| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/30/2009 | US20090108419 Leadframe for leadless package |
| 04/30/2009 | US20090108418 Non-leaded semiconductor package structure |
| 04/30/2009 | US20090108417 Method and System for Providing a Continuous Impedance Along a Signal Trace in an IC Package |
| 04/30/2009 | US20090108416 Direct-connect signaling system |
| 04/30/2009 | US20090108415 Increasing etch selectivity during the patterning of a contact structure of a semiconductor device |
| 04/30/2009 | US20090108414 Wafer |
| 04/30/2009 | US20090108413 Interlayer Insulating Film, Interconnection Structure, and Methods of Manufacturing the Same |
| 04/30/2009 | US20090108411 Silicon substrate for package |
| 04/30/2009 | US20090108410 Semiconductor device |
| 04/30/2009 | US20090108409 Semiconductor device and manufacturing method thereof |
| 04/30/2009 | US20090108400 Anti-fuse structure including a sense pad contact region and methods for fabrication and programming thereof |
| 04/30/2009 | US20090108399 Apparatus and method for manufacturing semiconductor device incorporating fuse elements |
| 04/30/2009 | US20090108398 Fuse of Semiconductor Device and Method for Forming the Same |
| 04/30/2009 | US20090108393 Semiconductor Device With a Plurality of Ground Planes |
| 04/30/2009 | US20090108392 Semiconductor structure and method of manufacture |
| 04/30/2009 | US20090108381 Low temperature bi-CMOS compatible process for MEMS RF resonators and filters |
| 04/30/2009 | US20090108258 Semiconductor Device And Method for Fabricating The Same |
| 04/30/2009 | US20090108257 Critical dimension for trench and vias |
| 04/30/2009 | US20090108248 Integrated circuit including doped semiconductor line having conductive cladding |
| 04/30/2009 | US20090107704 Composite substrate |
| 04/30/2009 | US20090106974 Method of producing an overmolded electronic module with a flexible circuit pigtail |
| 04/30/2009 | DE202009001574U1 Befestigungselement Fastener |
| 04/30/2009 | DE202009000460U1 Wärmeableitungsanordnung Heat dissipation arrangement |
| 04/30/2009 | DE202009000459U1 Wärmeableitungsanordnung Heat dissipation arrangement |
| 04/30/2009 | DE112007001249T5 Hocheffizientes, beidseitig gekühltes diskretes Leistungsschaltungsgehäuse, insbesondere Basiselement für innovative Leistungsschaltungsmodule Highly efficient, both sides chilled discrete power circuit housing, in particular basic element for innovative power circuit modules |
| 04/30/2009 | DE102008045410A1 Halbleitervorrichtung mit IGBT mit eingebauter Diode und Halbleitervorrichtung mit DMOS mit eingebauter Diode A semiconductor device having IGBT with built-in diode and semiconductor device having DMOS with built-in diode |
| 04/30/2009 | DE102007051277A1 Verfahren und Vorrichtung zur indirekten Kühlung von dünnen Bauteilen Method and apparatus for indirect cooling of thin components |
| 04/30/2009 | DE102007050985A1 Befestigungsklammer Crab |
| 04/30/2009 | DE102007050608A1 Gehäuse für einen Halbleiter-Chip A housing for a semiconductor chip |
| 04/30/2009 | DE102006001767B4 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing |
| 04/30/2009 | DE102004014864B4 Schutzkreis zum Schutz vor elektrostatischen Entladungen von Licht emittierenden Dioden und Verfahren zur Herstellung Protection circuit to protect against electrostatic discharges of light-emitting diodes and methods of making |
| 04/29/2009 | EP2053747A1 Circuit architecure for radiation resilience |
| 04/29/2009 | EP2053666A1 Heat dissipation device for LEDs and related production method |
| 04/29/2009 | EP2053656A2 Semiconductor device and its fabrication process |
| 04/29/2009 | EP2053655A2 Chip scale package using large ductile solder balls |
| 04/29/2009 | EP2053654A2 Cooled multichip module |
| 04/29/2009 | EP2053651A2 Method for producing substrate |
| 04/29/2009 | EP2053647A2 Semiconductor chip mounting method, semiconductor mounting wiring board producing method and semiconductor mounting wiring board |
| 04/29/2009 | EP2053646A1 Method for vertical interconnection inside 3D electronic modules using vias |
| 04/29/2009 | EP2052410A2 High speed, high density, low power die interconnect system |
| 04/29/2009 | EP2052409A2 Molded housing used in force fit method |
| 04/29/2009 | EP1982353A4 Flip-attached and underfilled stacked semiconductor devices |
| 04/29/2009 | EP1869724A4 Circuitry module |
