| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/08/2009 | CN201219335Y Fixer |
| 04/08/2009 | CN201219108Y Support structure of light-emitting diode |
| 04/08/2009 | CN201219106Y Permenorm alloy lead frame |
| 04/08/2009 | CN201219105Y CPU refrigerating device |
| 04/08/2009 | CN201218490Y Radiating assembly |
| 04/08/2009 | CN201218488Y Radiating device |
| 04/08/2009 | CN201218487Y High-power LED bulb |
| 04/08/2009 | CN201218485Y Efficiently cooling high-power LED reflectoscope |
| 04/08/2009 | CN201218484Y Intensified heat radiating device for LED road lamp |
| 04/08/2009 | CN201218482Y Angle-fixing high-brightness polycrystal packaging LED heat radiating device |
| 04/08/2009 | CN201218472Y Control device integrated LED luminous element |
| 04/08/2009 | CN201218471Y Driving circuit integrated LED luminous element |
| 04/08/2009 | CN101405872A Infrared sensor and method for manufacturing infrared sensor |
| 04/08/2009 | CN101405863A Semiconductor devices and electrical parts manufacturing using metal coated wires |
| 04/08/2009 | CN101405862A Semiconductor device having post-mold nickel/palladium/gold plated leads |
| 04/08/2009 | CN101405861A Semiconductor device with solderable loop contacts |
| 04/08/2009 | CN101405860A Aluminum bump bonding for fine aluminum wire |
| 04/08/2009 | CN101405859A Thermal interconnect and interface systems, methods of production and uses thereof |
| 04/08/2009 | CN101405843A Method for forming thin film and multilayer structure of thin film |
| 04/08/2009 | CN101405625A Composite layer having improved adhesion, and fluid focus lens incorporating same |
| 04/08/2009 | CN101405561A Heat exchanger and method for manufacturing it |
| 04/08/2009 | CN101405219A Silica powder and use thereof |
| 04/08/2009 | CN101404863A Electronic circuit device and method of making the same |
| 04/08/2009 | CN101404862A Electronic circuit device and method of making the same |
| 04/08/2009 | CN101404861A Electronic circuit device and method of making the same |
| 04/08/2009 | CN101404287A Semiconductor storage device and manufacturing method of the same |
| 04/08/2009 | CN101404279A Multi-chip 3D stacking and packaging structure |
| 04/08/2009 | CN101404278A Circuit device, circuit module and outdoor unit |
| 04/08/2009 | CN101404277A Multichip module |
| 04/08/2009 | CN101404276A Light emitting module and method for manufacturing the same |
| 04/08/2009 | CN101404275A Circuit device |
| 04/08/2009 | CN101404274A Lead frame, packaging structure and packaging method for packaging three-pin electronic component |
| 04/08/2009 | CN101404273A Semiconductor device |
| 04/08/2009 | CN101404272A Labeling type semiconductor component and its production method |
| 04/08/2009 | CN101404271A Audio power amplifier package |
| 04/08/2009 | CN101404270A Semiconductor device, method of manufacturing the same, and semiconductor substrate |
| 04/08/2009 | CN101404269A Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device |
| 04/08/2009 | CN101404268A Semiconductor device and method of bump formation |
| 04/08/2009 | CN101404267A Semiconductor device and method of manufacturing the same |
| 04/08/2009 | CN101404266A Thermoelectricity separated light emitting diode seat body and its cooling unit structure |
| 04/08/2009 | CN101404265A Integrated circuit semiconductor device |
| 04/08/2009 | CN101404261A Triode and manufacturing method thereof |
| 04/08/2009 | CN101404259A Wiring board, semiconductor apparatus and method of manufacturing them |
| 04/08/2009 | CN101403492A Radiating module with fins embedded in ring shape |
| 04/08/2009 | CN101403491A Combination type LED lamp cooling structure and LED lamp |
| 04/08/2009 | CN101403490A Cooling structure, backlight module and LCD device and its assembling method |
| 04/08/2009 | CN101403488A Heat radiating structure for LED lamp |
| 04/08/2009 | CN101403485A LED luminous element for integrated control device |
| 04/08/2009 | CN100477891C Multilayer wiring board, method for producing the came, and method for producing fiber reinforced resin board |
| 04/08/2009 | CN100477388C Contact assembly, and insertor or electrical connector using the contact assembly |
| 04/08/2009 | CN100477306C White Light-emitting diode |
| 04/08/2009 | CN100477299C Semiconductor device and optical device using said semiconductor device |
| 04/08/2009 | CN100477286C Semiconductor module |
