| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/13/2009 | CN101431074A Calibration technique for measuring gate resistance of power MOS gate device at wafer level |
| 05/13/2009 | CN101431072A Semiconductor integrated circuit |
| 05/13/2009 | CN101431071A 半导体芯片和半导体器件 Semiconductor chips and semiconductor devices |
| 05/13/2009 | CN101431070A Hybrid integrated circuit structure of three-dimensional CMOS and molecule switching element |
| 05/13/2009 | CN101431069A Power semiconductor module with temperature sensor |
| 05/13/2009 | CN101431068A 半导体封装模块 The semiconductor package module |
| 05/13/2009 | CN101431067A Packaging structure for multi-chip stack |
| 05/13/2009 | CN101431066A Semiconductor packaging stack combination construction with movable outer terminal |
| 05/13/2009 | CN101431065A Metal wiring layer and method of fabricating the same |
| 05/13/2009 | CN101431064A 半导体器件 Semiconductor devices |
| 05/13/2009 | CN101431063A Semiconductor device and method of manufacturing the same |
| 05/13/2009 | CN101431062A Carrier band substrate for smart card and semiconductor module for smart card |
| 05/13/2009 | CN101431061A Mounted structural body and method of manufacturing the same |
| 05/13/2009 | CN101431060A Chip carrier tap and its production method and chip carrier tape coil |
| 05/13/2009 | CN101431059A Routing structure and method thereof |
| 05/13/2009 | CN101431058A Semiconductor device and a method of manufacturing the same |
| 05/13/2009 | CN101431052A Dual image sensor and manufacturing method thereof |
| 05/13/2009 | CN101431050A Method of producing multiple semiconductor devices |
| 05/13/2009 | CN101431036A Fabrication method of semiconductor integrated circuit device |
| 05/13/2009 | CN101431033A Multi-chip stack packaging method |
| 05/13/2009 | CN101431031A Semiconductor package and manufacturing method thereof |
| 05/13/2009 | CN101431029A Composite metal line for packaging wire and manufacturing method thereof |
| 05/13/2009 | CN101431028A Enhancement type back grid zinc oxide nano wire field effect transistor and method for producing the same |
| 05/13/2009 | CN101430463A LCD device and method for producing the same |
| 05/13/2009 | CN101430085A Light source component of LED grille lamp |
| 05/13/2009 | CN101430084A LED light source, its production method and equipment for radiating rib |
| 05/13/2009 | CN101430083A Passive radiator and heat radiating device of road lamp |
| 05/13/2009 | CN101430081A Fence type LED lighting device |
| 05/13/2009 | CN101430068A Liquid crystal display device |
| 05/13/2009 | CN101430067A Liquid crystal display device |
| 05/13/2009 | CN101430061A LED lampshade with chimney type air draft pipe |
| 05/13/2009 | CN101429324A Encapsulating epoxy resin composition, and electronic parts device using the same |
| 05/13/2009 | CN101429323A Encapsulating epoxy resin composition, and electronic parts device using the same |
| 05/13/2009 | CN101429322A Encapsulating epoxy resin composition, and electronic parts device using the same |
| 05/13/2009 | CN101429278A Resin for optical-semiconductor-element encapsulation containing polyimide and optical semicondutor device obtained with the same |
| 05/13/2009 | CN100488346C Rack enclosure |
| 05/13/2009 | CN100487933C Light-emitting diode package structure and its package method |
| 05/13/2009 | CN100487904C Image sensor device and manufacturing method of the same |
| 05/13/2009 | CN100487893C Semiconductor chip and its manufacturing method |
| 05/13/2009 | CN100487892C Semiconductor packages including transformer or antenna |
| 05/13/2009 | CN100487891C Making method for semiconductor part and semiconductor tube core |
| 05/13/2009 | CN100487890C Systems and methods for removing operating heat from a light emitting diode |
| 05/13/2009 | CN100487889C Chip packing structure, chip structure and method for forming chip |
| 05/13/2009 | CN100487888C Semiconductor device, semiconductor crystal wafer, semiconductor assembly and manufacturing method for semiconductor device |
| 05/13/2009 | CN100487886C Method of manufacturing bit-line in a semiconductor device |
| 05/13/2009 | CN100487857C In-situ dry clean chamber for front end of line fabrication |
| 05/13/2009 | CN100487339C Compressor technology information device |
| 05/12/2009 | US7532481 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material |
| 05/12/2009 | US7532475 Semiconductor chip assembly with flexible metal cantilevers |
| 05/12/2009 | US7532472 Heat dissipation device |
