| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/07/2009 | DE10149093B4 Halbleiterbauelement mit Harzgehäuse A semiconductor device with resin case |
| 05/07/2009 | DE10142975B4 Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben The same heat sink member for elktronische components and methods for applying |
| 05/06/2009 | EP2056349A1 Component built-in module and method for producing the same |
| 05/06/2009 | EP2056347A2 Electrical isolation of monolithic circuits using a conductive through-hole in the substrate |
| 05/06/2009 | EP2056346A2 Semi-conductor chip with a protective layer and method of operating a semi-conductor chip |
| 05/06/2009 | EP2056345A1 Heat sink module for electronic components or circuits and method for its manufacture |
| 05/06/2009 | EP2056344A1 Electronic component storing package and electronic device |
| 05/06/2009 | EP2056342A2 Wiring board and method for manufacturing the same |
| 05/06/2009 | EP2055152A1 Method and apparatus for reducing thermal stress in light-emitting elements |
| 05/06/2009 | EP2054935A2 Testing for correct undercutting of an electrode during an etching step |
| 05/06/2009 | EP2054934A2 Deformable integrated circuit device |
| 05/06/2009 | EP2054932A2 Semiconductor component and assembly with projecting electrode |
| 05/06/2009 | EP2054931A2 Reducing stress between a substrate and a projecting electrode on the substrate |
| 05/06/2009 | EP2054930A1 Heat sink for semiconductor components or similar devices, and method for producing it |
| 05/06/2009 | EP2054927A1 Thin-film solar module |
| 05/06/2009 | EP2054150A2 Coated molecular sieve |
| 05/06/2009 | EP1776715A4 Method for forming a gate electrode having a metal |
| 05/06/2009 | EP1378154A4 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods |
| 05/06/2009 | EP1378153A4 Electronic module including a cooling substrate and related methods |
| 05/06/2009 | EP1360882A4 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 05/06/2009 | EP1247294A4 Packaging of integrated circuits and vertical integration |
| 05/06/2009 | CN201234435Y Two phase changing cooling head construction |
| 05/06/2009 | CN201234434Y Heat suction device |
| 05/06/2009 | CN201234433Y Novel heat radiating device |
| 05/06/2009 | CN201234430Y Heat radiating device for bidirectional gas flow exhaust channel and heat radiator thereof |
| 05/06/2009 | CN201233892Y Encapsulation construction for large power multiple LED chips |
| 05/06/2009 | CN201233891Y Convex type novel semiconductor encapsulation construction for functional pin and chip bearing substrate |
| 05/06/2009 | CN201233890Y Bonding welding spot construction for bonding wire when packaging great current schottky products |
| 05/06/2009 | CN201233889Y Flat sealing type semi-conductor encapsulation construction for plastic packaging body |
| 05/06/2009 | CN201233888Y Convex type semiconductor encapsulation construction for functional pin and chip bearing substrate |
| 05/06/2009 | CN201232990Y LED cartridge lamp |
| 05/06/2009 | CN201232989Y LED bulb |
| 05/06/2009 | CN201232988Y Heat radiation structure of LED lighting device |
| 05/06/2009 | CN201232987Y High power LED lamp with radiating module structure |
| 05/06/2009 | CN201232986Y Novel heat radiator capable of enlarging irradiation angle of LED street lamp |
| 05/06/2009 | CN201232985Y LED street lamp exterior protrusion type novel heat radiation system |
| 05/06/2009 | CN201232984Y Radiating module for LED lamp |
| 05/06/2009 | CN201232983Y Heat radiator and LED lamp |
| 05/06/2009 | CN201232982Y LED lamp |
| 05/06/2009 | CN201232981Y LED oscillation type radiating module |
| 05/06/2009 | CN201232980Y Light distribution structure for high-brightness LED street lamp holder |
| 05/06/2009 | CN201232979Y LED reflectoscope |
| 05/06/2009 | CN201232978Y High power LED infrared emission tube |
| 05/06/2009 | CN201232867Y Indoor lamp tube type LED lighting lamp |
| 05/06/2009 | CN101427382A Method for manufacturing light receiving apparatus |
| 05/06/2009 | CN101427370A Improved CMOS diodes with dual gate conductors, and methods for forming the same |
| 05/06/2009 | CN101427369A Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
| 05/06/2009 | CN101427368A Electro-osmotic pumps and micro-channels |
| 05/06/2009 | CN101427367A Aluminum/silicon carbide composite and radiating part comprising the same |
