| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/22/2009 | CN101414576A Semiconductor device and method for forming barrier metal layer thereof |
| 04/22/2009 | CN101414575A Method for processing silicon-based liquid crystal metal routing |
| 04/22/2009 | CN101414566A Wiring circuit board, manufacturing method thereof, circuit module provided with this wiring circuit board |
| 04/22/2009 | CN101414507A Magnetic and dielectric composite electronic device |
| 04/22/2009 | CN101414203A Fastening structure of radiating fin for portable computer |
| 04/22/2009 | CN101413736A Development and application of supporting role energy sources |
| 04/22/2009 | CN101413655A Heat radiation structure of LED lamp backlight device |
| 04/22/2009 | CN101413654A Heat radiation structure of LED lamp backlight device |
| 04/22/2009 | CN101413653A Vacuum liquid heat radiating device for LED light fitting |
| 04/22/2009 | CN101413652A LED light source device |
| 04/22/2009 | CN101413650A High heat radiation performance LED lighting unit and light distribution-adjustable light fitting using the same |
| 04/22/2009 | CN101413649A LED light fitting |
| 04/22/2009 | CN101413648A LED light fitting with heat radiation structure |
| 04/22/2009 | CN101413647A LED light fitting with heat radiation structure |
| 04/22/2009 | CN101413632A LED lamp strip |
| 04/22/2009 | CN101412838A Epoxy resin molding material for sealing and electronic part apparatus |
| 04/22/2009 | CN100482060C Heat radiator |
| 04/22/2009 | CN100482059C Heat radiator |
| 04/22/2009 | CN100482058C Apparatus and method for a cooling solution fastening assembly |
| 04/22/2009 | CN100482057C Radiating equipment structure |
| 04/22/2009 | CN100482041C 印刷布线板 A printed circuit board |
| 04/22/2009 | CN100482035C Method for manufacturing heat conductive substrate |
| 04/22/2009 | CN100482032C Printed circuit board having embedded RF module power stage circuit |
| 04/22/2009 | CN100481731C Information coding circuit in integrated circuits and method thereof |
| 04/22/2009 | CN100481667C Electrostatic discharge protective circuit using base trigger silicon rectifier |
| 04/22/2009 | CN100481537C Manufacture method for diode light-emitting device and structure thereof |
| 04/22/2009 | CN100481512C Semiconductor device and method of fabricating the same |
| 04/22/2009 | CN100481480C Glass flip-chip packaging construction for image sensor |
| 04/22/2009 | CN100481477C Method for fabricating vertical CMOS image sensor |
| 04/22/2009 | CN100481469C Thin film transistor array substrate, manufacturing method for the same, and transflective liquid crystal display |
| 04/22/2009 | CN100481467C Thin film transistor base board and the method for reducing the interference between the metal leads |
| 04/22/2009 | CN100481455C Seal ring structure with incomplete contact through hole stack |
| 04/22/2009 | CN100481454C Semiconductor devices |
| 04/22/2009 | CN100481447C Light emitting device provided with lens for controlling light distribution characteristic |
| 04/22/2009 | CN100481446C 半导体器件 Semiconductor devices |
| 04/22/2009 | CN100481445C Electronic parts, module, module assembling method, identification method, and environment setting method |
| 04/22/2009 | CN100481443C Electronic apparatus |
| 04/22/2009 | CN100481442C Optical module with flexible substrate |
| 04/22/2009 | CN100481441C Electron package structure |
| 04/22/2009 | CN100481440C Semiconductor device |
| 04/22/2009 | CN100481439C Device and method for implementing multi-time programming using once programmable element |
| 04/22/2009 | CN100481438C Wafer with optical control modules in dicing paths |
| 04/22/2009 | CN100481437C Semiconductor structure implementing sacrificial material |
| 04/22/2009 | CN100481436C Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state |
| 04/22/2009 | CN100481435C Reprogrammable fuse structure and method |
| 04/22/2009 | CN100481434C Semiconductor integrated circuit and method for manufacturing the same, and mask |
| 04/22/2009 | CN100481433C Semiconductor device having improved metal wiring |
| 04/22/2009 | CN100481432C Semiconductor device with dual damascene structure in wafer |
| 04/22/2009 | CN100481431C Thin film coating wafer encapsulation structure for reducing soft plate distortion |
| 04/22/2009 | CN100481430C Surface installing emitting LED |
