| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/23/2009 | US20090101896 Semiconductor device |
| 04/23/2009 | US20090100668 Inductor formed in an integrated circuit |
| 04/23/2009 | DE4345586B4 Verfahren zum Erzeugen von Vielfach-Dickschichtsubstraten A method of generating multiple thick film substrates |
| 04/23/2009 | DE202007017759U1 Integrierte Kühlung eines integrierten Schaltkreises Integrated cooling an integrated circuit |
| 04/23/2009 | DE112007001424T5 Kühlkörper und Kühler Heatsink and cooler |
| 04/23/2009 | DE112007001422T5 Kühler Cooler |
| 04/23/2009 | DE112007001304T5 Verfahren, Vorrichtung und System für Kohlenstoffnanoröhrendochtstrukturen Method, apparatus and system for carbon nanotube wick structures |
| 04/23/2009 | DE112007001240T5 Integriertes Transistormodul mit doppelseitiger Kühlung und Verfahren zur Herstellung Integrated transistor module with double-sided cooling and processes for preparing |
| 04/23/2009 | DE112007000081T5 Hochfrequenzgerätmodul und Herstellungsverfahren desselben The same radio frequency device module and manufacturing method |
| 04/23/2009 | DE102008051560A1 Power module, particularly power semiconductor module, has housing with multiple receiving elements and carrier element, where elastic deformable cover is arranged on carrier element |
| 04/23/2009 | DE102008050972A1 Halbleiter-Chipbaustein, Halbleiter-Chipbaugruppe und Verfahren zum Herstellen eines Bauelements A semiconductor chip package, semiconductor chip assembly and method of manufacturing a device |
| 04/23/2009 | DE102008031511A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 04/23/2009 | DE102007056269A1 Gekühltes Multichipmodul Chilled multichip module |
| 04/23/2009 | DE102007050433A1 Halbleitermodul und Verfahren zum Herstellen eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module |
| 04/23/2009 | DE102007050405A1 Elektrische Leistungskomponente, insbesondere Leistungshalbleiter-Modul, mit einer Kühlvorrichtung und Verfahren zum flächigen und wärmeleitenden Anbinden einer Kühlvorrichtung an eine elektrische Electric power component, in particular a power semiconductor module with a cooling device and method for two-dimensional bonding of a heat conducting and electrical cooling device to a |
| 04/23/2009 | DE102007050102A1 Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul A process for the preparation of a transfer module and transmission module |
| 04/23/2009 | DE102007049035A1 Chipkühlvorrichtung mit Keilelement Chip Cooler with wedge element |
| 04/23/2009 | DE10105086B4 Leistungsmodul Power module |
| 04/23/2009 | DE10100620B4 Leistungsmodul Power module |
| 04/22/2009 | EP2051300A2 Package for a power semiconductor device |
| 04/22/2009 | EP2051299A1 Turbo-guiding type cooling apparatus |
| 04/22/2009 | EP2051298A1 Integrated Circuit Package |
| 04/22/2009 | EP2051294A2 Hypersensitive sensor comprising SOI flip-chip |
| 04/22/2009 | EP2051287A1 Method for forming conductive film, thin film transistor, panel with thin film transistor, and method for manufacturing thin film transistor |
| 04/22/2009 | EP2050713A1 Method of manufacturing a cavity with an apertured seal bead and structure obtained |
| 04/22/2009 | EP2050146A1 Led device and back panel of liquid crystal display |
| 04/22/2009 | EP2050145A1 Light source comprising edge emitting elements |
| 04/22/2009 | EP2050134A2 An integrated circuit device having at least one bond pad with a selectable plurality of input-output functionalities |
| 04/22/2009 | EP2050131A1 Method for producing an electric functional layer on a surface of a substrate |
| 04/22/2009 | EP2050130A2 Transponder and method of producing a transponder |
| 04/22/2009 | EP2003944A9 Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
| 04/22/2009 | EP2003691A9 Base for power module |
| 04/22/2009 | EP1081764B1 High-frequency module and method of manufacture thereof |
| 04/22/2009 | EP0782766B1 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 04/22/2009 | CN201226638Y Radiator fixed seat |
| 04/22/2009 | CN201226637Y Radiating device structure |
| 04/22/2009 | CN201226636Y Liquid cooling radiating device with evaporation cavity |
| 04/22/2009 | CN201226635Y Centralized heat source type liquid-cooling radiating device using hot pipe |
| 04/22/2009 | CN201226633Y Electronic device with radiating system |
| 04/22/2009 | CN201226632Y Radiator for peafowl screen |
| 04/22/2009 | CN201226627Y Heat radiator |
| 04/22/2009 | CN201226361Y LED packaging structure and backlight module unit with the same |
| 04/22/2009 | CN201226360Y High-power LED encapsulation structure |