| 05/06/2009 | CN101427366A A microwave chip supporting structure |
| 05/06/2009 | CN101427365A Semiconductor sensor device and method for manufacturing same |
| 05/06/2009 | CN101427360A Wafer scale die handling |
| 05/06/2009 | CN101426835A Curable resin composition |
| 05/06/2009 | CN101426359A 换热器 Heat Exchanger |
| 05/06/2009 | CN101426358A Vortex guiding heat radiating device |
| 05/06/2009 | CN101426356A Construction for heat radiating device |
| 05/06/2009 | CN101426355A Cover wind heat radiation device |
| 05/06/2009 | CN101425744A Curved surface fin insertion type heat radiator for frequency transformer |
| 05/06/2009 | CN101425554A Package construction having vertical LED and manufacturing method thereof |
| 05/06/2009 | CN101425532A Organic electro-luminescent display device |
| 05/06/2009 | CN101425531A Organic electro-luminescence display device |
| 05/06/2009 | CN101425530A Active matrix display device |
| 05/06/2009 | CN101425527A Solid-state imaging device, production method and drive method thereof, and camera |
| 05/06/2009 | CN101425525A Semiconductor device and method of manufacturing the same |
| 05/06/2009 | CN101425523A CMOS semiconductor sensor package component and manufacturing method thereof |
| 05/06/2009 | CN101425520A Array substrate and display panel having the same |
| 05/06/2009 | CN101425519A Transient voltage suppressor manufactured in silicon on oxide (soi) layer |
| 05/06/2009 | CN101425517A Semiconductor device |
| 05/06/2009 | CN101425516A Split-gate memory cells and fabrication methods thereof |
| 05/06/2009 | CN101425515A Semiconductor device with vertical channel transistor and method for fabricating the same |
| 05/06/2009 | CN101425513A Light emitting module having heat radiation function, reflection cover and assembling method thereof |
| 05/06/2009 | CN101425512A Stacked semiconductor package and method for manufacturing the same |
| 05/06/2009 | CN101425511A Mounted structure |
| 05/06/2009 | CN101425510A Sensor module package structure and method of the same |
| 05/06/2009 | CN101425509A High heat radiation power type electrode rack for LED |
| 05/06/2009 | CN101425508A 芯片堆叠封装 Chip Stacking |
| 05/06/2009 | CN101425507A LED row having heat radiating fins and production method |
| 05/06/2009 | CN101425506A LED and its making method |
| 05/06/2009 | CN101425505A Circuit layout construction for measuring whether concave falls are generated by copper wire |
| 05/06/2009 | CN101425504A Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device |
| 05/06/2009 | CN101425503A Semiconductor device and method for manufacturing the same |
| 05/06/2009 | CN101425502A Fuse breakdown method adapted to semiconductor device |
| 05/06/2009 | CN101425501A 半导体器件 Semiconductor devices |
| 05/06/2009 | CN101425500A Solving via-misalignment issues in interconnect structures having air-gaps |
| 05/06/2009 | CN101425499A Printed circuit board having adhesive layer and semiconductor package using the same |
| 05/06/2009 | CN101425498A Chip bearing belt and chip packaging construction |
| 05/06/2009 | CN101425497A On-chip lead wire encapsulation construction and lead wire frame thereof |
| 05/06/2009 | CN101425496A Silicon substrate having flip chip projection |
| 05/06/2009 | CN101425495A Optoelectronic component encapsulation construction having silica substrate |
| 05/06/2009 | CN101425494A Solder-top enhanced semiconductor device and method for low parasitic impedance packaging |
| 05/06/2009 | CN101425493A Back end integrated wlcsp structure without aluminum pads |
| 05/06/2009 | CN101425492A Wafer stage encapsulation construction having laminated layer |
| 05/06/2009 | CN101425491A Elastic projection of sloped lateral wall and production method thereof |
| 05/06/2009 | CN101425490A Chip and manufacturing method thereof |
| 05/06/2009 | CN101425489A Solder convex point connected metal layer in microelectronic package and use thereof |
| 05/06/2009 | CN101425488A Novel liquid cooling heat radiator for semiconductor device |
| 05/06/2009 | CN101425487A Manufacturing method for heat conducting device capable for LED installation |
| 05/06/2009 | CN101425486A Flip chip packages with spacers separating heat sinks and substrates |
| 05/06/2009 | CN101425485A Semiconductor clamp system |
| 05/06/2009 | CN101425484A Nitride semiconductor free-standing substrateand device using the same |