| 04/08/2009 | CN100477283C Diode presenting high breakdown voltage |
| 04/08/2009 | CN100477272C TFT array substrate, liquid crystal display device, manufacturing methods of TFT array substrate and liquid crystal display device, and electronic device |
| 04/08/2009 | CN100477252C Organic electroluminescent device and manufacture method thereof |
| 04/08/2009 | CN100477237C Electro-optical device and manufacturing method thereof, electronic apparatus, and capacitor |
| 04/08/2009 | CN100477234C Thin-film transistor array base plate |
| 04/08/2009 | CN100477228C Semiconductor device and method for fabricating the same |
| 04/08/2009 | CN100477227C Semiconductor memory device and method for fabricating the same |
| 04/08/2009 | CN100477221C Electrostatic discharge protection device for raising electrostatic bleeder channel using longitudinal polysilicon |
| 04/08/2009 | CN100477216C Integrated small thermal sediment system and making method thereof |
| 04/08/2009 | CN100477215C Semiconductor apparatus |
| 04/08/2009 | CN100477213C Integrated circuit chip programmable and operation method thereof |
| 04/08/2009 | CN100477211C LED module |
| 04/08/2009 | CN100477209C Device with power semiconductor components for controlling the power of high currents |
| 04/08/2009 | CN100477208C Method for manufacturing a semiconductor device |
| 04/08/2009 | CN100477207C Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 04/08/2009 | CN100477205C Transistors for electrostatic discharge protection and method for forming two transistors close to each other |
| 04/08/2009 | CN100477204C Wafer with optical control modules in IC fields |
| 04/08/2009 | CN100477203C Offset dependent resistor for measuring misalignment of stitched masks |
| 04/08/2009 | CN100477202C Electrically programmable fuse structure and manufacturing method thereof |
| 04/08/2009 | CN100477201C Semiconductor structure and forming method thereof |
| 04/08/2009 | CN100477200C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/08/2009 | CN100477199C Semiconductor package with lead directly adhered to chip and producing method thereof |
| 04/08/2009 | CN100477198C Chip packaging structure and manufacturing method thereof |
| 04/08/2009 | CN100477197C Multiple power semiconductor package |
| 04/08/2009 | CN100477196C Semiconductor device and method of manufacturing thereof |
| 04/08/2009 | CN100477195C Making method based on semiconductor film to improve package structure of high-frequency transmission |
| 04/08/2009 | CN100477194C Circuit board, manufacturing method thereof and semiconductor package and manufacturing method thereof |
| 04/08/2009 | CN100477193C Multilayer wiring board and manufacturing method thereof |
| 04/08/2009 | CN100477192C Semiconductor device and manufacturing method for the same |
| 04/08/2009 | CN100477191C Structure of wafer |
| 04/08/2009 | CN100477190C A method and apparatus for improved power routing |
| 04/08/2009 | CN100477189C Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board and electronic device |
| 04/08/2009 | CN100477188C Display device installed with driving element |
| 04/08/2009 | CN100477187C Semiconductor chip, semiconductor device, and method for manufacturing semiconductor device |
| 04/08/2009 | CN100477186C High frequency integrated circuit (HFIC) microsystem assembly and method for fabricating the same |
| 04/08/2009 | CN100477185C Surface mountable clip suitable for use in a mobile communication device |
| 04/08/2009 | CN100477184C Semiconductor chip having polished and ground bottom surface portions |
| 04/08/2009 | CN100477183C Method of electronic assembly heat conduction |
| 04/08/2009 | CN100477182C Phase change thermal interface materials using polyester resin and clay filled |
| 04/08/2009 | CN100477181C Micropin heat exchanger |
| 04/08/2009 | CN100477180C Relay base plate and multilayer printed wiring board |
| 04/08/2009 | CN100477179C Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulation |
| 04/08/2009 | CN100477178C Printed circuit board |
| 04/08/2009 | CN100477177C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/08/2009 | CN100477176C Integrated circuit package and assembling method thereof |
| 04/08/2009 | CN100477175C Semiconductor structure and manufacturing method thereof |
| 04/08/2009 | CN100477174C Electronic device and method for fabricating the same |