Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2009
04/02/2009DE102008045338A1 Halbleiterbauelement Semiconductor device
04/02/2009DE102008039939A1 Integriertes Schaltungsbauelement mit einer aus der Gasphase abgeschiedenen Isolationsschicht An integrated circuit device having a deposited from the gas phase insulation layer
04/02/2009DE102008038815A1 Integrierte Schaltung mit einer Parylen-Materialschicht Integrated circuit comprising a parylene material layer
04/02/2009DE102008011254A1 Carrier element's recess closing method for semiconductor component i.e. LED, involves providing screen with openings, filling of recess of carrier element by screen through screen printing of viscous mass, and hardening viscous mass
04/02/2009DE102007053849A1 Anordnung umfassend ein optoelektronisches Bauelement Assembly comprising an optoelectronic component
04/02/2009DE102007053067A1 Verfahren zur Herstellung eines Halbleiterbauelementes und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device
04/02/2009DE102007046969B3 Elektronische Schaltung aus Teilschaltungen und Verfahren zu deren Herstellung und demgemäßer Umrichter oder Schalter Electronic circuit part from circuits and methods for their preparation and demgemäßer converter or switch
04/02/2009DE102007046558A1 Integrated circuit for use with input transistor, has gate electrode, where gate oxide of input transistor is twenty five times thicker than standard gate oxide of standard metal oxide semiconductor transistor of integrated circuit
04/02/2009DE102007046556A1 Halbleiterbauelement mit Kupfermetallisierungen A semiconductor device having copper metallizations
04/02/2009DE102007046520A1 Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes The light-emitting surface element and method for manufacturing a light-emitting surface element
04/02/2009DE102007046496A1 Protection encapsulation manufacturing method for Organic LED, involves executing molding process under influence of heat to form cavity at surface of encapsulation element, where cavity accommodates drying agent
04/02/2009DE102007046095A1 Integrated circuit for automobile control system, has assembly contact points connected with substrate, and semiconductor chips arranged between lead frame and common connection plane, where chips are arranged on lead frame
04/02/2009DE102007044047A1 Schaltungsanordnung mit einem elektronischen Bauelement und einer ESD-Schutzanordnung Circuit arrangement having an electronic component and an ESD protection arrangement
04/02/2009DE102007044046A1 Power semiconductor module, has conductor section connected at side of frame, such that connection element is fixed in its position relative to substrate by positioning of element and frame relative to frame and element, respectively
04/02/2009DE102004064028B4 Verfahren zum Herstellen eines Waferebenenpakets A method of manufacturing a wafer-level package
04/02/2009DE102004030042B4 Halbleiterbauelement mit einem auf einem Träger montierten Halbleiterchip, bei dem die vom Halbleiterchip auf den Träger übertragene Wärme begrenzt ist, sowie Verfahren zur Herstellung eines Halbleiterbauelementes A semiconductor device with a carrier mounted on a semiconductor chip in which the power transmitted from the semiconductor chip to the heat carrier is limited, and methods for producing a semiconductor device
04/02/2009DE102004013077B4 Verfahren zur Herstellung eines Photodetektors Process for the preparation of a photodetector
04/02/2009DE10146176B4 Verfahren zur Umverdrahtung von Pads bei einem Waferlevel-Package, Waferlevel-Package und Halbleiterchip Method for rewiring pads at a wafer level package, wafer level package and semiconductor chip
04/02/2009CA2700589A1 Directly injected forced convection cooling for electronics
04/01/2009EP2043263A1 Surface-acoustic-wave divice for flip-chip mounting
04/01/2009EP2043169A2 Thermoelectric module substrate and thermoelectric module using such substrate
04/01/2009EP2043152A2 Electronic apparatus with stacked semiconductor chips and manufacturing method thereof
04/01/2009EP2043150A2 Microwave Communication Package
04/01/2009EP2043149A1 Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use
04/01/2009EP2043148A2 Thermal-dissipating device
04/01/2009EP2043147A2 Automotive electric/electronic package
04/01/2009EP2043146A1 Lid or case for sealing package and method for manufacturing the lid or the case
04/01/2009EP2042260A2 Method and paste for contacting metal surfaces
04/01/2009EP2041805A1 Lighting device package
04/01/2009EP2041804A1 Lighting device package
04/01/2009EP2041789A2 Power amplifier assembly
04/01/2009EP2041788A2 Cooling semiconductor-based devices arranged in a greenhouse
04/01/2009EP2041787A1 Method for encasing electronic components and integrated circuits
04/01/2009EP2041786A2 Integrated circuit, transponder, method of producing an integrated circuit and method of producing a transponder
04/01/2009EP2041783A2 Module having a flat structure, and equipment method
