26/2009 | WO2009038984A2 Microelectronic package and method of forming same |
| 03/26/2009 | WO2009038706A2 Cooling hot-spots by lateral active heat transport |
| 03/26/2009 | WO2009038692A1 A mems package |
| 03/26/2009 | WO2009038490A1 Thermal spreader for heat pipe coolers and water coolers |
| 03/26/2009 | WO2009038169A1 Semiconductor device and its fabrication method |
| 03/26/2009 | WO2009037928A1 Phase change type heat spreader, channel structure, electronic apparatus and method for manufacturing phase change type heat spreader |
| 03/26/2009 | WO2009037918A1 High frequency substrate and high frequency module using same |
| 03/26/2009 | WO2009037902A1 Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 03/26/2009 | WO2009037862A1 Inclusion complex containing epoxy resin composition for semiconductor encapsulation |