| 05/12/2009 | US7532467 Thermal management devices, systems, and methods |
| 05/12/2009 | US7532446 Protection circuit for electro static discharge |
| 05/12/2009 | US7531907 System and method for forming serial numbers on HDD wafers |
| 05/12/2009 | US7531906 Flip chip packaging using recessed interposer terminals |
| 05/12/2009 | US7531905 Stacked semiconductor device |
| 05/12/2009 | US7531904 Wiring material suitable for a display device having thin film transistors and transparent electrodes and an element structure |
| 05/12/2009 | US7531903 Interconnection structure used in a pad region of a semiconductor substrate |
| 05/12/2009 | US7531902 Tungsten nitride and tungsten carbonitride layers; superior capability for preventing diffusion of copper |
| 05/12/2009 | US7531901 Metal interconnection of semiconductor device and method for forming the same |
| 05/12/2009 | US7531900 Package structure for electronic device |
| 05/12/2009 | US7531899 Ball grid array package |
| 05/12/2009 | US7531898 Non-Circular via holes for bumping pads and related structures |
| 05/12/2009 | US7531897 Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby |
| 05/12/2009 | US7531896 Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner |
| 05/12/2009 | US7531895 Integrated circuit package and method of manufacture thereof |
| 05/12/2009 | US7531894 Method of electrically connecting a microelectronic component |
| 05/12/2009 | US7531893 Power semiconductor devices having integrated inductor |
| 05/12/2009 | US7531891 Semiconductor device |
| 05/12/2009 | US7531890 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same |
| 05/12/2009 | US7531886 MOSFET fuse programmed by electromigration |
| 05/12/2009 | US7531876 Semiconductor device having power semiconductor elements |
| 05/12/2009 | US7531872 High voltage transistor and method for fabricating the same |
| 05/12/2009 | US7531863 Semiconductor device and method of fabricating the same |
| 05/12/2009 | US7531852 Electronic unit with a substrate where an electronic circuit is fabricated |
| 05/12/2009 | US7531844 Light emitting element |
| 05/12/2009 | US7531836 Body bias compensation for aged transistors |
| 05/12/2009 | US7531785 Circuit device and method of manufacturing the same |
| 05/12/2009 | US7531757 IC card and semiconductor integrated circuit device package |
| 05/12/2009 | US7531453 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 05/12/2009 | US7531447 Process for forming integrated circuit comprising copper lines |
| 05/12/2009 | US7531441 Method of manufacturing semiconductor device |
| 05/12/2009 | US7531429 Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
| 05/12/2009 | US7531417 High performance system-on-chip passive device using post passivation process |
| 05/12/2009 | US7531416 Thick film capacitors on ceramic interconnect substrates |
| 05/12/2009 | US7531385 Flip chip mounting method and method for connecting substrates |
| 05/12/2009 | US7531381 Manufacturing method of a quad flat no-lead package structure |
| 05/12/2009 | US7531375 Solid image-pickup device and method for manufacturing the solid image pickup device |
| 05/12/2009 | US7531243 Sol-gel method; applying solution containing metal alkoxide and polymer having a hydrogen bond-forming group on film and radiating with electromagnetic waves to form gas barrier layer; durability, accuracy |
| 05/12/2009 | US7531229 Microstructured component and method for its manufacture |
| 05/12/2009 | US7531115 Conductive material and method for filling via-hole |
| 05/12/2009 | US7531108 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation |
| 05/12/2009 | US7531020 For semiconductors; adhesion of copper to diamond grains is improved by the addition of boron; solid solutions; high thermoconductivity; produced with an unpressurized and pressure-assisted infiltration technique |
| 05/12/2009 | US7531011 Method of manufacturing capacitor device |
| 05/12/2009 | US7530819 Device for controlling a vehicle |
| 05/12/2009 | US7530163 Electronic parts packaging structure and method of manufacturing the same |
| 05/07/2009 | WO2009059015A2 Method of protecting circuits using integrated array fuse elements and process for fabrication |
| 05/07/2009 | WO2009058973A2 Bga package with traces for plating pads under the chip |
| 05/07/2009 | WO2009058417A1 Cooling member |
| 05/07/2009 | WO2009058143A1 Bond pad support structure for semiconductor device |
| 05/07/2009 | WO2009057691A1 Connection terminal, package using the same, and electronic device |