| 04/22/2009 | CN201226357Y LED chip packaging structure for backlight module |
| 04/22/2009 | CN201226356Y LED packaging structure for preventing fluorescent powder light-emitting efficiency from reducing due to high temperature |
| 04/22/2009 | CN201226355Y Packaging structure for electronic memory device |
| 04/22/2009 | CN201226354Y Semiconductor element |
| 04/22/2009 | CN201225594Y Heat conductance improved structure of substrate |
| 04/22/2009 | CN201225593Y Hot pipe heat radiation LED module group |
| 04/22/2009 | CN201225592Y Heat radiation structure of LED illuminating apparatus |
| 04/22/2009 | CN201225591Y Fence type LED light fittings |
| 04/22/2009 | CN201225546Y Lamp holder of LED road lamp |
| 04/22/2009 | CN201225534Y Illumination device |
| 04/22/2009 | CN101416312A Method and circuits for sensing on-chip voltage in powerup mode |
| 04/22/2009 | CN101416311A Clipless and wireless semiconductor die package and method for making the same |
| 04/22/2009 | CN101416310A Multi-die semiconductor package |
| 04/22/2009 | CN101416309A Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same |
| 04/22/2009 | CN101416308A Semiconductor die packages using thin dies and metal substrates |
| 04/22/2009 | CN101416307A Cooler |
| 04/22/2009 | CN101416306A Cooler |
| 04/22/2009 | CN101416305A Over-molded semiconductor package with integrated through hole technology(THT) heat spreader pin(s) |
| 04/22/2009 | CN101416304A Conformable interface materials for improving thermal contacts |
| 04/22/2009 | CN101416303A Thermal enhanced package |
| 04/22/2009 | CN101416302A Elastically deformable integrated-circuit device |
| 04/22/2009 | CN101416277A Method and system for treating a dielectric film |
| 04/22/2009 | CN101415794A Working liquid for latent heat transport apparatus and method for operating latent heat transport apparatus |
| 04/22/2009 | CN101415760A Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
| 04/22/2009 | CN101415736A Curable resin composition |
| 04/22/2009 | CN101415316A Electronic device and manufacturing method thereof |
| 04/22/2009 | CN101415315A Radiating device |
| 04/22/2009 | CN101415313A Radiating device |
| 04/22/2009 | CN101415312A Radiating device |
| 04/22/2009 | CN101415311A Radiating device |
| 04/22/2009 | CN101415310A Radiating device |
| 04/22/2009 | CN101414652A Package structure for LED and preparation method thereof |
| 04/22/2009 | CN101414613A Wafer level package and mask for fabricating the same |
| 04/22/2009 | CN101414610A Display unit and method of manufacturing the same |
| 04/22/2009 | CN101414607A Semiconductor device and method for fabricating the same |
| 04/22/2009 | CN101414603A Stacked semiconductor package and method for manufacturing the same |
| 04/22/2009 | CN101414602A Inner imbedded type multifunctional integration type structure for integration protection element and preparation method thereof |
| 04/22/2009 | CN101414601A Semiconductor encapsulation stacking combined construct for protecting welding spot between external pins |
| 04/22/2009 | CN101414600A Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
| 04/22/2009 | CN101414599A Anti-fuse structures and anti-fuse array structures |
| 04/22/2009 | CN101414598A Semiconductor contact structure |
| 04/22/2009 | CN101414597A Member for mounting semiconductor element, semiconductor device, and imaging equipment |
| 04/22/2009 | CN101414596A Chip encapsulation substrate assembly and chip encapsulation construct |
| 04/22/2009 | CN101414595A Package substrate and manufacturing method thereof |
| 04/22/2009 | CN101414594A Lead pin for mounting semiconductor and printed wiring board |
| 04/22/2009 | CN101414593A Lead pin for mounting semiconductor and printed wiring board |
| 04/22/2009 | CN101414592A Image sensor encapsulation |
| 04/22/2009 | CN101414591A Island-shaped loading plate and preparation method thereof |
| 04/22/2009 | CN101414590A Inter-connecting structure for semiconductor package and method of the same |
| 04/22/2009 | CN101414589A IC structure and method for forming the same |
| 04/22/2009 | CN101414588A LED radiator |
| 04/22/2009 | CN101414587A Semiconductor device and method for providing cooling device on the surface thereof |
| 04/22/2009 | CN101414586A Package for a power semiconductor device and package method |
| 04/22/2009 | CN101414585A 光学设备及其制造方法 The optical device and manufacturing method thereof |
| 04/22/2009 | CN101414584A Semiconductor device and method of fabricating semiconductor device |
| 04/22/2009 | CN101414583A Display device with flip-chip structure |
| 04/22/2009 | CN101414581A Semiconductor device and method for manufacturing the same |