| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/28/2009 | US7525139 Image sensor with a protection layer |
| 04/28/2009 | US7525132 Semiconductor integrated circuit wiring design method and semiconductor integrated circuit |
| 04/28/2009 | US7525118 Test element group, method of manufacturing a test element group, method of testing a semiconductor device, and semiconductor device |
| 04/28/2009 | US7524763 Fabrication method of wafer level chip scale packages |
| 04/28/2009 | US7524759 Post passivation interconnection schemes on top of IC chip |
| 04/28/2009 | US7524754 Interconnect shunt used for current distribution and reliability redundancy |
| 04/28/2009 | US7524709 Manufacturing method for a display device |
| 04/28/2009 | US7524703 Integrated circuit stacking system and method |
| 04/28/2009 | US7524702 Conductor substrate, semiconductor device and production method thereof |
| 04/28/2009 | US7524699 Electronic component and a panel |
| 04/28/2009 | US7524684 Semiconductor device with electrode pad having probe mark |
| 04/28/2009 | US7524537 Spray coating apparatus and fixtures |
| 04/28/2009 | US7524533 Diffusion barrier layers and processes for depositing metal films thereupon by CVD or ALD processes |
| 04/28/2009 | US7524391 Optical device and method for manufacturing the same, and electronic apparatus |
| 04/28/2009 | US7524194 Lithographic type microelectronic spring structures with improved contours |
| 04/28/2009 | US7523780 High density electronic cooling triangular shaped microchannel device |
| 04/23/2009 | WO2009052150A1 Chip scale stacked die package |
| 04/23/2009 | WO2009052117A1 Method and system for forming an air gap structure |
| 04/23/2009 | WO2009051975A2 Wafer level stacked die packaging |
| 04/23/2009 | WO2009051708A1 Interposer for an integrated dc-dc converter |
| 04/23/2009 | WO2009051679A2 Process for placing, securing and interconnecting electronic components |
| 04/23/2009 | WO2009051440A2 Bump structure with multiple layers and method of manufacture |
| 04/23/2009 | WO2009051239A1 Wiring board, mounting structure and method for manufacturing wiring board |
| 04/23/2009 | WO2009051178A1 Led package substrate and led package using the same |
| 04/23/2009 | WO2009051120A1 Substrate with semiconductor element mounted thereon |
| 04/23/2009 | WO2009051094A1 Metal-graphite composite material having high thermal conductivity and method for producing the same |
| 04/23/2009 | WO2009051071A1 Flexible board |
| 04/23/2009 | WO2009051001A1 One-way fluid moving device |
| 04/23/2009 | WO2009050974A1 Process for manufacturing ceramic multilayer substrate with cavity |
| 04/23/2009 | WO2009050207A1 Method for producing electrical interconnects and devices made thereof |
| 04/23/2009 | WO2009050130A2 Chip cooling device having wedge element |
| 04/23/2009 | WO2009049957A1 Composite element consisting of at least two semiconductor substrates, and production method |
| 04/23/2009 | WO2009049453A1 A power led encapsulation structure |
| 04/23/2009 | WO2009049400A1 A system and method for a single chip direct conversion transceiver in silicon |
| 04/23/2009 | WO2009035907A3 Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
| 04/23/2009 | WO2009035906A3 Composite, thermal interface material containing the composite, and methods for their preparation and use |
| 04/23/2009 | WO2009026998A3 Connection of a chip comprising pads and bumps to a substrate comprising metallic strip conductors |
| 04/23/2009 | WO2008142081A9 Component with mechanically loadable connection surfaces |
| 04/23/2009 | WO2007122521A3 Heat dissipation system for a miniaturized form factor communications card |
| 04/23/2009 | WO2007062122A3 Semiconductor devices including voltage switchable materials for over-voltage protection |
| 04/23/2009 | WO2007056063A3 Semiconductor device package with integrated heat spreader |
| 04/23/2009 | WO2007038098A3 Leadframes for improved moisture reliability of semiconductor devices |
| 04/23/2009 | WO2007033337A3 Transistor formed with self-aligned contacts |
| 04/23/2009 | WO2007025134A3 Thermally conductive thermoplastics for die-level packaging of microelectronics |
| 04/23/2009 | WO2007014116A3 Electronic device including discontinuous storage elements |
| 04/23/2009 | WO2006078530A3 Packaging designs for leds |
| 04/23/2009 | WO2006029169A3 Grooved substrates for uniform underfilling solder ball assembled electronic devices |
| 04/23/2009 | US20090102329 Rectifier for automotive alternator |
