| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/06/2009 | CN101425483A Seal ring structure with improved cracking protection and reduced problems |
| 05/06/2009 | CN101425481A Pixel construction and manufacturing method thereof |
| 05/06/2009 | CN101425453A Alpha tantalum layer forming method, mim capacitor and forming method thereof |
| 05/06/2009 | CN101425333A High density resistor conversion memory and memory operation method thereof |
| 05/06/2009 | CN101424395A LED lamp |
| 05/06/2009 | CN101424389A White light illumination module for increasing white balance and reducing heat drift and light mixing color block |
| 05/06/2009 | CN101423751A Thermal interfacial material and its preparation method |
| 05/06/2009 | CN100486410C Fluid cross pin-rib array minisize heat exchanger |
| 05/06/2009 | CN100486409C Heat radiation assembly and its flow direction control structure |
| 05/06/2009 | CN100485978C Nitride-based semiconductor light-emitting device |
| 05/06/2009 | CN100485948C 半导体装置模块 Semiconductor device module |
| 05/06/2009 | CN100485937C Semiconductor memory device and constructing method |
| 05/06/2009 | CN100485932C Semiconductor device and electric apparatus |
| 05/06/2009 | CN100485930C 半导体器件 Semiconductor devices |
| 05/06/2009 | CN100485929C Semiconductor device advantageous in improving water resistance and oxidation resistance |
| 05/06/2009 | CN100485928C Semiconductor device and display device thereof |
| 05/06/2009 | CN100485926C Light-emitting diodes lamp |
| 05/06/2009 | CN100485925C LED module |
| 05/06/2009 | CN100485923C Semiconductor device of electrostatic protection circuit using thyristor as protection element |
| 05/06/2009 | CN100485922C Static discharge protection sensor and circuit |
| 05/06/2009 | CN100485921C Overmolded semiconductor package with an integrated EMI and RFI shield |
| 05/06/2009 | CN100485920C Integrate circuit with double layer silicon carbon compound barrier layer |
| 05/06/2009 | CN100485919C Semiconductor device, and method for manufacturing the same |
| 05/06/2009 | CN100485918C Interconnection, interconnection forming method, thin-film transistor and displaying device |
| 05/06/2009 | CN100485917C Method for manufacturing non-exterior pin semiconductor packaging construction plated in sealing glue |
| 05/06/2009 | CN100485916C Semiconductor device and power supply unit utilizing the same |
| 05/06/2009 | CN100485915C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 05/06/2009 | CN100485914C Semiconductor package and semiconductor device |
| 05/06/2009 | CN100485913C Substrate for mounting semiconductor |
| 05/06/2009 | CN100485912C Substrate for producing semiconductor packages |
| 05/06/2009 | CN100485911C Sensor device and sensor system, and manufacturing method therefor |
| 05/06/2009 | CN100485910C Electronic component and its manufacturing method |
| 05/06/2009 | CN100485909C Structure combining IC integration base board and carrier board and manufacturing method for the same and electronic device |
| 05/06/2009 | CN100485900C Through-wafer gateway and surface metallization for coupling thereto |
| 05/06/2009 | CN100485899C Semiconductor chip and method of fabricating the same |
| 05/06/2009 | CN100485896C Semiconductor device and method of making the same |
| 05/06/2009 | CN100485895C Built-in wafer encapsulation structure and its making process |
| 05/06/2009 | CN100485894C Flip chip packaging method and packaging structure thereof |
| 05/06/2009 | CN100485884C Substrate for electronic device and method for processing same |
| 05/06/2009 | CN100485879C Method of producing group III nitride substrate wafers and group III nitride substrate wafers |
| 05/06/2009 | CN100485875C Self-aligning contact window open manufacturing method, internal connecting structure and manufacturing method thereof |
| 05/06/2009 | CN100485828C A cooling arrangement for high temperature superconducting device |
| 05/06/2009 | CN100485498C Display device |
| 05/06/2009 | CN100485288C Apparatus and method for utilizing recirculated heat to cause refrigeration |
| 05/06/2009 | CN100484686C Method for producing leadless welding flux delamination structure |
| 05/05/2009 | US7529448 System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| 05/05/2009 | US7529091 Power semiconductor module and method for cooling a power semiconductor module |
| 05/05/2009 | US7529090 Heat dissipation device |
| 05/05/2009 | US7529089 Heat-dissipating device connected in series to water-cooling circulation system |