04/01/2009EP2041782A1 Method of temporarily attaching a rigid carrier to a substrate
04/01/2009EP2041592A2 Methods and apparatus for passive attachment of components for integrated circuits
04/01/2009EP2041186A2 Process for producing moulding powder
04/01/2009EP1845119B1 Resin compositions, cured article obtained therefrom, and sheet
04/01/2009EP1639634B1 Electronic device, assembly and methods of manufacturing an electronic device
04/01/2009EP1454339A4 An integrated circuit resistant to the formation of cracks in a passivation layer
04/01/2009EP1371091A4 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
04/01/2009EP1186033B1 Carrier for electronic components and a method for manufacturing a carrier
04/01/2009CN201215811Y Light emitting diode
04/01/2009CN201215806Y Package construction and component for LED lamp
04/01/2009CN201215805Y LTCC integrated package millimeter wave component
04/01/2009CN201215804Y Four-row double-column transistor lead frame plate piece
04/01/2009CN201215803Y Double-row double-column transistor lead frame plate piece
04/01/2009CN201215802Y Double-row-in-parallel integrated circuit lead frame plate piece
04/01/2009CN201215801Y Seat body of high-power LED module having heat radiating function
04/01/2009CN201215303Y Radiating module of high heat radiation LED lamp
04/01/2009CN101401205A Periphery design for charge balance power devices
04/01/2009CN101401204A Method for manufacturing a microelectronic package
04/01/2009CN101401203A Semiconductor device packaging
04/01/2009CN101400246A Conductor rail with heat conduction
04/01/2009CN101400245A Electronic component cooling apparatus
04/01/2009CN101400241A Evaporation chamber for inner container type evaporative cooling device
04/01/2009CN101399882A Terminal device for digital subscriber line xDSL
04/01/2009CN101399430A 半导体装置 Semiconductor device
04/01/2009CN101399403A Package construction module having high density electric connection and packaging method
04/01/2009CN101399303A LED device
04/01/2009CN101399301A Surface adhesive conducting wire rack
04/01/2009CN101399285A Field-effect transistor, semiconductor chip and semiconductor device
04/01/2009CN101399282A Solid-state image pickup device, method of manufacturing solid-state image pickup device, and image pickup device
04/01/2009CN101399273A Image display system and fabrication method thereof
04/01/2009CN101399272A Thin-film transistor array substrate
04/01/2009CN101399267A Power transistor structure and method for producing the same
04/01/2009CN101399263A Circuit device
04/01/2009CN101399262A Power semiconductor arrangement
04/01/2009CN101399261A Semiconductor package and method of fabricating the same
04/01/2009CN101399260A Circuit module
04/01/2009CN101399259A Circuit device and method of manufacturing the same
04/01/2009CN101399258A 半导体装置 Semiconductor device
04/01/2009CN101399257A Method and structure of expanding, upgrading, or fixing multi-chip package
04/01/2009CN101399256A Electronic apparatus and manufacturing method thereof
04/01/2009CN101399255A Semiconductor device having circularly connected plural pads via through holes and method of evaluating the same
04/01/2009CN101399254A 半导体装置 Semiconductor device
04/01/2009CN101399253A Method for cutting fuse-wires by laser, test structure and method thereof and test wafer
04/01/2009CN101399252A Semiconductor device and layout method thereof
04/01/2009CN101399251A Layout method of memory and structure
04/01/2009CN101399250A Semiconductor chip and semiconductor device having a plurality of semiconductor chips
04/01/2009CN101399249A Insulation wiring board, manufacture method thereof and semiconductor packaging using the same
04/01/2009CN101399248A Wiring substrate and method of manufacturing the same
04/01/2009CN101399247A COF package and tape substrate used in same
04/01/2009CN101399246A Package substrate structure and production method thereof
04/01/2009CN101399245A Semiconductor package having dimpled plate interconnections
04/01/2009CN101399244A Circuit structure, photo mask for defining the circuit structure
04/01/2009CN101399243A Semiconductor package and method for manufacturing the same
04/01/2009CN101399242A Power semiconductor module
04/01/2009CN101399241A Loading mechanism for bare die packages and lga socket
04/01/2009CN101399240A Microelectronic package and method of cooling an interconnect feature in same
04/01/2009CN101399239A Flat shape electronic chip radiator
04/01/2009CN101399238A 光学设备及其制造方法 The optical device and its manufacturing method
04/01/2009CN101399237A Rapid heat radiation ceramic case formed by full compression joint
04/01/2009CN101399236A Semiconductor device and method for manufacturing same
04/01/2009CN101399169A Film-forming method, film-forming apparatus, storage medium, and semiconductor device
04/01/2009CN101398589A Liquid crystal display device
04/01/2009CN101398272A Hot pipe
04/01/2009CN101398015A Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same
04/01/2009CN100474999C Copper size and wiring board using the same