| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/07/2009 | WO2009057654A1 Part built-in wiring board, and manufacturing method for the part built-in wiring board |
| 05/07/2009 | WO2009057444A1 Circuit board and display device |
| 05/07/2009 | WO2009057018A2 Rf-ic packaging method and circuits obtained thereby |
| 05/07/2009 | WO2009056387A2 Hf chip module, hf assembly and method for producing an hf assembly |
| 05/07/2009 | WO2009056338A2 Heat sink module for electronic components or circuits, and method for the production thereof |
| 05/07/2009 | WO2009055920A1 High aperture ratio pixel layout for display device |
| 05/07/2009 | WO2009038984A3 Microelectronic package and method of forming same |
| 05/07/2009 | WO2009032465A3 Redistribution structures for microfeature workpieces |
| 05/07/2009 | WO2009027348A3 Circuit arrangement for protection from electrostatic discharges and method for operating the same |
| 05/07/2009 | WO2009026171A3 Stacked die vertical interconnect formed by transfer of interconnect material |
| 05/07/2009 | WO2008147825A4 Thermal interconnect and interface materials, methods of production and uses thereof |
| 05/07/2009 | WO2008122891A3 Binding of costituents having a high mobility in an electronic connection |
| 05/07/2009 | WO2008071850A3 Novel nanoparticle containing siloxane polymers |
| 05/07/2009 | WO2008054364A3 Carbon nanotubes for the selective transfer of heat from electronics |
| 05/07/2009 | WO2007104004A4 Method and apparatus for dissipating heat from an integrated circuit |
| 05/07/2009 | WO2007058854A3 Semiconductor package including a semiconductor die having redistributed pads |
| 05/07/2009 | US20090117758 Electrical junction box |
| 05/07/2009 | US20090117733 Protection of seedlayer for electroplating |
| 05/07/2009 | US20090117729 Electrostatic Discharge (ESD) Protection Structure |
| 05/07/2009 | US20090117690 Integrated transistor module and method of fabricating same |
| 05/07/2009 | US20090117687 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/07/2009 | US20090116197 Method for power semiconductor module fabrication, its apparatus, power semiconductor module and its junction method |
| 05/07/2009 | US20090116195 Heat sink for dissipating heat and apparatus having the same |
| 05/07/2009 | US20090115330 Self-emitting element, display panel, display apparatus, and method of manufacturing self-emitting element |
| 05/07/2009 | US20090115075 Method for manufacturing thin substrate using a laminate body |
| 05/07/2009 | US20090115074 Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element |
| 05/07/2009 | US20090115073 Wiring substrate and semiconductor device and method of manufacturing the same |
| 05/07/2009 | US20090115072 BGA Package with Traces for Plating Pads Under the Chip |
| 05/07/2009 | US20090115071 Flip chip mounting method and method for connecting substrates |
| 05/07/2009 | US20090115070 Semiconductor device and method for manufacturing thereof |
| 05/07/2009 | US20090115069 Semiconductor chip package and method of manufacturing the same |
| 05/07/2009 | US20090115068 Semiconductor Device and Method of Manufacturing the Same |
| 05/07/2009 | US20090115067 Module having built-in electronic component and method for manufacturing such module |
| 05/07/2009 | US20090115066 Metal wiring layer and method of fabricating the same |
| 05/07/2009 | US20090115065 Semiconductor device and manufacturing method thereof |
| 05/07/2009 | US20090115064 Spacer process for on pitch contacts and related structures |
| 05/07/2009 | US20090115063 Semiconductor integrated circuit device and a method of manufacturing the same |
| 05/07/2009 | US20090115062 Semiconductor device |
| 05/07/2009 | US20090115061 Solving Via-Misalignment Issues in Interconnect Structures Having Air-Gaps |
| 05/07/2009 | US20090115060 Integrated circuit device and method |
| 05/07/2009 | US20090115059 Gold wire for semiconductor element connection |
| 05/07/2009 | US20090115058 Back End Integrated WLCSP Structure without Aluminum Pads |
| 05/07/2009 | US20090115057 C4 joint reliability |
| 05/07/2009 | US20090115056 Device mounting board, semiconductor module, and mobile device |
| 05/07/2009 | US20090115055 Mounting structure of electronic component |
| 05/07/2009 | US20090115054 Electronic component |
| 05/07/2009 | US20090115053 Semiconductor Package Thermal Performance Enhancement and Method |
| 05/07/2009 | US20090115052 Hybrid silicon/non-silicon electronic device with heat spreader |
| 05/07/2009 | US20090115051 Electronic Circuit Package |
| 05/07/2009 | US20090115050 Interposer And Semiconductor Device |
| 05/07/2009 | US20090115049 Semiconductor package |
| 05/07/2009 | US20090115048 Multipiece Apparatus for Thermal and Electromagnetic Interference (EMI) Shielding Enhancement in Die-Up Array Packages and Method of Making the Same |
| 05/07/2009 | US20090115047 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
| 05/07/2009 | US20090115046 Micro-electro-mechanical system device and method for making same |
| 05/07/2009 | US20090115045 Stacked package module and method for fabricating the same |
| 05/07/2009 | US20090115044 Structures and methods for stack type semiconductor packaging |
| 05/07/2009 | US20090115043 Mountable integrated circuit package system with mounting interconnects |
| 05/07/2009 | US20090115042 Semiconductor device having three-dimensional stacked structure and method of fabricating the same |
| 05/07/2009 | US20090115041 Semiconductor package and semiconductor device |
| 05/07/2009 | US20090115040 Integrated circuit package system with array of external interconnects |