| 04/22/2009 | CN100481429C Inner pin jointing tape coiling and tape coiling support packaging structure using the same |
| 04/22/2009 | CN100481428C Semiconductor apparatus and manufacturing method thereof |
| 04/22/2009 | CN100481427C Signal transfer film, display apparatus and method of manufacturing the same |
| 04/22/2009 | CN100481426C Semiconductor device for one-line protruding block interleaving detection |
| 04/22/2009 | CN100481425C Semiconductor device having aluminum electrode and metallic electrode |
| 04/22/2009 | CN100481424C Semiconductor device and method for manufacturing the same |
| 04/22/2009 | CN100481423C Chip with projection cube structure |
| 04/22/2009 | CN100481422C Electron device |
| 04/22/2009 | CN100481421C Method for fabricating semiconductor package |
| 04/22/2009 | CN100481420C Stack type chip packaging structure, chip packaging body and manufacturing method thereof |
| 04/22/2009 | CN100481419C Feeding apparatus and feeding method for semiconductor lead frame |
| 04/22/2009 | CN100481418C ARC layer for semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481417C Semiconductor device |
| 04/22/2009 | CN100481416C Semiconductor device and stacked semiconductor device and the manufacturing methods thereof |
| 04/22/2009 | CN100481415C Chip packaging member and manufacturing method thereof |
| 04/22/2009 | CN100481414C Semiconductor device and manufacturing thereof |
| 04/22/2009 | CN100481413C Radiator and package structure |
| 04/22/2009 | CN100481412C Insulating circuit board and insulating circuit board provided with cooling sink section |
| 04/22/2009 | CN100481411C Electric circuit module as well as power converter and vehicle-mounted electric system comprising the same |
| 04/22/2009 | CN100481410C Heatsink assembly |
| 04/22/2009 | CN100481409C 芯片封装结构及其封装制程 Chip packaging structure and packaging process |
| 04/22/2009 | CN100481407C Pin ball grid array encapsulation structure of wafer |
| 04/22/2009 | CN100481406C Improved etch method |
| 04/22/2009 | CN100481405C Semiconductor device |
| 04/22/2009 | CN100481404C 半导体晶片及半导体装置 A semiconductor wafer and a semiconductor device |
| 04/22/2009 | CN100481403C Electronic device substrate and fabrication method thereof, and electronic device fabricating method |
| 04/22/2009 | CN100481402C Semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481389C Programmable resistive RAM and manufacturing method thereof |
| 04/22/2009 | CN100481388C Method and system for removing impairment of integrated circuit |
| 04/22/2009 | CN100481385C Methods for metal arc layer formation |
| 04/22/2009 | CN100481384C Conductor-dielectric structure and fabricating method thereof |
| 04/22/2009 | CN100481383C Method for manufacturing semiconductor device and semiconductor device |
| 04/22/2009 | CN100481379C Method of adhesion improvement for low K dielectrics to conductive materials |
| 04/22/2009 | CN100481377C Semiconductor device and manufacturing method |
| 04/22/2009 | CN100481376C Semiconductor device and manufacturing method thereof, circuit plate and electronic device |
| 04/22/2009 | CN100481357C Method for manufacturing a substrate with cavity |
| 04/22/2009 | CN100481347C Semiconductor integrated circuit |
| 04/22/2009 | CN100481319C Interfacial layer for use with high K dielectric materials |
| 04/22/2009 | CN100481255C Semiconductor memory device with on-die termination circuit |
| 04/22/2009 | CN100481234C Voice coding device and decoding device, optical recording medium and voice transmission method |
| 04/22/2009 | CN100481122C RFID tag and method of manufacturing the same |
| 04/22/2009 | CN100480827C Film transistor substrate for liquid crystal display board and manufacture thereof |
| 04/22/2009 | CN100480787C Semiconductor chip and display device using the same |
| 04/22/2009 | CN100480617C Insulation layer and semiconductor conducting layer aligning error electrical testing structure in micro-electro-mechanical system |
| 04/22/2009 | CN100480611C Heat pipe |
| 04/22/2009 | CN100480352C Epoxy resin composition, solid device packed by the same and method |
| 04/22/2009 | CN100480226C Multifunctional monomers and use thereof in making cross-linked polymers and porous films |
| 04/21/2009 | US7522422 Heat sink |
| 04/21/2009 | US7522414 Apparatus for extending an operator panel |
| 04/21/2009 | US7521952 Test structure for electromigration analysis and related method |