| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/21/2009 | US7521813 Protective coating is cured unsaturated polysiloxane rubber |
| 04/21/2009 | US7521812 Method of wire bonding over active area of a semiconductor circuit |
| 04/21/2009 | US7521811 Substrate for packaging semiconductor chip and method for manufacturing the same |
| 04/21/2009 | US7521810 Chip stack package and manufacturing method thereof |
| 04/21/2009 | US7521809 Semiconductor device having a chip stack on a rewiring plate |
| 04/21/2009 | US7521807 Semiconductor device with inclined through holes |
| 04/21/2009 | US7521806 Chip spanning connection |
| 04/21/2009 | US7521805 Post passivation interconnection schemes on top of the IC chips |
| 04/21/2009 | US7521803 Semiconductor device having first and second dummy wirings varying in sizes/coverage ratios around a plug connecting part |
| 04/21/2009 | US7521802 Semiconductor device having a refractory metal containing film and method for manufacturing the same |
| 04/21/2009 | US7521800 Solder pad and method of making the same |
| 04/21/2009 | US7521799 Semiconductor device and method of manufacturing the same |
| 04/21/2009 | US7521798 Stacked imager package |
| 04/21/2009 | US7521797 Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
| 04/21/2009 | US7521796 Method of making the semiconductor device, circuit board, and electronic instrument |
| 04/21/2009 | US7521795 Semiconductor package |
| 04/21/2009 | US7521794 Intrinsic thermal enhancement for FBGA package |
| 04/21/2009 | US7521793 Integrated circuit mounting for thermal stress relief useable in a multi-chip module |
| 04/21/2009 | US7521792 Semiconductor package with heat spreader |
| 04/21/2009 | US7521791 Method and apparatus for dissipating heat from an integrated circuit |
| 04/21/2009 | US7521790 Semiconductor device module and manufacturing method of semiconductor device module |
| 04/21/2009 | US7521788 Semiconductor module with conductive element between chip packages |
| 04/21/2009 | US7521787 Semiconductor device |
| 04/21/2009 | US7521786 Sustaining circuit with bi-directional device |
| 04/21/2009 | US7521785 Packaged systems with MRAM |
| 04/21/2009 | US7521783 Ultra thin image sensor package structure and method for fabrication |
| 04/21/2009 | US7521782 Optical device package structure |
| 04/21/2009 | US7521781 Integrated circuit package system with mold clamp line critical area having widened conductive traces |
| 04/21/2009 | US7521780 Integrated circuit package system with heat dissipation enclosure |
| 04/21/2009 | US7521779 Roughened printed circuit board |
| 04/21/2009 | US7521778 Semiconductor device and method of manufacturing the same |
| 04/21/2009 | US7521769 Photonic crystal biosensor structure and fabrication method |
| 04/21/2009 | US7521763 Dual stress STI |
| 04/21/2009 | US7521761 Variable layout structure for producing CMOS circuit |
| 04/21/2009 | US7521744 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 04/21/2009 | US7521381 Method for producing silicon wafer and silicon wafer |
| 04/21/2009 | US7521360 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
| 04/21/2009 | US7521357 Methods of forming metal wiring in semiconductor devices using etch stop layers |
| 04/21/2009 | US7521355 Integrated circuit insulators and related methods |
| 04/21/2009 | US7521350 Manufacturing method of a semiconductor device |
| 04/21/2009 | US7521336 Crack stop for low K dielectrics |
| 04/21/2009 | US7521335 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
| 04/21/2009 | US7521296 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material |
| 04/21/2009 | US7521295 Leadframe and method of manufacturing the same |
| 04/21/2009 | US7521294 Lead frame for semiconductor package |
| 04/21/2009 | US7521293 Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument |
| 04/21/2009 | US7521288 Stacked chip semiconductor device and method for manufacturing the same |
| 04/21/2009 | US7521286 Methods of refining lead-containing materials |
| 04/21/2009 | US7521276 Compliant terminal mountings with vented spaces and methods |