| 04/23/2009 | US20090102071 Semiconductor substrate and method for manufacturing semiconductor device |
| 04/23/2009 | US20090102070 Alignment Marks on the Edge of Wafers and Methods for Same |
| 04/23/2009 | US20090102069 Integrated circuit system with assist feature |
| 04/23/2009 | US20090102068 System and method to manufacture an implantable electrode |
| 04/23/2009 | US20090102067 Electrically enhanced wirebond package |
| 04/23/2009 | US20090102066 Chip package structure and method of manufacturing the same |
| 04/23/2009 | US20090102065 Bonding pad for anti-peeling property and method for fabricating the same |
| 04/23/2009 | US20090102064 Connection structure and method of producing the same |
| 04/23/2009 | US20090102063 Semiconductor package and method for fabricating the same |
| 04/23/2009 | US20090102062 Wiring substrate and method of manufacturing the same, and semiconductor device |
| 04/23/2009 | US20090102060 Wafer Level Stacked Die Packaging |
| 04/23/2009 | US20090102059 Semiconductor device |
| 04/23/2009 | US20090102058 Method for forming a plug structure and related plug structure thereof |
| 04/23/2009 | US20090102057 Semiconductor device |
| 04/23/2009 | US20090102056 Patterned Leads For WLCSP And Method For Fabricating The Same |
| 04/23/2009 | US20090102055 Semiconductor device |
| 04/23/2009 | US20090102054 Semiconductor package |
| 04/23/2009 | US20090102053 Metal line stacking structure in semiconductor device and formation method thereof |
| 04/23/2009 | US20090102052 Semiconductor Device and Fabricating Method Thereof |
| 04/23/2009 | US20090102051 Method to create super secondary grain growth in narrow trenches |
| 04/23/2009 | US20090102050 Solder ball disposing surface structure of package substrate |
| 04/23/2009 | US20090102049 Semiconductor device, layered type semiconductor device using the same, base substrate and semiconductor device manufacturing method |
| 04/23/2009 | US20090102048 Electronic device and manufacturing method thereof |
| 04/23/2009 | US20090102047 Flip chip package structure and carrier thereof |
| 04/23/2009 | US20090102046 On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity |
| 04/23/2009 | US20090102045 Packaging substrate having capacitor embedded therein |
| 04/23/2009 | US20090102044 Device including a housing for a semiconductor chip |
| 04/23/2009 | US20090102043 Semiconductor package and manufacturing method thereof |
| 04/23/2009 | US20090102042 Semiconductor device and method of fabricating semiconductor device |
| 04/23/2009 | US20090102041 Electrical connection device and assembly method thereof |
| 04/23/2009 | US20090102040 Power semiconductor module |
| 04/23/2009 | US20090102039 Package on package structure |
| 04/23/2009 | US20090102038 Chip scale stacked die package |
| 04/23/2009 | US20090102037 Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof |
| 04/23/2009 | US20090102036 Stacked semiconductor package having interposing print circuit board |
| 04/23/2009 | US20090102035 Semiconductor Packaging Device |
| 04/23/2009 | US20090102034 Packaged Microchip with Spacer for Mitigating Electrical Leakage Between Components |
| 04/23/2009 | US20090102033 Integrated circuit package |
| 04/23/2009 | US20090102032 Electronic Device |
| 04/23/2009 | US20090102031 Method for connecting a die attach pad to a lead frame and product thereof |
| 04/23/2009 | US20090102030 Integrated circuit package with etched leadframe for package-on-package interconnects |
| 04/23/2009 | US20090102029 Semiconductor Device |
| 04/23/2009 | US20090102028 Method for manufacturing a semiconductor component and structure therefor |
| 04/23/2009 | US20090102027 Method for manufacturing semiconductor device, semiconductor device, and electronic appliance |
| 04/23/2009 | US20090102026 Semiconductor-on-insulator substrate with a diffusion barrier |
| 04/23/2009 | US20090102021 Through-Silicon Vias and Methods for Forming the Same |
| 04/23/2009 | US20090102014 Anti-Fuse Cell and Its Manufacturing Process |
| 04/23/2009 | US20090101972 Process for fabricating a field-effect transistor with doping segregation used in source and/or drain |
| 04/23/2009 | US20090101945 Semiconductor device |
| 04/23/2009 | US20090101943 Reversely Tapered Contact Structure Compatible With Dual Stress Liner Process |
| 04/23/2009 | US20090101898 Method and resulting structure for fabricating test key structures in dram structures |
| 04/23/2009 | US20090101897 Package for a light emitting element |