| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/26/2009 | DE102007043597A1 Verfahren zum Betrieb einer Übertemperaturschutz-Steuereinheit und Steuereinheit Method for operating an over-temperature protection control unit and control unit |
| 03/26/2009 | DE102007042103A1 Schaltungsanordnung zum Schutz vor elektrostatischen Entladungen und Verfahren zur Ableitung von elektrostatischen Entladungen Circuitry to protect against electrostatic discharges and method for the derivation of electrostatic discharges |
| 03/25/2009 | EP2040521A2 Method of manufacturing substrate |
| 03/25/2009 | EP2040518A2 Heat transfer member and connector |
| 03/25/2009 | EP2040315A2 Environment-sensitive device, and method for sealing environment-sensitive element |
| 03/25/2009 | EP2040297A1 Decoupling capacitor assembly, integrated circuit/decoupling capacitor assembly and method for fabricating the same |
| 03/25/2009 | EP2040296A2 Method for forming BGA package with increased standoff height |
| 03/25/2009 | EP2040295A2 System with a connection device and at least one semi-conductor construction element |
| 03/25/2009 | EP2040294A1 Method of manufacturing a semiconductor device |
| 03/25/2009 | EP2040293A1 Cooler for power module and power module |
| 03/25/2009 | EP2040291A1 Method of gluing chips to a constraint substrate and method of placing a semi-conductor reading circuit under constraint |
| 03/25/2009 | EP2040289A2 Packaging substrate structure and method for manufacturing the same |
| 03/25/2009 | EP2040288A2 Method of forming semiconductor chip wiring pattern using alignment marks |
| 03/25/2009 | EP2040104A1 Optical transceiver module with improved noise reduction |
| 03/25/2009 | EP2039460A2 Relocation device, contacting device, delivery system, relocation and contacting unit production facility, production method and a transponder unit |
| 03/25/2009 | EP2038928A2 Semiconductor device and method of manufacturing a semiconductor device |
| 03/25/2009 | EP2038927A2 Power supply network |
| 03/25/2009 | EP2038926A2 Integrated circuit |
| 03/25/2009 | EP2038925A1 A semiconductor fuse structure and a method of manufacturing a semiconductor fuse structure |
| 03/25/2009 | EP2038924A1 Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
| 03/25/2009 | EP2038921A1 Method for attaching electronic components to a support by means of pressure sintering and circuit arrangement |
| 03/25/2009 | EP2038920A1 Method for packaging components |
| 03/25/2009 | EP1825201A4 Integrated liquid cooling device with immersed electronic components |
| 03/25/2009 | EP1747706B1 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 03/25/2009 | EP1570521B1 Method, system and apparatus for cooling high power density devices |
| 03/25/2009 | EP1412550B1 Support with getter-material for micromechanical device |
| 03/25/2009 | EP1122788B1 Method of manufacturing of an soi substrate |
| 03/25/2009 | EP1114449B1 Method for forming a capacitor with a ruthenium silicide diffusion barrier layer |
| 03/25/2009 | CN201213349Y Heat Radiation device |
| 03/25/2009 | CN201213136Y Led |
| 03/25/2009 | CN201213135Y LED chip packaging construction having highly efficient heat radiating substrate |
| 03/25/2009 | CN201213134Y Package construction for LED chip |
| 03/25/2009 | CN201213133Y More uniformly conducted capacitor coupled electro-static discharge protection device |
| 03/25/2009 | CN201213132Y Semiconductor package piece connected by gold plating linking copper wire |
| 03/25/2009 | CN201213131Y High brightness polycrystal encapsulated outward heat radiating device for LED |
| 03/25/2009 | CN201213130Y Heat pipe/wind cooling composite heat radiating system used for large power thyristor |
| 03/25/2009 | CN201212667Y 改进的led灯具 Improved led lamps |
| 03/25/2009 | CN201212666Y Heat radiation structure of led lamp |
| 03/25/2009 | CN201212665Y Radiating device for LED chip |
| 03/25/2009 | CN201212664Y Led lamp apparatus |
| 03/25/2009 | CN201212663Y LED unit radiating heat directly and LED wick composed of the same |
| 03/25/2009 | CN201212655Y High-brightness polycrystal packaged LED antisymmetric arrangement apparatus |
| 03/25/2009 | CN101395724A Solar cell marking method, and solar cell |
| 03/25/2009 | CN101395715A Electronic device package, module and electronic device |
| 03/25/2009 | CN101395708A 半导体装置 Semiconductor device |
| 03/25/2009 | CN101395531A Cooling apparatus and electronic device comprising same |
| 03/25/2009 | CN101395290A Semiconductor device, its manufacturing method, and sputtering target material for use in the method |