| 04/21/2009 | US7521124 Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance |
| 04/21/2009 | US7521122 Laminated sheet |
| 04/21/2009 | US7521115 Low temperature bumping process |
| 04/21/2009 | US7521011 Semiconductor-sealing-purpose epoxy resin compound producing method |
| 04/21/2009 | US7520957 Lid assembly for front end of line fabrication |
| 04/21/2009 | US7520956 On-wafer monitoring system |
| 04/21/2009 | US7520054 Process of manufacturing high frequency device packages |
| 04/21/2009 | US7520053 Method for manufacturing a bump-attached wiring circuit board |
| 04/17/2009 | CA2641293A1 Turbo-guiding type cooling apparatus |
| 04/16/2009 | WO2009049188A1 Semiconductor device and method for manufacturing a semiconductor device |
| 04/16/2009 | WO2009048861A2 Methods for forming a through via |
| 04/16/2009 | WO2009048798A1 Wireless semiconductor package for efficient heat dissipation |
| 04/16/2009 | WO2009048738A1 Bump i/o contact for semiconductor device |
| 04/16/2009 | WO2009048604A2 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
| 04/16/2009 | WO2009048154A1 Semiconductor device and method for designing the same |
| 04/16/2009 | WO2009048097A1 Semiconductor device |
| 04/16/2009 | WO2009047885A1 Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition |
| 04/16/2009 | WO2009047876A1 Circuit device |
| 04/16/2009 | WO2009046962A2 Chip module for chip card |
| 04/16/2009 | WO2009046647A1 A heat sink system, a heat sink apparatus and a heat sink method for a computer |
| 04/16/2009 | WO2009025471A3 Apparatus for attaching adhesion film for manufacturing semiconductor packages |
| 04/16/2009 | WO2009023284A3 Interconnection element with plated posts formed on mandrel |
| 04/16/2009 | WO2009023283A3 Interconnection element with posts formed by plating |
| 04/16/2009 | WO2009017835A3 Semiconductor packaging process using through silicon vias |
| 04/16/2009 | WO2008060644A3 Apparatus and method for cooling ics using nano-rod based chip-level heat sinks |
| 04/16/2009 | WO2007086046A3 Chip attack protection |
| 04/16/2009 | WO2007080573A3 Recyclying faulty multi-die packages |
| 04/16/2009 | WO2007040668A3 Stacked contact bump |
| 04/16/2009 | WO2007028136A3 Protective barrier layer for semiconductor device electrodes |
| 04/16/2009 | WO2007025060A3 Rfid tag and method and apparatus for manufacturing same |
| 04/16/2009 | WO2007002244A3 High temperature packaging for electronic components, modules and assemblies |
| 04/16/2009 | WO2006135874A3 Dfn semiconductor package having reduced electrical resistance |
| 04/16/2009 | WO2006107507A3 Wafer level package including a device wafer integrated with a passive component |
| 04/16/2009 | WO2006060408A3 Body-biased pmos protection against electrotatic discharge |
| 04/16/2009 | WO2006023835A3 Stacked wafer scale package |
| 04/16/2009 | WO2005050257A3 High temperature imaging device |
| 04/16/2009 | WO2004062958A3 Integrated component |
| 04/16/2009 | US20090099435 Analyte Monitoring Device and Methods of Use |
| 04/16/2009 | US20090099432 Analyte Monitoring Device and Methods of Use |
| 04/16/2009 | US20090098725 Method for fabricating semiconductor device |
| 04/16/2009 | US20090098718 Multiple mask and method for producing differently doped regions |
| 04/16/2009 | US20090098683 Method for cutting solid-state image pickup device |
| 04/16/2009 | US20090098673 Thin film transistor array panel and method for manufacturing the same |
| 04/16/2009 | US20090097209 Driver module structure |
| 04/16/2009 | US20090097177 Electrostatic protection circuit |
| 04/16/2009 | US20090097126 Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark |
| 04/16/2009 | US20090096435 Layout schemes and apparatus for high performance dc-dc output stage |
| 04/16/2009 | US20090096116 Alignment mark and mehtod for forming the same |
| 04/16/2009 | US20090096115 Semiconductor package and method for fabricating the same |
| 04/16/2009 | US20090096114 Epoxy Resin Composition and Semiconductor Device |
| 04/16/2009 | US20090096113 SOI on Package Hypersensitive Sensor |