| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/09/2009 | WO2006044061A3 Die attach paddle for mounting integrated circuit die |
| 04/09/2009 | WO2005081618A3 Method for improving heat dissipation in encapsulated electronic components |
| 04/09/2009 | WO2005060450A3 Land grid array packaged device and method of forming same |
| 04/09/2009 | WO2005035808A3 High thermal conductivity metal matrix composites |
| 04/09/2009 | WO2004040618A3 Feedthrough design and method for a hermetically sealed microdevice |
| 04/09/2009 | US20090093696 Analyte Monitoring Device and Methods of Use |
| 04/09/2009 | US20090093130 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
| 04/09/2009 | US20090093110 BGA package having half-etched bonding pad and cut plating line and method of fabricating same |
| 04/09/2009 | US20090093085 Carrier Structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device |
| 04/09/2009 | US20090092748 Electronic device packaging and curable resin composition |
| 04/09/2009 | US20090091351 Chip identification system and method |
| 04/09/2009 | US20090091045 Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device |
| 04/09/2009 | US20090091044 Dicing die attachment film and method for packaging semiconductor using same |
| 04/09/2009 | US20090091043 Die offset die to die bonding |
| 04/09/2009 | US20090091042 Integrated circuit package system including die having relieved active region |
| 04/09/2009 | US20090091041 Stacked type chip package structure and method of fabricating the same |
| 04/09/2009 | US20090091040 Semiconductor device and semiconductor storage device |
| 04/09/2009 | US20090091039 Semiconductor device, method of manufacturing the same, and semiconductor substrate |
| 04/09/2009 | US20090091038 Air gap for interconnect application |
| 04/09/2009 | US20090091037 Methods for Fabricating Contacts to Pillar Structures in Integrated Circuits |
| 04/09/2009 | US20090091036 Wafer structure with a buffer layer |
| 04/09/2009 | US20090091035 Highly integrated and reliable DRAM and its manufacture |
| 04/09/2009 | US20090091034 Driving circuit of a liquid crystal display panel |
| 04/09/2009 | US20090091033 Fabrication of metal oxide films |
| 04/09/2009 | US20090091032 Bond Pad Design for Fine Pitch Wire Bonding |
| 04/09/2009 | US20090091031 Semiconductor device |
| 04/09/2009 | US20090091030 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device |
| 04/09/2009 | US20090091029 Semiconductor package having marking layer |
| 04/09/2009 | US20090091028 Semiconductor device and method of bump formation |
| 04/09/2009 | US20090091027 Semiconductor package having restraining ring surfaces against soldering crack |
| 04/09/2009 | US20090091026 Stackable semiconductor package having plural pillars per pad |
| 04/09/2009 | US20090091025 Method for forming and releasing interconnects |
| 04/09/2009 | US20090091024 Stable Gold Bump Solder Connections |
| 04/09/2009 | US20090091023 Semiconductor Device Package |
| 04/09/2009 | US20090091022 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 04/09/2009 | US20090091021 Semiconductor device and method of manufacturing the same |
| 04/09/2009 | US20090091020 Co-fired ceramic module |
| 04/09/2009 | US20090091019 Memory Packages Having Stair Step Interconnection Layers |
| 04/09/2009 | US20090091018 Electronic Component Sealing Substrate, Electronic Component Sealing Substrate to be Divided Into a Plurality of Pieces, Electronic Apparatus Including Electronic Component Sealing Substrate, and Method for Producing Electronic Apparatus |
| 04/09/2009 | US20090091017 Partitioned Integrated Circuit Package with Central Clock Driver |
| 04/09/2009 | US20090091016 I/o pad structures for integrated circuit devices |
| 04/09/2009 | US20090091015 Stacked-type chip package structure and method of fabricating the same |
| 04/09/2009 | US20090091013 Lead frame, electronic component including the lead frame, and manufacturing method thereof |
| 04/09/2009 | US20090091012 capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids; reaction of 1,3-bis(3-aminophenoxy)benzene, for example, and an acid component |
| 04/09/2009 | US20090091011 Semiconductor device having interconnected contact groups |
| 04/09/2009 | US20090091010 Wireless semiconductor package for efficient heat dissipation |
| 04/09/2009 | US20090091009 Stackable integrated circuit package |
| 04/09/2009 | US20090091008 Semiconductor device |
| 04/09/2009 | US20090091007 Semiconductor Device Having Grooved Leads to Confine Solder Wicking |
| 04/09/2009 | US20090091006 Dual Capillary IC Wirebonding |
| 04/09/2009 | US20090091005 Shielding structure for semiconductors and manufacturing method therefor |
| 04/09/2009 | US20090091004 Semiconductor device |
| 04/09/2009 | US20090091001 Crack resistant semiconductor package and method of fabricating the same |
| 04/09/2009 | US20090090972 Tunable voltage isolation ground to ground esd clamp |
| 04/09/2009 | US20090090547 Multilayer printed wiring board |
| 04/09/2009 | US20090090542 Multilayer printed wiring board |
| 04/09/2009 | US20090090541 Stacked semiconductor device and fabricating method thereof |
| 04/09/2009 | US20090089999 Analyte Monitoring Device and Methods of Use |
| 04/09/2009 | DE4421358B4 Gleichrichteranordnung, vorzugsweise für einen Drehstromgenerator für Kraftfahrzeuge Rectifier arrangement, preferably for an alternator for motor vehicles |
| 04/09/2009 | DE19956903B4 HF-Halbleiterbauelement und Verfahren zur Integration von HF-Dioden RF semiconductor device and method for the integration of RF diodes |
