Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/19/2009US20090073228 Through-hole forming method, inkjet head, and silicon substrate
03/19/2009US20090072930 High speed electronics interconnect and method of manufacture
03/19/2009US20090072780 Photovoltaic-Charged Secondary Battery System
03/19/2009US20090072416 Semiconductor device, and manufacturing method of semiconductor device
03/19/2009US20090072415 Integrated circuit device having a gas-phase deposited insulation layer
03/19/2009US20090072414 Bonding method of semiconductor and laminated structure fabricated thereby
03/19/2009US20090072413 Semiconductor device
03/19/2009US20090072412 Integrated circuit package system with package encapsulation having recess
03/19/2009US20090072411 Semiconductor device with conductive interconnect
03/19/2009US20090072410 Microelectronic circuit structure with layered low dielectric constant regions
03/19/2009US20090072409 Interconnect Structures Incorporating Air-Gap Spacers
03/19/2009US20090072408 Connecting and Bonding Adjacent Layers with Nanostructures
03/19/2009US20090072407 Thermo-compression bonded electrical interconnect structure and method
03/19/2009US20090072405 Semiconductor device
03/19/2009US20090072404 Semiconductor device and method of manufacturing same
03/19/2009US20090072403 Wiring Structure, Semiconductor Device and Manufacturing Method Thereof
03/19/2009US20090072402 Semiconductor device and method of fabricating the same
03/19/2009US20090072401 Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer
03/19/2009US20090072400 Contact forming in two portions and contact so formed
03/19/2009US20090072399 semiconductor mounting bonding wire
03/19/2009US20090072398 Integrated circuit, circuit system, and method of manufacturing
03/19/2009US20090072397 Redistribution layer for wafer-level chip scale package and method therefor
03/19/2009US20090072396 Method of Forming Low Stress Multi-Layer Metallurgical Structures and High Reliable Lead Free Solder Termination Electrodes
03/19/2009US20090072395 Semiconductor device and method for manufacturing the same
03/19/2009US20090072394 Semiconductor device and method of manufacturing the same
03/19/2009US20090072393 Structure and Method for Fabricating Flip Chip Devices
03/19/2009US20090072392 Techniques For Forming Solder Bump Interconnects
03/19/2009US20090072391 Structurally-enhanced integrated circuit package and method of manufacture
03/19/2009US20090072390 Semiconductor apparatus and fabrication method thereof
03/19/2009US20090072389 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
03/19/2009US20090072388 Semiconductor device with inductor
03/19/2009US20090072387 Curvilinear heat spreader/lid with improved heat dissipation
03/19/2009US20090072386 Semiconductor package and semiconductor package assembly
03/19/2009US20090072385 Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures
03/19/2009US20090072384 Packaging substrate having heat-dissipating structure
03/19/2009US20090072383 Semiconductor device, electronic component module, and method for manufacturing semiconductor device
03/19/2009US20090072382 Microelectronic package and method of forming same
03/19/2009US20090072381 Semiconductor device with double-sided electrode structure and its manufacturing method
03/19/2009US20090072380 Microelectromechanical Device Packages with Integral Heaters
03/19/2009US20090072379 Semiconductor device
03/19/2009US20090072378 Memory device system with stacked packages
03/19/2009US20090072377 Integrated circuit package system with delamination prevention structure
03/19/2009US20090072376 Carrier Structure Stacking System and Method
03/19/2009US20090072375 Integrated circuit package system with multi-chip module
03/19/2009US20090072374 Electric Device, Stack of Electric Devices, and Method of Manufacturing a Stack of Electric Devices
03/19/2009US20090072373 Packaged integrated circuits and methods to form a stacked integrated circuit package
03/19/2009US20090072372 Planar Array Contact Memory Cards
03/19/2009US20090072371 Methods And Articles Incorporating Local Stress For Performance Improvement Of Strained Semiconductor Devices
03/19/2009US20090072370 Multilayer wiring substrate, method of manufacturing the same, and semiconductor device
03/19/2009US20090072369 Semiconductor device
03/19/2009US20090072368 Package for monolithic compound semiconductor (csc) devices for dc to dc converters
03/19/2009US20090072367 Leadframe
03/19/2009US20090072366 Integrated circuit package system with dual connectivity
03/19/2009US20090072365 Integrated circuit package system with external interconnects at high density
