| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/16/2009 | US20090096112 Integrated circuit underfill package system |
| 04/16/2009 | US20090096111 Semiconductor device and method of manufacturing the same |
| 04/16/2009 | US20090096110 Method for manufacturing a stacked semiconductor package, and stacked semiconductor package |
| 04/16/2009 | US20090096109 Semiconductor device and method for fabricating the same |
| 04/16/2009 | US20090096108 Structure and methods of forming contact structures |
| 04/16/2009 | US20090096107 Semiconductor integrated circuit device |
| 04/16/2009 | US20090096106 Antireflective coatings |
| 04/16/2009 | US20090096105 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
| 04/16/2009 | US20090096104 Semiconductor device having crack stop structure |
| 04/16/2009 | US20090096103 Semiconductor device and method for forming barrier metal layer thereof |
| 04/16/2009 | US20090096102 Conductor structure including manganese oxide capping layer |
| 04/16/2009 | US20090096101 Bridge for semiconductor internal node |
| 04/16/2009 | US20090096100 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material |
| 04/16/2009 | US20090096099 Package substrate and method for fabricating the same |
| 04/16/2009 | US20090096098 Inter-connecting structure for semiconductor package and method of the same |
| 04/16/2009 | US20090096097 Semiconductor device and manufacturing method of the same |
| 04/16/2009 | US20090096096 Semiconductor device and circuit device having the same mounted thereon |
| 04/16/2009 | US20090096095 Semiconductor device and method of manufacturing the same |
| 04/16/2009 | US20090096094 Semiconductor device |
| 04/16/2009 | US20090096093 Inter-connecting structure for semiconductor package and method of the same |
| 04/16/2009 | US20090096092 Bump I/O Contact for Semiconductor Device |
| 04/16/2009 | US20090096091 Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device |
| 04/16/2009 | US20090096089 Method for producing a thin semiconductor chip comprising an integrated circuit |
| 04/16/2009 | US20090096088 Sealed wafer packaging of microelectromechanical systems |
| 04/16/2009 | US20090096087 Microelectronic assembly and method of preparing same |
| 04/16/2009 | US20090096086 Cooling system for semiconductor devices |
| 04/16/2009 | US20090096085 Thermally Enhanced Wafer Level Package |
| 04/16/2009 | US20090096084 Semiconductor chip packages having reduced stress |
| 04/16/2009 | US20090096083 Connecting structure for connecting at least one semiconductor component to a power semiconductor module |
| 04/16/2009 | US20090096082 High speed electrical interconnects and method of manufacturing thereof |
| 04/16/2009 | US20090096081 Semiconductor device |
| 04/16/2009 | US20090096080 Semiconductor package, electronic part and electronic device |
| 04/16/2009 | US20090096079 Semiconductor package having a warpage resistant substrate |
| 04/16/2009 | US20090096078 Semiconductor device and method for manufacturing a semiconductor device |
| 04/16/2009 | US20090096077 Tenon-and-mortise packaging structure |
| 04/16/2009 | US20090096076 Stacked semiconductor package without reduction in stata storage capacity and method for manufacturing the same |
| 04/16/2009 | US20090096075 Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same |
| 04/16/2009 | US20090096074 Semiconductor device |
| 04/16/2009 | US20090096073 Semiconductor device and lead frame used for the same |
| 04/16/2009 | US20090096072 Package for a power semiconductor device |
| 04/16/2009 | US20090096071 Semiconductor package and electronic device having the same |
| 04/16/2009 | US20090096070 Semiconductor package and substrate for the same |
| 04/16/2009 | US20090096069 Cof board |
| 04/16/2009 | US20090096068 System and Method for Stabilizing an Amplifier |
| 04/16/2009 | US20090096066 Structure and Method for Device-Specific Fill for Improved Anneal Uniformity |
| 04/16/2009 | US20090096063 Semiconductor apparatus with decoupling capacitor |
| 04/16/2009 | US20090096056 On-chip cooling systems for integrated circuits |
| 04/16/2009 | US20090096055 Method to form cmos circuits with sub 50nm sti structures using selective epitaxial silicon post sti etch |
| 04/16/2009 | US20090096027 Power Semiconductor Device |
| 04/16/2009 | US20090096008 Nonvolatile memory device and method of fabricating the same |
| 04/16/2009 | US20090095979 Power Module |
| 04/16/2009 | US20090095974 Semiconductor package and manufacturing method thereof |
| 04/16/2009 | US20090095955 Semiconductor integrated circuit and testing method thereof |
| 04/16/2009 | US20090095621 Support assembly |
| 04/16/2009 | US20090095523 Housings for electronic components |
| 04/16/2009 | US20090095334 Showerhead assembly |
