| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/30/2009 | WO2009055450A1 Adhesion improvement of dielectric barrier to copper by the addition of thin interface layer |
| 04/30/2009 | WO2009055365A2 Packaged microchip with spacer for mitigating electrical leakage between components |
| 04/30/2009 | WO2009055142A1 System and method for cooling structures having both an active state and an inactive state |
| 04/30/2009 | WO2009055069A2 Multiple package module using a rigid flex printed circuit board |
| 04/30/2009 | WO2009055032A2 All optical fast distributed arbitration in a computer system device |
| 04/30/2009 | WO2009055029A2 Three-dimensional die stacks with inter-device and intra-device optical interconnect |
| 04/30/2009 | WO2009054466A1 DISPLAY DEVICE AND Cu ALLOY FILM FOR USE IN THE DISPLAY DEVICE |
| 04/30/2009 | WO2009054461A1 Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification |
| 04/30/2009 | WO2009054414A1 Semiconductor device |
| 04/30/2009 | WO2009054343A1 Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |
| 04/30/2009 | WO2009054268A1 METHOD FOR FORMING Cu WIRING |
| 04/30/2009 | WO2009053912A1 Semiconductor device with improved esd protection |
| 04/30/2009 | WO2009053460A1 Production method for a radar sensor |
| 04/30/2009 | WO2009053357A1 Electrical power component, in particular power semiconductor module, having a cooling device and method for the planar and heat-conductive attachment of a cooling device to an electrical power component |
| 04/30/2009 | WO2009053159A2 Fixing clamp |
| 04/30/2009 | WO2009052817A2 Corrosion-resistant microchannel heat sink and semiconductor cooling device comprising said microchannel heat sink |
| 04/30/2009 | WO2009052815A2 Microchannel heat sink for cooling semiconductor elements and method for treating the surfaces thereof |
| 04/30/2009 | WO2009052814A2 Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same |
| 04/30/2009 | WO2009052683A1 Electronic circuit package |
| 04/30/2009 | WO2009030979A3 Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
| 04/30/2009 | WO2009027888A3 Solderable structure |
| 04/30/2009 | WO2009026509A3 Semiconductor package having buss-less substrate |
| 04/30/2009 | WO2009010457A3 Expansion slots for the thermomechanical relief of an electrical contact |
| 04/30/2009 | WO2009007930A3 Integrated circuits on a wafer and method for separating integrated circuits on a wafer |
| 04/30/2009 | WO2008120090A3 A method for the sorption of gaseous contaminants by means of nanostructured sorbers in the form of a fiber |
| 04/30/2009 | WO2007062165A3 Alloys for flip chip interconnects and bumps |
| 04/30/2009 | WO2007050287A3 Semiconductor structure and method of assembly |
| 04/30/2009 | WO2007047808A3 Stacked integrated circuit chip assembly |
| 04/30/2009 | WO2007038645A3 Electrostatic protection systems and methods |
| 04/30/2009 | WO2007038342A3 Flip chip semiconductor device and process of its manufacture |
| 04/30/2009 | WO2007016662A3 Enhanced multi-die package |
| 04/30/2009 | WO2007016088A3 Packaged integrated circuit with enhanced thermal dissipation |
| 04/30/2009 | WO2007001860A3 Bulk resistance control technique |
| 04/30/2009 | WO2005036610A3 Multi-surface contact ic packaging structures and assemblies |
| 04/30/2009 | US20090111280 Method for removing oxides |
| 04/30/2009 | US20090111262 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
| 04/30/2009 | US20090111260 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 04/30/2009 | US20090111220 Coated lead frame |
| 04/30/2009 | US20090111219 Wafer-level chip scale package and method for fabricating and using the same |
| 04/30/2009 | US20090111218 Stack mcp and manufacturing method thereof |
| 04/30/2009 | US20090110917 Electronic Package and Method of Preparing Same |
| 04/30/2009 | US20090110346 Diffusion And Laser Photoelectrically Coupled Integrated Circuit Signal Line |
| 04/30/2009 | US20090110014 Small form factor transmitter optical subassembly (tosa) having functionality for controlling the temperature, and methods of making and using the tosa |
| 04/30/2009 | US20090109645 Power Semiconductor Module Comprising Load Connection Elements Applied To Circuit Carriers |
| 04/30/2009 | US20090109643 Thin semiconductor device package |
| 04/30/2009 | US20090109628 Chip Cooling System with Convex Portion |
| 04/30/2009 | US20090109515 Encapsulated spatial light modulator having large active area |