| 04/09/2009 | DE19932399B4 Verfahren, bei dem eine Halbleitervorrichtung hergestellt wird Method in which a semiconductor device is fabricated |
| 04/09/2009 | DE112007000832T5 Dünne Plättchen und Metallsubstrate verwendende Halbleiterplättchengehäuse Thin plates and metal substrates used semiconductor die package |
| 04/09/2009 | DE102008047916A1 Halbleiterbauelement mit Mehrfachschichtmetallisierung A semiconductor device comprising Mehrfachschichtmetallisierung |
| 04/09/2009 | DE102008046761A1 Halbleiterbauelement mit leitfähiger Verbindungsanordnung Semiconductor device with conductive connection arrangement |
| 04/09/2009 | DE102008045735A1 Gestapelte Halbleiterchips Stacked semiconductor chips |
| 04/09/2009 | DE102008040900A1 Verbindungen mittels Chip-Durchkontaktierungen für gestapelte integrierte Schaltkreisstrukturen Compounds by means of chip-vias for stacked integrated circuit structures |
| 04/09/2009 | DE102008039732A1 Halbleiter-Herstellungsprozess-Ladungsschutz-Schaltkreise Semiconductor manufacturing process overload protection circuits |
| 04/09/2009 | DE102008036834A1 Diodenbasiertes ESE-Konzept für Demos-Schutz Diode-based ESD protection concept for demos |
| 04/09/2009 | DE102007046901A1 Production of electrically conductive or heat-conductive component for producing metallic contact between two elements e.g. cooling bodies or solar cells, comprises forming elemental silver from silver compound between contact areas |
| 04/09/2009 | DE102007046851A1 Halbleiterstruktur mit einem elektrisch leitfähigen Strukturelement und Verfahren zum Ausbilden einer Halbleiterstruktur Semiconductor structure having an electrically conductive structural member and method of forming a semiconductor structure |
| 04/09/2009 | DE102007046846A1 Seitenwandschutzschicht Sidewall protection layer |
| 04/09/2009 | DE102007045281A1 Leistungsmodul Power module |
| 04/09/2009 | DE102007044795A1 Electronic module, has contact circuit path structure arranged on isolation structure, and component contact surfaces of components and contact surface of carrier electrically connected with each other by isolation structure |
| 04/09/2009 | DE102007044604A1 Elektrisches Vielschichtbauelement Electrical multilayer component |
| 04/09/2009 | DE102007025658B4 Bonddrahtanordnung und Verfahren zur Herstellung einer Bonddrahtanordnung Bond wire assembly and method of manufacturing a bonding wire arrangement |
| 04/09/2009 | DE102007022338A1 Leistungshalbleiterbauelement mit Metallkontaktschicht sowie Herstellungsverfahren hierzu Power semiconductor component with metal contact layer and manufacturing method therefor |
| 04/09/2009 | DE102007021983B4 Verfahren zur Herstellung eines integrierten metallischen Kühlkörpers für eine Halbleitereinrichtung A method for manufacturing an integrated metallic heat sink for a semiconductor device |
| 04/09/2009 | DE102005000734B4 Verfahren zum Einstellen einer Abweichung einer kritischen Abmessung von Mustern Method for adjusting a deviation of a critical dimension of patterns |
| 04/09/2009 | DE102004036142B4 Halbleiterbauelement mit einer Metallisierung mit mehreren durch zumindest eine Barriereschicht getrennten Metallisierungsschichten sowie Verfahren zu dessen Herstellung A semiconductor device with a plurality of metallization with through at least one barrier layer separate metallization layers as well as methods for its preparation |
| 04/09/2009 | DE10143919B4 Elekrisch leitende Paste und Verfahren zur Herstellung eines mehrlagigen keramischen elektronischen Bauteils unter verwendung dieser Paste By electricity-conducting paste and method of manufacturing a multilayer ceramic electronic component using this paste |
| 04/09/2009 | DE10120641B4 Keramik mit sehr guten Hochfrequenzeigenschaften und Verfahren zu ihrer Herstellung Ceramic having excellent high-frequency properties and processes for their preparation |
| 04/09/2009 | DE10085347B4 Verwendung einer MOS-Struktur als Entstörkondensator bei dünnen Gate-Oxiden Use of a MOS structure and interference suppression capacitor with thin gate oxides |
| 04/09/2009 | DE10023539B4 Verfahren zum Herstellen eines Bauteils A method for manufacturing a component |
| 04/08/2009 | EP2045840A2 Wiring board with guard ring |
| 04/08/2009 | EP2045355A1 Gas-barrier film and organic device comprising same |
| 04/08/2009 | EP2045344A1 Copper alloy sheets for electrical/electronic part |
| 04/08/2009 | EP2044627A1 Electronic arrangement |
| 04/08/2009 | EP2044626A1 Silicon level solution for mitigation of substrate noise |
| 04/08/2009 | EP2044601A2 Thermally imageable dielectric layers, thermal transfer donors and receivers |
| 04/08/2009 | EP2043809A2 System and method for laser processing at non-constant velocities |
| 04/08/2009 | EP1788514B1 Electronic micromodule and method of fabrication |
| 04/08/2009 | EP1668971A4 Radiation shielded semiconductor device package |
| 04/08/2009 | EP1598862B1 Semiconductor device and radiation detector employing it |
| 04/08/2009 | CN201219345Y Heat radiation assembly |
| 04/08/2009 | CN201219343Y Novel tooth piece type ribbed radiator |
| 04/08/2009 | CN201219342Y Novel fluted sheet type ribbed radiator |
| 04/08/2009 | CN201219341Y Novel fin type radiator |
| 04/08/2009 | CN201219340Y Heat pipe radiator with radiation fin interspace of 8 to 18mm |
| 04/08/2009 | CN201219339Y Horizontally placed heat pipe radiator |
| 04/08/2009 | CN201219338Y Radiator with internal flow guiding function |