| 04/16/2009 | DE112007001364T5 Wärmewiderstand sowie Halbleitereinrichtung und elektrische Einrichtung mit einem derartigen Wärmewiderstand Thermal resistance and semiconductor device and electrical device with such a heat resistance |
| 04/16/2009 | DE112006003866T5 Eine elektronische Mehrfachchip-Baugruppe mit reduzierter Spannung An electronic multi-chip module with reduced voltage |
| 04/16/2009 | DE10301243B4 Verfahren zum Herstellen einer integrierten Schaltungsanordnung, insbesondere mit Kondensatoranordnung A method of fabricating an integrated circuit arrangement, in particular with capacitor assembly |
| 04/16/2009 | DE10210041B4 Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung Heat sink for dissipating heat generated by an electrical component and method for manufacturing such a heat sink |
| 04/16/2009 | DE102008047416A1 Halbleiteranordnung und Verfahren zur Herstelllung von Halbleiteranordnungen Semiconductor device and method for Manufacture of semiconductor devices |
| 04/16/2009 | DE102008046095A1 Vereinzelter Halbleiterbaustein Scattered semiconductor device |
| 04/16/2009 | DE102008039388A1 Gestapelte Halbleiterchips Stacked semiconductor chips |
| 04/16/2009 | DE102008017809A1 Leistungshalbleitermodul The power semiconductor module |
| 04/16/2009 | DE102007046451A1 Vorrichtung zur Detektion von Wärmestrahlung mit hoher Auflösung, Verfahren zum Herstellen und Verwendung der Vorrichtung A device for detection of thermal radiation with high resolution, methods of making and using the apparatus |
| 04/16/2009 | DE102007044620A1 Anordnung mit einer Verbindungseinrichtung und mindestens einem Halbleiterbauelement Arrangement with a connection device and at least one semiconductor component |
| 04/16/2009 | DE102006033864B4 Elektronische Schaltung in einer Package-in-Package-Konfiguration und Herstellungsverfahren für eine solche Schaltung Electronic circuit in a package-on-package configuration and manufacturing method for such a circuit |
| 04/16/2009 | DE102004035746B4 Leistungshalbleitermodul The power semiconductor module |
| 04/16/2009 | DE102004018471B4 Leistungshalbleiterschaltung und Verfahren zum Herstellen einer Leistungshalbleiterschaltung Power semiconductor circuit and method for manufacturing a power semiconductor circuit |
| 04/15/2009 | EP2048924A2 Electronic component with high density, low cost attachment |
| 04/15/2009 | EP2048922A2 COF Board |
| 04/15/2009 | EP2048750A1 Connector for connecting electronic component |
| 04/15/2009 | EP2048712A2 Electronic device manufacturing method and electronic device |
| 04/15/2009 | EP2048711A2 Semiconductor package and manufacturing method thereof |
| 04/15/2009 | EP2048708A1 Semiconductor integrated circuit device |
| 04/15/2009 | EP2048704A1 Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display |
| 04/15/2009 | EP2047725A1 Production method of solder circuit board |
| 04/15/2009 | EP2047606A2 Dual inductor circuit for multi-band wireless communication device |
| 04/15/2009 | EP2047509A1 A method of fabricating a nanostructure on a pre-etched substrate. |
| 04/15/2009 | EP2047508A2 Integrated circuit heat dissipation device |
| 04/15/2009 | EP2047505A2 An interconnect structure with dielectric air gaps |
| 04/15/2009 | EP1929522B1 Integrated circuit comprising at least one integrated transmission line |
| 04/15/2009 | EP1894240B1 Electronic module |
| 04/15/2009 | EP1777278B1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/15/2009 | EP1647171A4 Thermal diffusion apparatus |
| 04/15/2009 | EP1595289A4 Thermal interconnect systems methods of production and uses thereof |
| 04/15/2009 | EP1382065A4 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 04/15/2009 | EP1354351B1 Direct build-up layer on an encapsulated die package |
| 04/15/2009 | EP1307919A4 Electrical passivation of silicon-containing surfaces using organic layers |
| 04/15/2009 | CN201222843Y Module for preventing electromagnetic interference |
| 04/15/2009 | CN201222842Y Plate type temperature-equalization heat transmission module |
| 04/15/2009 | CN201222841Y 散热器 Heat sink |
| 04/15/2009 | CN201222840Y Mosaic radiator for electric power electronic element |
| 04/15/2009 | CN201222839Y Mosaic radiator for electric power electronic element |
| 04/15/2009 | CN201222837Y 无风扇散热器 Fanless heatsink |
| 04/15/2009 | CN201222836Y 电子装置及其散热模块 Electronic device and cooling modules |
| 04/15/2009 | CN201222509Y Seat structure for luminous diode |
| 04/15/2009 | CN201222500Y High pressure-resistant constant flow source device |
| 04/15/2009 | CN201222499Y Flip LED integrated chip with high on-state voltage |
| 04/15/2009 | CN201222498Y Packaging structure for luminous diode chip with high efficiency crossrange luminous effect |