| 05/05/2009 | US7529013 Optical modulator module package |
| 05/05/2009 | US7528884 Optical device |
| 05/05/2009 | US7528495 Chip structure |
| 05/05/2009 | US7528494 Accessible chip stack and process of manufacturing thereof |
| 05/05/2009 | US7528492 Test patterns for detecting misalignment of through-wafer vias |
| 05/05/2009 | US7528491 Semiconductor components and assemblies including vias of varying lateral dimensions |
| 05/05/2009 | US7528490 Semiconductor device and ferroelectric memory, and method for manufacturing semiconductor device |
| 05/05/2009 | US7528488 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure |
| 05/05/2009 | US7528487 Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board |
| 05/05/2009 | US7528486 Anisotropic conductive film and bump, and packaging structure of semiconductor having the same |
| 05/05/2009 | US7528485 Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device |
| 05/05/2009 | US7528484 Multi-concentric pad arrangements for integrated circuit pads |
| 05/05/2009 | US7528483 Cooling system for a semiconductor device and method of fabricating same |
| 05/05/2009 | US7528482 Embedded chip package with improved heat dissipation performance and method of making the same |
| 05/05/2009 | US7528481 Wafer level packaging cap and fabrication method thereof |
| 05/05/2009 | US7528480 Circuit board, semiconductor device, and manufacturing method of circuit board |
| 05/05/2009 | US7528479 Multilayer substrate for digital tuner and multilayer substrate |
| 05/05/2009 | US7528478 Semiconductor devices having post passivation interconnections and a buffer layer |
| 05/05/2009 | US7528477 Castellation wafer level packaging of integrated circuit chips |
| 05/05/2009 | US7528476 Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument |
| 05/05/2009 | US7528475 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 05/05/2009 | US7528474 Stacked semiconductor package assembly having hollowed substrate |
| 05/05/2009 | US7528473 Electronic circuit, a semiconductor device and a mounting substrate |
| 05/05/2009 | US7528472 Chip package mechanism |
| 05/05/2009 | US7528471 Integrated circuit incorporating wire bond inductance |
| 05/05/2009 | US7528470 Conductor board and method for producing a conductor board |
| 05/05/2009 | US7528469 Semiconductor equipment having multiple semiconductor devices and multiple lead frames |
| 05/05/2009 | US7528468 Capacitor assembly with shielded connections and method for forming the same |
| 05/05/2009 | US7528467 IC substrate with over voltage protection function |
| 05/05/2009 | US7528464 Semiconductor device and method for manufacturing the same |
| 05/05/2009 | US7528460 Semiconductor device sealed with electrical insulation sealing member |
| 05/05/2009 | US7528449 Semiconductor device including ESD protective element |
| 05/05/2009 | US7528430 Electronic systems |
| 05/05/2009 | US7528415 Semiconductor laser |
| 05/05/2009 | US7528413 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| 05/05/2009 | US7528404 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| 05/05/2009 | US7528068 Method for manufacturing semiconductor device |
| 05/05/2009 | US7528062 Integrated matching network and method for manufacturing integrated matching networks |
| 05/05/2009 | US7528014 Semiconductor device and method of manufacturing the same |
| 05/05/2009 | US7528013 Method for fabricating high performance leadframe in electronic package |
| 05/05/2009 | US7528008 Method of electrically connecting a microelectronic component |
| 05/05/2009 | US7528007 Methods for assembling semiconductor devices and interposers |
| 05/05/2009 | US7528005 Method of manufacturing chip size package semiconductor device without intermediate substrate |
| 05/05/2009 | US7527990 Solid state imaging device and producing method thereof |
| 05/05/2009 | US7527987 Fast localization of electrical failures on an integrated circuit system and method |
| 05/05/2009 | US7527871 Curable organopolysiloxane composition and semiconductor device |
| 05/05/2009 | US7527188 Self-encapsulated silver alloys for interconnects |
| 05/05/2009 | US7527090 Heat dissipating device with preselected designed interface for thermal interface materials |
| 05/05/2009 | US7527085 Electronic component cooling apparatus |
| 05/05/2009 | CA2322595C Method of making an ohmic contact to p-type silicon carbide, comprising titanium carbide and nickel silicide |
| 04/30/2009 | WO2009055612A1 Sealed substrate carriers and systems and methods for transporting substrates |