| 05/07/2009 | US20090115039 High Bond Line Thickness For Semiconductor Devices |
| 05/07/2009 | US20090115038 Semiconductor Packages and Methods of Fabricating the Same |
| 05/07/2009 | US20090115037 Integrated circuit package with integrated heat sink |
| 05/07/2009 | US20090115036 Semiconductor chip package having metal bump and method of fabricating same |
| 05/07/2009 | US20090115035 Integrated circuit package |
| 05/07/2009 | US20090115034 Semiconductor device |
| 05/07/2009 | US20090115033 Reduction of package height in a stacked die configuration |
| 05/07/2009 | US20090115032 Integrated circuit package system with dual connectivity |
| 05/07/2009 | US20090115031 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device |
| 05/07/2009 | US20090115029 Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device |
| 05/07/2009 | US20090115025 Semiconductor device and method for manufacturing the same |
| 05/07/2009 | US20090115024 Seal ring structure with improved cracking protection and reduced problems |
| 05/07/2009 | US20090115008 Manufacturing method of an electronic device including overmolded mems devices |
| 05/07/2009 | US20090114999 Transistors of semiconductor device having channel region in a channel-portion hole and methods of forming the same |
| 05/07/2009 | US20090114984 Power device and a method for producing a power device |
| 05/07/2009 | US20090114973 Method for forming self-aligned contacts and local interconnects simultaneously |
| 05/07/2009 | US20090114914 High performance sub-system design and assembly |
| 05/07/2009 | US20090114913 Test structure and methodology for three-dimensional semiconductor structures |
| 05/07/2009 | US20090114912 Mask design elements to aid circuit editing and mask redesign |
| 05/07/2009 | US20090114441 Electronic component |
| 05/07/2009 | US20090114375 Water cooling type heat dissipation module for electronic device |
| 05/07/2009 | US20090113698 Apparatus for electrically coupling a semiconductor package to a printed circuit board |
| 05/07/2009 | DE19800928B4 Gehäuse, insbesondere stapelbares Gehäuse, zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung Housing, in particular a stackable housing for receiving components and process for its preparation |
| 05/07/2009 | DE112007000752T5 Verfahren zum Reduzieren der Kapazität zwischen Interconnect-Leiterbahnen durch Verwenden eines Abstandshalters mit niedriger Dielektrizitätskonstante A method of reducing the capacitance between interconnect conductor tracks by using a spacer having a low dielectric constant |
| 05/07/2009 | DE10353849B4 Anpresselement zum Anpressen eines zu kühlenden elektrischen Beuteils an ein Kühlelement, System zum Kühlen eines elektrischen Bauteils, und Bauteilanordnung mit einem zu kühlenden elektrischen Bauteil Pressing member for pressing a to be cooled electric Beuteils to a cooling element system for cooling an electrical component, and component assembly to be cooled with an electrical component |
| 05/07/2009 | DE10338252B4 Bitleitung einer Halbleitervorrichtung mit einer nippelförmigen Abdeckschicht und Verfahren zur Herstellung derselben Bit line of a semiconductor device having a nipple-shaped covering layer and method of manufacturing the same |
| 05/07/2009 | DE10314505B4 Verbesserte Diodenstruktur für Soi-Schaltungen Improved diode structure for Soi circuits |
| 05/07/2009 | DE102008051949A1 Integrierte Schaltung mit Belastungserfassungselement Integrated circuit with load sensing element |
| 05/07/2009 | DE102008051467A1 Halbleiter-Bauelement Semiconductor component |
| 05/07/2009 | DE102008051466A1 Bauelement, das einen Halbleiterchip mit mehreren Elektroden enthält Component that includes a semiconductor chip having a plurality of electrodes |
| 05/07/2009 | DE102008046728A1 Elektronikbauelement Electronic component |
| 05/07/2009 | DE102007052397A1 Cooling device for cooling semiconductor chip of commercial personal computer, has heat conductive material e.g. gap filler, arranged between heat absorption surface and coupling surface of heat spreading element |
| 05/07/2009 | DE102007052097A1 SOI-Bauelement mit einer Substratdiode, die durch reduzierte Implantationsenergie gebildet ist SOI device with a substrate diode which is formed by reduced implantation energy |
| 05/07/2009 | DE102007052049A1 Halbleiterbauelement und Verfahren zum Strukturieren von vertikalen Kontakten und Metallleitungen in einem gemeinsamen Ätzprozess A semiconductor device and method of patterning of vertical contacts and metal lines in a common etch process |
| 05/07/2009 | DE102007051875A1 HF-Chipmodul, HF-Baugruppe und Verfahren zur Herstellung einer HF-Baugruppe RF-chip module, the RF module and method for manufacturing a RF assembly |
| 05/07/2009 | DE102007051870A1 Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses Module housing and method of manufacturing a module housing |
| 05/07/2009 | DE102007051800A1 Trägerkörper für Halbleiterbauelemente Carrier body for semiconductor devices |
| 05/07/2009 | DE102007051796A1 Kühlvorrichtung für Halbleiterbauelemente A cooling apparatus for semiconductor devices |
| 05/07/2009 | DE102007046843A1 Erhöhte Zuverlässigkeit für eine Kontaktstruktur zur Verbindung eines aktiven Gebiets mit einer Polysiliziumleitung Increased reliability for a contact structure for connecting an active region with a polysilicon line |
| 05/07/2009 | DE102007020656B4 Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips Workpiece with semiconductor chips, semiconductor device and process for the production of a workpiece with semiconductor chips |