H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/25/2009	CN100472765C Heat sink made from diamond-copper composite material containing boron
03/25/2009	CN100472764C Module with built-in component and method for manufacturing module
03/25/2009	CN100472763C Semiconductor packing structure comprising passive element
03/25/2009	CN100472762C Package circuit board and forming method thereof
03/25/2009	CN100472754C Electronic component and manufacturing method thereof
03/25/2009	CN100472750C Spread block lamination integrated with dielectric substance in interconnection structure and forming method thereof
03/25/2009	CN100472740C Semiconductor device and method of manufacturing the same
03/25/2009	CN100472739C Copper interconnect wiring and method of forming thereof
03/25/2009	CN100472648C Tamper-resistant packaging and approach
03/25/2009	CN100472306C Substrate for display device, manufacturing method for same and display device
03/25/2009	CN100471984C Method of depositing a material layer
03/24/2009	US7509615 Circuit layout structure and method
03/24/2009	US7508680 Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate
03/24/2009	US7508676 Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
03/24/2009	US7508674 Fixture for attaching a heat sink to a heat generating device
03/24/2009	US7508669 Cooling device for an electronic component, especially for a microprocessor
03/24/2009	US7508667 Heat sink backplate module, circuit board, and electronic apparatus having the same
03/24/2009	US7508662 Handle arrangement with integrated heat pipe
03/24/2009	US7508295 Protection circuit
03/24/2009	US7508238 Semiconductor integrated circuit device
03/24/2009	US7508132 Device having a getter structure and a photomask
03/24/2009	US7508084 CMOS image sensor
03/24/2009	US7508083 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
03/24/2009	US7508082 Semiconductor device and method of manufacturing the same
03/24/2009	US7508080 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
03/24/2009	US7508077 Semiconductor device and method of manufacturing same
03/24/2009	US7508076 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers
03/24/2009	US7508075 Self-aligned poly-metal structures
03/24/2009	US7508074 Etch stop layer in poly-metal structures
03/24/2009	US7508073 Wiring board, semiconductor device using the same, and method for manufacturing wiring board
03/24/2009	US7508072 Semiconductor device with pad electrode for testing and manufacturing method of the same
03/24/2009	US7508071 Adjusting die placement on a semiconductor wafer to increase yield
03/24/2009	US7508070 Two dimensional stacking using interposers
03/24/2009	US7508069 Managed memory component
03/24/2009	US7508068 Semiconductor module and power conversion device
03/24/2009	US7508067 Semiconductor insulation structure
03/24/2009	US7508066 Heat dissipating semiconductor package and fabrication method thereof
03/24/2009	US7508065 Device package and methods for the fabrication and testing thereof
03/24/2009	US7508064 Package for sealing an integrated circuit die
03/24/2009	US7508063 Low cost hermetically sealed package
03/24/2009	US7508062 Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
03/24/2009	US7508061 Three-dimensional semiconductor module having multi-sided ground block
03/24/2009	US7508060 Multi-chip semiconductor connector assemblies
03/24/2009	US7508059 Stacked chip package with redistribution lines
03/24/2009	US7508058 Stacked integrated circuit module
03/24/2009	US7508057 Electronic component device
03/24/2009	US7508056 Surface mount hermetic package for power semiconductor die
03/24/2009	US7508055 High heat release semiconductor and method for manufacturing the same
03/24/2009	US7508054 Semiconductor device and a method of manufacturing the same
03/24/2009	US7508053 Semiconductor MOS transistor device and method for making the same
03/24/2009	US7508052 Crack protection for silicon die
03/24/2009	US7508051 Wafer with optical control modules in dicing paths
03/24/2009	US7508038 ESD protection transistor
03/24/2009	US7507913 Multilayer printed wiring board
03/24/2009	US7507682 Includes a ceramic component, an acrylic resin, and a cellulose resin, and loss factor tan delta of the paste; prevents a layer bonding failure and warping deformation
03/24/2009	US7507663 Fabrication of semiconductor devices
03/24/2009	US7507658 Semiconductor apparatus and method of fabricating the apparatus
03/24/2009	US7507656 Method and structure for low k interlayer dielectric layer
03/24/2009	US7507655 Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device
03/24/2009	US7507607 Method of forming a silicide bridged anti-fuse with a tungsten plug metalization process
03/24/2009	US7507606 Semiconductor device and method of manufacturing the same
03/24/2009	US7507604 Breakable interconnects and structures formed thereby
03/24/2009	US7507602 Semiconductor device and method of manufacturing the same
03/24/2009	US7507594 Contact portion and manufacturing method thereof, thin film transistor array panel and manufacturing method thereof
03/24/2009	US7507302 Method for producing nanocomposite magnet using atomizing method
03/24/2009	US7506795 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
03/24/2009	US7506794 High-temperature alloy standoffs for injection molding of solder
03/24/2009	US7506438 Low profile integrated module interconnects and method of fabrication
03/19/2009	WO2009035972A2 Packaged integrated circuits and methods to form a stacked integrated circuit package
03/19/2009	WO2009035962A2 Electromagnetic shield formation for integrated circuit die package
03/19/2009	WO2009035907A2 Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
03/19/2009	WO2009035906A2 Composite, thermal interface material containing the composite, and methods for their preparation and use
03/19/2009	WO2009035882A1 Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
03/19/2009	WO2009035849A2 Semiconductor die mount by conformal die coating
03/19/2009	WO2009035815A1 Polymer-ceramic composites with excellent tcc
03/19/2009	WO2009035681A1 Wrap-around overmold for electronic assembly
03/19/2009	WO2009035393A1 Connecting and bonding adjacent layers with nanostructures
03/19/2009	WO2009035113A1 Lead frame and lead frame manufacturing method
03/19/2009	WO2009034956A1 Cooling apparatus
03/19/2009	WO2009034865A1 Exhaust system structure of film forming apparatus, film forming apparatus and method of disposing of exhaust gas
03/19/2009	WO2009034846A1 Apparatus with heating part
03/19/2009	WO2009034793A1 Flexible wiring board and bare chip mounting method
03/19/2009	WO2009034641A1 Water jacket
03/19/2009	WO2009034628A1 Solder precoated substrate, mounting substrate, and solder precoating method
03/19/2009	WO2009034596A1 Process for producing silicic coating, silicic coating and semiconductor device
03/19/2009	WO2009034496A2 Wafer, method of manufacturing integrated circuits on a wafer, and method of storing data about said circuits
03/19/2009	WO2009034461A2 Semiconductor device and wire bonding method
03/19/2009	WO2009034454A2 Semiconductor device
03/19/2009	WO2009033959A1 Device for disassembling electronic power components and method for implementing said device
03/19/2009	WO2009033837A2 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
03/19/2009	WO2009007932A3 Integrated circuits on a wafer and method of producing integrated circuits
03/19/2009	WO2008130493A3 Connecting microsized devices using ablative films
03/19/2009	WO2008112883A3 Die attachment method with a covex surface underfill
03/19/2009	US20090077517 Semiconductor intergrated device and apparatus for designing the same
03/19/2009	US20090077516 Semiconductor integrated device and apparatus for designing the same
03/19/2009	US20090075515 Heat transfer member and connector
03/19/2009	US20090075479 Method of manufacturing semiconductor device
03/19/2009	US20090075430 Thermal intermediate apparatus, systems, and methods
03/19/2009	US20090075427 Method of manufacturing a semiconductor device
03/19/2009	US20090073668 Carrier Assembly For An Integrated Circuit

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