| 04/30/2009 | US20090108474 Junction structure and method of manufacturing the same |
| 04/30/2009 | US20090108473 Die-attach material overflow control for die protection in integrated circuit packages |
| 04/30/2009 | US20090108472 Wafer-level underfill process using over-bump-applied resin |
| 04/30/2009 | US20090108471 Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus |
| 04/30/2009 | US20090108469 Chip stack package |
| 04/30/2009 | US20090108468 Stacked semiconductor package and method for manufacturing the same |
| 04/30/2009 | US20090108467 Device with a plurality of semiconductor chips |
| 04/30/2009 | US20090108466 Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process |
| 04/30/2009 | US20090108465 Ceramic substrate grid structure for the creation of virtual coax arrangement |
| 04/30/2009 | US20090108464 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108463 Method of manufacturing semiconductor device and semiconductor device |
| 04/30/2009 | US20090108462 Dual integration scheme for low resistance metal layers |
| 04/30/2009 | US20090108461 Semiconductor device and method of fabricating the same |
| 04/30/2009 | US20090108460 Device including a semiconductor chip having a plurality of electrodes |
| 04/30/2009 | US20090108459 Semiconductor device |
| 04/30/2009 | US20090108458 Semiconductor structure and method of manufacture |
| 04/30/2009 | US20090108457 Apparatus for Improved Power Distribution in a Three Dimensional Vertical Integrated Circuit |
| 04/30/2009 | US20090108456 Solder-top Enhanced Semiconductor Device and Method for Low Parasitic Impedance Packaging |
| 04/30/2009 | US20090108455 Integrated circuit and process for fabricating thereof |
| 04/30/2009 | US20090108454 Metal line in semiconductor device and fabricating method thereof |
| 04/30/2009 | US20090108453 Chip structure and method for fabricating the same |
| 04/30/2009 | US20090108452 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108451 Semiconductor device and method for manufacturing the same |
| 04/30/2009 | US20090108450 Interconnect structure and method of making same |
| 04/30/2009 | US20090108448 Metal pad of semiconductor device |
| 04/30/2009 | US20090108447 Semiconductor device having a fine pitch bondpad |
| 04/30/2009 | US20090108446 Electrode structure for semiconductor chip |
| 04/30/2009 | US20090108445 Substrate structure and semiconductor package using the same |
| 04/30/2009 | US20090108444 Chip package structure and its fabrication method |
| 04/30/2009 | US20090108443 Flip-Chip Interconnect Structure |
| 04/30/2009 | US20090108442 Self-assembled stress relief interface |
| 04/30/2009 | US20090108441 Semiconductor clamp system |
| 04/30/2009 | US20090108440 Semiconductor device |
| 04/30/2009 | US20090108439 Fluid cooled encapsulated microelectronic package |
| 04/30/2009 | US20090108438 Semiconductor device and method of manufacturing the same |
| 04/30/2009 | US20090108437 Wafer scale integrated thermal heat spreader |
| 04/30/2009 | US20090108436 Semiconductor package |
| 04/30/2009 | US20090108435 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
| 04/30/2009 | US20090108434 Semiconductor integrated circuit device, pdp driver, and plasma display panel |
| 04/30/2009 | US20090108433 Multilayer semiconductor device package assembly and method |
| 04/30/2009 | US20090108432 Stack package made of chip scale packages |
| 04/30/2009 | US20090108431 Inverted package-on-package (POP) assemblies and packaging methods for integrated circuits |
| 04/30/2009 | US20090108430 Stacked semiconductor package in which semiconductor packages are connected using a connector |
| 04/30/2009 | US20090108429 Flip Chip Packages with Spacers Separating Heat Sinks and Substrates |
| 04/30/2009 | US20090108428 Mountable integrated circuit package system with substrate having a conductor-free recess |
| 04/30/2009 | US20090108427 Techniques for Modular Chip Fabrication |
| 04/30/2009 | US20090108426 Optical device and method of manufacturing the same |
| 04/30/2009 | US20090108425 Stacked package and method of manufacturing the same |
| 04/30/2009 | US20090108424 Leadframe for leadless package |
| 04/30/2009 | US20090108423 Semiconductor package |
| 04/30/2009 | US20090108422 Semiconductor device |
| 04/30/2009 | US20090108421 Apparatus and method configured to lower thermal stresses |
| 04/30/2009 | US20090108420 Semiconductor device and its fabrication process |