03/19/2009US20090072364 Integrated circuit package system with leads separated from a die paddle
03/19/2009US20090072363 Integrated circuit package-in-package system with leads
03/19/2009US20090072362 Thermal enhanced upper and dual heat sink exposed molded leadless package
03/19/2009US20090072361 Multi-Chip Stacked Package Structure
03/19/2009US20090072360 Molded semiconductor device including IC-chip covered with conductor member
03/19/2009US20090072358 Semiconductor Integrated Circuit Package, Printed Circuit Board, Semiconductor Apparatus, and Power Supply Wiring Structure
03/19/2009US20090072357 Integrated shielding process for precision high density module packaging
03/19/2009US20090072356 High-Heat-Resistant Semiconductor Device
03/19/2009US20090072334 Semiconductor device, pre-mold package, and manufacturing method therefor
03/19/2009US20090072315 Semiconductor Manufacturing Process Charge Protection Circuits
03/19/2009US20090072249 Nitride Semiconductor Light-Emitting Device
03/19/2009US20090072234 Test Stuctures for development of metal-insulator-metal (MIM) devices
03/19/2009US20090071695 Boron nitride agglomerated powder
03/19/2009US20090071000 Formation of circuitry with modification of feature height
03/19/2009US20090070996 Printed circuit board manufacturing method
03/19/2009DE202008015954U1 Kühlmodul Cooling module
03/19/2009DE202008015951U1 Kühlrippensatz und Kühlmodul mit diesem Kühlrippensatz Cooling fin set and cooling module with this fin set
03/19/2009DE202008014847U1 Grundplatte für Kühlkörper und dieser Kühlkörper Base plate for heat sink and the heat sink
03/19/2009DE19838574B4 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device
03/19/2009DE19811297B4 MOS-Halbleitervorrichtung mit hoher Durchbruchspannung MOS type semiconductor device with high breakdown voltage
03/19/2009DE19804568B4 Vorrichtung bestehend aus einem Feldeffekttransistor (FET) in Verbindung mit einer Vorspannungs-Versorgungseinrichtung und einem kapazitiven Element und Verfahren zu deren Ansteuerung Device consisting of a field effect transistor (FET) in conjunction with a bias supply means, and a capacitive element and driving method thereof
03/19/2009DE10310646B4 Package mit Substrat hoher Wärmeleitfähigkeit Package substrate with high thermal conductivity
03/19/2009DE10221891B4 Leistungshalbleitervorrichtung Power semiconductor device
03/19/2009DE102008045409A1 Befestigungsstruktur für eine elektronische Vorrichtung Mounting structure for an electronic device
03/19/2009DE102008045408A1 Befestigungsstruktur für eine elektronische Vorrichtung und Verfahren zum Herstellen derselben Mounting structure for an electronic device and methods for manufacturing the same
03/19/2009DE102007044537A1 Cooling body for e.g. electronic component, has fins arranged relative to one another and cross-section of fins designed perpendicular to longitudinal direction of body, such that cross-section of body along flow direction is constant
03/19/2009DE102007044358A1 Vorrichtung zum Kühlen von elektronischen Bauteilen Apparatus for cooling of electronic components
03/19/2009DE102006060801B4 Verfahren zur Herstellung eines Chipkartenmoduls und Chipkartenmodul A process for producing a chip card module and the smart card module
03/19/2009CA2698119A1 Polymer-ceramic composites with excellent tcc
03/18/2009EP2037499A1 Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit
03/18/2009EP2037498A1 High performance highly heat resistant semiconductor module
03/18/2009EP2037497A1 Semiconductor package, its manufacturing method, semiconductor device, and electronic device
03/18/2009EP2037465A1 Double LC-tank structure
03/18/2009EP2036860A1 Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith
03/18/2009EP2036417A2 Electronic module configured for air flow therethrough and system including same
03/18/2009EP2036132A2 An integrated circuit device having barrier and method of fabricating the same
03/18/2009EP2036127A1 Stackable ic package with top and bottom interconnect
03/18/2009EP2036125A2 Flip-chip interconnection with formed couplings
03/18/2009EP2036124A2 Flip-chip interconnection with a small passivation layer opening
03/18/2009EP2036123A2 Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
03/18/2009EP2036116A1 Adjustable capacity device and process thereof
03/18/2009EP1578559B1 Bonding method
03/18/2009EP1186034B1 Robust interconnect structure
03/18/2009EP1151454B1 An optoelectronic assembly
03/18/2009CN201210787Y Combination of radiating device
03/18/2009CN201210786Y Radiating rib construction and heat radiation module thereof
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