| 04/29/2009 | EP1656819A4 Thermally enhanced electronic module with self-aligning heat sink |
| 04/29/2009 | EP1518272B1 Semiconductor structure integrated under a pad |
| 04/29/2009 | EP1407393A4 Topological global routing for automated ic package interconnect |
| 04/29/2009 | EP1261989B1 Metal-insulator-metal capacitor and a method for producing same |
| 04/29/2009 | EP1143514B1 Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon |
| 04/29/2009 | CN201230438Y Combination of heat radiating device |
| 04/29/2009 | CN201230437Y Heat radiator |
| 04/29/2009 | CN201230436Y Combination of radiating device |
| 04/29/2009 | CN201230434Y Heat radiating construction |
| 04/29/2009 | CN201230433Y Heat radiating model set |
| 04/29/2009 | CN201230432Y Machine box and heat radiating device |
| 04/29/2009 | CN201230431Y 水冷功率模块 Water-cooled power modules |
| 04/29/2009 | CN201230429Y Heat radiating device for electronic module |
| 04/29/2009 | CN201230428Y Heat radiating module |
| 04/29/2009 | CN201229954Y LED support construction |
| 04/29/2009 | CN201229945Y Combined electronic element |
| 04/29/2009 | CN201229944Y LED structure |
| 04/29/2009 | CN201229943Y Lead frame board having heat radiating projection on both sides |
| 04/29/2009 | CN201229942Y Dual row dual column thin type lead frame board |
| 04/29/2009 | CN201229941Y Lead wire frame for transistor |
| 04/29/2009 | CN201229940Y Copper coated iron silicon plastic packaging rectifying diode |
| 04/29/2009 | CN201229939Y Heat radiator for DC power transmission thyristor conversion valve component |
| 04/29/2009 | CN201229938Y 芯片封装结构 Chip package |
| 04/29/2009 | CN201229937Y Flip chip encapsulation construction having non-array projection |
| 04/29/2009 | CN201229541Y Novel heat radiating rack |
| 04/29/2009 | CN201228954Y Matrix type LED lamp with heat radiation gain structure |
| 04/29/2009 | CN201228953Y Radiating fin structure for LED lamp |
| 04/29/2009 | CN201228952Y Street light fitting with LED heat radiating device |
| 04/29/2009 | CN201228949Y LED lamp heat radiation body |
| 04/29/2009 | CN201228933Y High brightness LED street lamp holder structure |
| 04/29/2009 | CN201228886Y High power LED street lamp r |
| 04/29/2009 | CN201228869Y Led lamp structure |
| 04/29/2009 | CN101421920A Method for improving heat dissipation in encapsulated electronic components |
| 04/29/2009 | CN101421843A Micro device with microtubes |
| 04/29/2009 | CN101421842A Thermal diodic devices for high cooling rate applications and methods for manufacturing same |
| 04/29/2009 | CN101421841A A circuit lid with a thermocouple |
| 04/29/2009 | CN101421840A Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
| 04/29/2009 | CN101421833A Land grid array packaged device and method of forming same |
| 04/29/2009 | CN101421831A Apparatus for manufacturing semiconductor, method for manufacturing semiconductor device, storage medium, and computer program |
| 04/29/2009 | CN101421591A Surface acoustic wave packages and methods of forming same |
| 04/29/2009 | CN101421576A Cooling apparatus and power converter |
| 04/29/2009 | CN101421056A System, method and apparatus for self-cleaning dry etch |
| 04/29/2009 | CN101420841A Heat radiating mechanism |
| 04/29/2009 | CN101420840A Sheet structure and method of manufacturing the same |
| 04/29/2009 | CN101420838A Highly efficient cooling device for electronic module |
| 04/29/2009 | CN101420836A Heat radiating module, substrate and manufacturing method therefor |
| 04/29/2009 | CN101420835A Low melting point alloy thermal interface material |
| 04/29/2009 | CN101420834A Heat Radiation device |
| 04/29/2009 | CN101420819A Printing circuit board and electronic apparatus |
| 04/29/2009 | CN101420168A Water cooling device used for current transformator power module |
| 04/29/2009 | CN101420007A Encapsulation construction and method for LED wafer |
| 04/29/2009 | CN101420002A LED encapsulation construction and manufacturing method thereof |
| 04/29/2009 | CN101419990A Flexible thin-film solar cell component |
| 04/29/2009 | CN101419984A Structure and method for fabricating self-aligned metal contacts |
| 04/29/2009 | CN101419978A Organic light emitting display |
| 04/29/2009 | CN101419973A TFT pixel construction implemented by third photo etching and manufacturing method thereof |
| 04/29/2009 | CN101419967A Electrostatic discharge protection circuit, manufacturing method thereof and liquid crystal display device having the same |