| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/15/2009 | CN201222497Y Luminous diode conductor holder structure |
| 04/15/2009 | CN201222496Y Down-lead for rectifying bridge stack |
| 04/15/2009 | CN201222495Y Diode conductor |
| 04/15/2009 | CN201222494Y Ultra-high second breakdown high-power transistor |
| 04/15/2009 | CN201221751Y Passive heat radiator and road lamp heat radiating device |
| 04/15/2009 | CN201221749Y LED lamp chimney type airflow tube array heat radiating device |
| 04/15/2009 | CN201221731Y LED bulb with reflecting cup |
| 04/15/2009 | CN201220197Y Glue solution injector driven by electromagnetic attraction |
| 04/15/2009 | CN101411250A Method for applying solder particles to contact surfaces as well as solder particles suitable for this and components with contact surfaces |
| 04/15/2009 | CN101411248A Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method |
| 04/15/2009 | CN101410989A Function element mounting module and method for manufacturing same |
| 04/15/2009 | CN101410978A Adjustable on-chip sub-capacitor design |
| 04/15/2009 | CN101410975A III-nitride power semiconductor device |
| 04/15/2009 | CN101410974A Electrically enhanced wirebond package |
| 04/15/2009 | CN101410973A Wafer-level chip scale package and method for fabricating and using the same |
| 04/15/2009 | CN101410972A Low ohmic through substrate interconnection for semiconductor carriers |
| 04/15/2009 | CN101410971A Electronic component and method for manufacturing the same |
| 04/15/2009 | CN101410970A Semiconductor assembly for improved device warpage and solder ball coplanarity |
| 04/15/2009 | CN101410965A Method and structure for eliminating aluminum terminal pad material in semiconductor devices |
| 04/15/2009 | CN101410964A Aluminum leadframes for semiconductor QFN/SON devices |
| 04/15/2009 | CN101410952A Method for seed film formation, plasma film forming apparatus, and memory medium |
| 04/15/2009 | CN101410942A Symmetrical MIM capacitor design |
| 04/15/2009 | CN101410433A Radiation or heat solidifiable anti-seepage sealant |
| 04/15/2009 | CN101409996A Method for preparing radiating module |
| 04/15/2009 | CN101409994A Procedure for spray painting and material-displacing superconductive soaking plate, and executive device thereof |
| 04/15/2009 | CN101409444A Method for improving ESD protection device uniform conduction |
| 04/15/2009 | CN101409319A Method for manufacturing LED using bonding technology |
| 04/15/2009 | CN101409317A Foot rest structure for LED |
| 04/15/2009 | CN101409316A Welding-free LED device |
| 04/15/2009 | CN101409315A Upside-down mounting LED chip |
| 04/15/2009 | CN101409308A Thin-film transistor, pixel structure and manufacturing method thereof |
| 04/15/2009 | CN101409304A Organic electro-luminescent display device |
| 04/15/2009 | CN101409291A Nonvolatile semiconductor storage device, and method for controlling nonvolatile semiconductor storage device |
| 04/15/2009 | CN101409289A Nonvolatile memory structure and array thereof |
| 04/15/2009 | CN101409288A Semiconductor device with contact stabilization and method for manufacturing the same |
| 04/15/2009 | CN101409286A Semiconductor capacitance structure |
| 04/15/2009 | CN101409284A Voltage-controlled capacitive element and semiconductor integrated circuit |
| 04/15/2009 | CN101409282A Thin film transistor substrate, display device having the same and method of manufacturing the same |
| 04/15/2009 | CN101409281A Method and apparatus for laying out pattern of high power switch mode voltage regulators |
| 04/15/2009 | CN101409280A Well potential triggered ESD protection |
| 04/15/2009 | CN101409279A Semiconductor device including electronic component coupled to a backside of a chip |
| 04/15/2009 | CN101409278A Glass substrate for planar display and IC chip for display |
| 04/15/2009 | CN101409277A Assembly comprising an electromagnetically screened SMD component, method and use |
| 04/15/2009 | CN101409276A System with a connection device and at least one semi-conductor construction element |
| 04/15/2009 | CN101409275A Double-interface smart card module and loading belt |
| 04/15/2009 | CN101409274A COF board |
| 04/15/2009 | CN101409273A Ball-placing side surface structure for package substrate and manufacturing method thereof |
| 04/15/2009 | CN101409272A Ring-shaped surface adherence type conductor holder |
| 04/15/2009 | CN101409271A 半导体器件 Semiconductor devices |