| 03/25/2009 | CN101394731A Heat radiator |
| 03/25/2009 | CN101394730A Split heat radiator |
| 03/25/2009 | CN101394729A Heat radiator and manufacturing method thereof |
| 03/25/2009 | CN101394727A Heat Radiation device |
| 03/25/2009 | CN101394081A Electro-static discharge protection design with low capacitance |
| 03/25/2009 | CN101394052A Heat transfer member and connector |
| 03/25/2009 | CN101393948A Front-back enclosing type LED encapsulation construction and encapsulation method |
| 03/25/2009 | CN101393939A Nano tube hetero-junction constituted by zinc oxide and carbon, preparation thereof |
| 03/25/2009 | CN101393921A Chip dimension type image sensing chip encapsulation |
| 03/25/2009 | CN101393917A Semiconductor device having reduced thickness, electronic product employing the same, and methods of fabricating the same |
| 03/25/2009 | CN101393913A Semiconductor device and method for manufacturing the same |
| 03/25/2009 | CN101393910A Semiconductor integrated circuit |
| 03/25/2009 | CN101393909A Serial transistor device and inverter circuit |
| 03/25/2009 | CN101393908A Encapsulation construction of multi-chip stack |
| 03/25/2009 | CN101393907A Protection for circuit boards |
| 03/25/2009 | CN101393906A Ion injection test body, ion injection region mask board and ion injection test method |
| 03/25/2009 | CN101393905A Al alloy film, electron device and active matrix substrate for photoelectricity display device |
| 03/25/2009 | CN101393904A Semiconductor devices including interconnections and contact plugs and methods of forming the same |
| 03/25/2009 | CN101393903A Bearing board construction embedded with chip and fabrication method thereof |
| 03/25/2009 | CN101393902A Flip chip structure and method of manufacture |
| 03/25/2009 | CN101393901A Semiconductor device |
| 03/25/2009 | CN101393900A Semiconductor device and manufacturing method of the same |
| 03/25/2009 | CN101393899A Semiconductor device |
| 03/25/2009 | CN101393898A Encapsulation structure and manufacturing method thereof |
| 03/25/2009 | CN101393876A Method of forming a semiconductor die having a sloped edge for receiving an electrical connector |
| 03/25/2009 | CN101393873A Stacked semiconductor chips |
| 03/25/2009 | CN101393871A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 03/25/2009 | CN101393865A Dielectric layer of ultra-low dielectric constant and forming method thereof |
| 03/25/2009 | CN101393845A Making method for substrate identification code |
| 03/25/2009 | CN101392900A Heat radiating device of white light LED of automobile head light |
| 03/25/2009 | CN101392888A Illuminating device of LED light source |
| 03/25/2009 | CN101392882A Vehicle lighting device |
| 03/25/2009 | CN101392335A Method for preparing tungsten copper composite encapsulation material |
| 03/25/2009 | CN100473255C Circuit board for flip-chip connection and manufacturing method thereof |
| 03/25/2009 | CN100472807C Gate stack and gate stack etch sequence for metal gate integration |
| 03/25/2009 | CN100472798C Organic light emitting display device and method of fabricating the same |
| 03/25/2009 | CN100472782C Semiconductor devices |
| 03/25/2009 | CN100472781C Multiple chips integrated module |
| 03/25/2009 | CN100472780C Electronic component and method for manufacturing the same |
| 03/25/2009 | CN100472779C Module part |
| 03/25/2009 | CN100472778C Semiconductor device with power module housed in casing |
| 03/25/2009 | CN100472777C Physical quantity sensor and manufacturing method therefor |
| 03/25/2009 | CN100472776C Small radio communication module and manufacturing method thereof |
| 03/25/2009 | CN100472775C Package for high frequency waves containing high frequency electronic circuit |
| 03/25/2009 | CN100472774C Semiconductor device cutting fusing wire and method |
| 03/25/2009 | CN100472773C An anti-fuse cell and its manufacturing process |
| 03/25/2009 | CN100472772C Circuit board and circuit structure |
| 03/25/2009 | CN100472771C Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
| 03/25/2009 | CN100472770C Area array package with non-electrically connected solder balls |
| 03/25/2009 | CN100472769C Semiconductor device and method for manufacturing same, and semiconductor wafer |
| 03/25/2009 | CN100472768C Electronic packaging materials for use with low-k dielectric-containing semiconductor devices and method for improving reliability thereof |
| 03/25/2009 | CN100472767C Chip structure |
| 03/25/2009 | CN100472766C Aluminum-silicon carbide composite |