| 04/15/2009 | CN101409270A Metallic conduction structure applying for module integrated circuit and preparation method thereof |
| 04/15/2009 | CN101409269A Conductive structure for semiconductor integrated circuit and method of forming the same |
| 04/15/2009 | CN101409268A Bond pad design for fine pitch wire bonding |
| 04/15/2009 | CN101409267A Semiconductor device and method of manufacturing the same |
| 04/15/2009 | CN101409266A Package structure |
| 04/15/2009 | CN101409265A Substrate for semiconductor package structure, semiconductor package structure and manufacturing method thereof |
| 04/15/2009 | CN101409264A Package for semiconductor device |
| 04/15/2009 | CN101409262A Pixel structure and manufacturing method thereof |
| 04/15/2009 | CN101409258A Optical sensor and manufacturing method thereof |
| 04/15/2009 | CN101409257A Optical sensor and manufacturing method thereof |
| 04/15/2009 | CN101409241A Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 04/15/2009 | CN101409239A Method for manufacturing wiring plate |
| 04/15/2009 | CN101409238A Method for preparing seedless layer package substrate |
| 04/15/2009 | CN101409229A Epitaxial substrate and manufacturing method thereof, and method for manufacturing LED device |
| 04/15/2009 | CN101408787A Novel radiating fin fastening structure for portable computer |
| 04/15/2009 | CN101408786A Novel radiating fin fastening structure for portable computer |
| 04/15/2009 | CN101408688A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 04/15/2009 | CN101408304A LED light fitting |
| 04/15/2009 | CN101408302A Light source module group with good heat radiating performance |
| 04/15/2009 | CN101408301A LED light fitting with heat radiating device |
| 04/15/2009 | CN101408300A LED light fitting with heat radiation structure |
| 04/15/2009 | CN101408299A LED light fitting with heat radiating device |
| 04/15/2009 | CN101408298A Upright post type LED heat radiator |
| 04/15/2009 | CN100479197C 光接收器封装件 Optical receiver package |
| 04/15/2009 | CN100479184C Wiring method for detection wire of organic electroluminescent display device |
| 04/15/2009 | CN100479183C Pixel structure and organic EL component |
| 04/15/2009 | CN100479174C Telescopic-lattice chip for silicon-based tellurium-cadmium mercury device |
| 04/15/2009 | CN100479172C Electro-optic display and manufacturing method thereof |
| 04/15/2009 | CN100479167C Sram cells |
| 04/15/2009 | CN100479163C Semiconductor apparatus |
| 04/15/2009 | CN100479162C Semiconductor component and its making method |
| 04/15/2009 | CN100479154C Light emitting diode packaging structure and method capable of increasing luminous efficiency |
| 04/15/2009 | CN100479152C Semiconductor device, electronic appts. their mfg. methods and electronic instrument |
| 04/15/2009 | CN100479150C Super long alignment infrared focus plane detector |
| 04/15/2009 | CN100479149C Esd protection circuit with collector current control triggering of single crystal integrated circuit |
| 04/15/2009 | CN100479148C Test key for checking up intraconnection and method for checking intraconnection |
| 04/15/2009 | CN100479147C Antifuse structure having an integrated heating element |
| 04/15/2009 | CN100479146C Interconnection structure and forming method thereof |
| 04/15/2009 | CN100479145C Method for manufacturing inner connecting line possessing antireflection coating and structure thereof |
| 04/15/2009 | CN100479144C Method for fabricating semiconductor package |
| 04/15/2009 | CN100479143C Semiconductor device |
| 04/15/2009 | CN100479142C Process for producing composite indium column for infrared focal plane device |
| 04/15/2009 | CN100479141C Semiconductor device and wire bonding chip size package therefor |
| 04/15/2009 | CN100479140C Microelectronic device chip including hybrid au bump, package of the same, and application and production |
| 04/15/2009 | CN100479139C Driver chip and display apparatus |
| 04/15/2009 | CN100479138C Embedded metal cooling seat of semiconductor component and method of producing the same |
| 04/15/2009 | CN100479137C Method and arrangement in inverter |
| 04/15/2009 | CN100479136C Chip encapsulation structure and its making method |
| 04/15/2009 | CN100479135C Semiconductor device and a method for manufacturing of the same |
| 04/15/2009 | CN100479134C Method for forming an encapsulated device and structure |
| 04/15/2009 | CN100479133C 半导体器件 Semiconductor devices |